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    • 1. 发明授权
    • Polyamide compositions with improved salt resistance and heat stability
    • 具有改善的耐盐性和热稳定性的聚酰胺组合物
    • US08349932B2
    • 2013-01-08
    • US13015616
    • 2011-01-28
    • Shailesh Ratilal DoshiAnnakutty MathewMarvin M. Martens
    • Shailesh Ratilal DoshiAnnakutty MathewMarvin M. Martens
    • C08K3/10C08K3/22
    • C08G69/265C08K3/013C08L29/04C08L77/06C08L2666/04
    • Disclosed is a polyamide composition including at least one semi-aromatic copolyamide, said semi-aromatic copolyamide consisting essentially of about 25 to about 55 mole percent repeat units of the formula —C(O)(CH2)mC(O)NHCH2ArCH2NH—  (I) and about 45 to about 75 mole percent repeat units of the formula —C(O)(CH2)mC(O)NH(CH2)nNH—  (II) wherein m is 8, 10, and/or 12, n is 6, 10 and/or 12 and Ar is a meta-substituted benzene ring; and said polyamide has a melting point equal to or less than 225° C.; and 0.25 to 20 weight percent of one or more polyhydroxy polymer(s) having a number average molecular weight of at least 2000 and selected from the group consisting of ethylene/vinyl alcohol copolymer and poly(vinyl alcohol). Also disclosed are molded or extruded articles including the polyamide composition.
    • 公开了包含至少一种半芳族共聚酰胺的聚酰胺组合物,所述半芳族共聚酰胺基本上由约25至约55摩尔%的式-C(O)(CH 2)m C(O)NHCH 2 ArCH 2 NH-(I )和约45至约75摩尔%的式-C(O)(CH 2)m C(O)NH(CH 2)n NH-(II)的重复单元,其中m为8,10和/或12,n为6 ,10和/或12,Ar是间位取代的苯环; 并且所述聚酰胺具有等于或小于225℃的熔点; 和0.25至20重量%的数均分子量为至少2000的一种或多种多羟基聚合物,并且选自乙烯/乙烯醇共聚物和聚(乙烯醇)。 还公开了包括聚酰胺组合物的模制或挤出制品。