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1. 发明授权

US08929074B2 Electronic device assemblies and vehicles employing dual phase change materials 有权
标题翻译：使用双相变材料的电子设备组件和车辆
公开(公告)号：US08929074B2
公开(公告)日：2015-01-06
申请号：US13561229
申请日：2012-07-30
申请人： Shailesh N. Joshi , Ercan Mehmet Dede
发明人： Shailesh N. Joshi , Ercan Mehmet Dede
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H02K7/006 , H02K9/005 , H02K9/19 , H02K9/20 , H02K2209/00 , H05K7/20345 , H05K7/20936 , H01L2924/00
摘要： Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.
摘要翻译：公开了使用双相变材料的电子装置组件和结合其的车辆。在一个实施例中，电子设备组件包括具有表面的半导体器件，其中半导体器件在瞬态热通量状态和正常热通量状态下工作，热耦合到半导体器件的表面的冷却剂流体，改变材料热耦合到半导体器件的表面。相变材料具有相变材料从第一相变为第二相的相变温度。至少当半导体器件在瞬态热通量状态下工作时，相变材料吸收热通量。

2. 发明授权

US08842435B2 Two-phase heat transfer assemblies and power electronics incorporating the same 有权
标题翻译：两相传热组件和并入其中的电力电子装置
公开(公告)号：US08842435B2
公开(公告)日：2014-09-23
申请号：US13471699
申请日：2012-05-15
申请人： Shailesh N. Joshi , Ercan Mehmet Dede
发明人： Shailesh N. Joshi , Ercan Mehmet Dede
IPC分类号： H05K7/20 , F28D15/00 , H01B9/06
CPC分类号： H05K7/209 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A two-phase heat transfer assembly includes a cold plate having an impingement surface, an array of heat generating device coupled to the cold plate, and an array of spray nozzles. The impingement surface has an array of central hydrophilic regions. Each individual central hydrophilic region is surrounded by a hydrophobic perimeter. A wettability of the impingement surface gradually progresses from hydrophilic at each individual central hydrophilic region to hydrophobic at each hydrophobic perimeter. The array of heat generating devices is coupled to a heated surface of the cold plate such that the array of central hydrophilic regions is aligned with the array of heat generating devices. The array of spray nozzles is configured to direct coolant droplets toward the impingement surface. The wettability profile of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the individual central hydrophilic regions from each hydrophobic perimeter.
摘要翻译：两相传热组件包括具有冲击表面的冷板，联接到冷板的发热装置阵列和一组喷嘴。冲击表面具有中心亲水区域的阵列。每个单独的中心亲水区被疏水周边包围。冲击表面的润湿性在每个疏水性周边处逐渐从亲水性逐渐发展到疏水性。发热装置的阵列耦合到冷板的加热表面，使得中心亲水区域的阵列与发热装置阵列对准。喷嘴阵列被配置成将冷却剂液滴引向冲击表面。冷板的冲击表面的润湿性能导致冷却剂液滴从每个疏水性周边向内朝各个中心亲水区域移动。

3. 发明授权

US09062688B2 Diaphragm pump 有权
标题翻译：隔膜泵
公开(公告)号：US09062688B2
公开(公告)日：2015-06-23
申请号：US13528358
申请日：2012-06-20
申请人： Shailesh N. Joshi , Jaewook Lee , Ercan Mehmet Dede
发明人： Shailesh N. Joshi , Jaewook Lee , Ercan Mehmet Dede
IPC分类号： F04D33/00 , F04B19/00 , F04B43/04
CPC分类号： F04D33/00 , F04B19/006 , F04B43/043
摘要： An apparatus that includes a chamber. The chamber includes an inlet via which process fluid enters the chamber and an outlet via which the process fluid exits the chamber. A diaphragm is fixed in position in the chamber at a periphery of the diaphragm. The diaphragm includes a magnetic fluid therein.
摘要翻译：一种包括腔室的装置。该室包括入口，工艺流体通过该入口进入腔室，出口通过该出口流出腔室。隔膜在隔膜的周边处固定在腔室中的适当位置。隔膜在其中包括磁性流体。

4. 发明申请

US20130308277A1 TWO-PHASE HEAT TRANSFER ASSEMBLIES AND POWER ELECTRONICS MODULES INCORPORATING THE SAME 有权
标题翻译：两相热交换器和功率电子模块
公开(公告)号：US20130308277A1
公开(公告)日：2013-11-21
申请号：US13471699
申请日：2012-05-15
申请人： Shailesh N. Joshi , Ercan Mehmet Dede
发明人： Shailesh N. Joshi , Ercan Mehmet Dede
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H05K7/209 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A two-phase heat transfer assembly includes a cold plate having an impingement surface, an array of heat generating device coupled to the cold plate, and an array of spray nozzles. The impingement surface has an array of central hydrophilic regions. Each individual central hydrophilic region is surrounded by a hydrophobic perimeter. A wettability of the impingement surface gradually progresses from hydrophilic at each individual central hydrophilic region to hydrophobic at each hydrophobic perimeter. The array of heat generating devices is coupled to a heated surface of the cold plate such that the array of central hydrophilic regions is aligned with the array of heat generating devices. The array of spray nozzles is configured to direct coolant droplets toward the impingement surface. The wettability profile of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the individual central hydrophilic regions from each hydrophobic perimeter.
摘要翻译：两相传热组件包括具有冲击表面的冷板，联接到冷板的发热装置阵列和一组喷嘴。冲击表面具有中心亲水区域的阵列。每个单独的中心亲水区被疏水周边包围。冲击表面的润湿性在每个疏水性周边处逐渐从亲水性逐渐发展到疏水性。发热装置的阵列耦合到冷板的加热表面，使得中心亲水区域的阵列与发热装置阵列对准。喷嘴阵列被配置成将冷却剂液滴引向冲击表面。冷板的冲击表面的润湿性能导致冷却剂液滴从每个疏水性周边向内朝各个中心亲水区域移动。

5. 发明申请

US20140029203A1 ELECTRONIC DEVICE ASSEMBLIES AND VEHICLES EMPLOYING DUAL PHASE CHANGE MATERIALS 有权
标题翻译：使用双相变更材料的电子设备组件和车辆
公开(公告)号：US20140029203A1
公开(公告)日：2014-01-30
申请号：US13561229
申请日：2012-07-30
申请人： Shailesh N. Joshi , Ercan Mehmet Dede
发明人： Shailesh N. Joshi , Ercan Mehmet Dede
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H02K7/006 , H02K9/005 , H02K9/19 , H02K9/20 , H02K2209/00 , H05K7/20345 , H05K7/20936 , H01L2924/00
摘要： Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.
摘要翻译：公开了使用双相变材料的电子装置组件和结合其的车辆。在一个实施例中，电子设备组件包括具有表面的半导体器件，其中半导体器件在瞬态热通量状态和正常热通量状态下操作，热耦合到半导体器件的表面的冷却剂流体，改变材料热耦合到半导体器件的表面。相变材料具有相变材料从第一相变为第二相的相变温度。至少当半导体器件在瞬态热通量状态下工作时，相变材料吸收热通量。

6. 发明授权

US09157460B2 Controlling a fluid flow with a magnetic field 有权
标题翻译：用磁场控制流体流动
公开(公告)号：US09157460B2
公开(公告)日：2015-10-13
申请号：US13489106
申请日：2012-06-05
申请人： Shailesh N. Joshi , Jaewook Lee
发明人： Shailesh N. Joshi , Jaewook Lee
IPC分类号： F15C1/04 , F15B7/00 , F16K99/00 , F16K31/06 , F16K31/02
CPC分类号： F15B7/00 , B01L2200/0673 , F16K31/02 , F16K31/0672 , F16K99/0015 , F16K99/0046 , Y10S137/909
摘要： A device, system and method for controlling the fluid flow of a process fluid in a tube with a magnetic field. A ferrogel can be included in the tube with the process fluid. A membrane can encapsulate the ferrogel. A mounting support can secure the membrane within the tube, and a magnetic field generator can generate the magnetic field to deform the membrane and the ferrogel from a natural position to a deformed position.
摘要翻译：用于控制具有磁场的管中的工艺流体的流体流动的装置，系统和方法。管子中可以含有过程流体。膜可以包裹铁素体。安装支撑件可以将膜固定在管内，并且磁场发生器可以产生磁场以使膜和铁凝胶从自然位置变形到变形位置。

7. 发明授权

US08315055B2 Systems and methods for providing heat transfer 有权
标题翻译：提供传热的系统和方法
公开(公告)号：US08315055B2
公开(公告)日：2012-11-20
申请号：US12500873
申请日：2009-07-10
申请人： Shailesh N. Joshi , Wen-Chieh Tang , Daniel T. Thompson
发明人： Shailesh N. Joshi , Wen-Chieh Tang , Daniel T. Thompson
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , F28F3/02 , F28F13/12 , G06F1/20 , H05K7/20154
摘要： There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating device. The thermally conductive plate has surface features configured to promote turbulent airflow over the thermally conductive plate, the thickness of the surface features being approximately equal to or less than the thickness of the plate.
摘要翻译：提供了一种散热装置。示例性的散热装置包括适于邻近至少一个发热装置设置的导热板。导热板具有被配置为促进导热板上的湍流气流的表面特征，表面特征的厚度大致等于或小于板的厚度。

8. 发明申请

US20110235272A1 ELECTRONIC COMPONENT HAVING A MOVABLE LOUVER 有权
标题翻译：具有可移动扬声器的电子元件
公开(公告)号：US20110235272A1
公开(公告)日：2011-09-29
申请号：US12748835
申请日：2010-03-29
申请人： Cullen E. BASH , Henry C. Coles , Shailesh N. Joshi
发明人： Cullen E. BASH , Henry C. Coles , Shailesh N. Joshi
IPC分类号： H05K7/20
CPC分类号： H05K7/20609 , H05K7/20727 , H05K7/20781
摘要： An electronic component includes a housing having an inlet section, a mid-section, and an outlet section, mounting components for mounting the housing within an electronics cabinet, at least one movable louver positioned in at least one of the inlet section, the mid-section, and the outlet section, an actuator configured to manipulate the at least one movable louver to vary a volume flowrate of airflow through the housing, and a controller configured to operate the actuator to one of substantially maintain an environmental condition change from the inlet to the outlet within a predetermined range and substantially restrict airflow through the housing when the electronic component is in a relatively low operational state.
摘要翻译：电子部件包括具有入口部分，中间部分和出口部分的壳体，用于将壳体安装在电子机柜内的安装部件，至少一个位于入口部分中的至少一个的可移动百叶窗，部分和出口部分，致动器，其构造成操纵所述至少一个可移动百叶窗以改变通过所述壳体的气流的体积流量;以及控制器，其被配置为将所述致动器操作到基本上保持从所述入口到出口处于预定范围内，并且当电子部件处于相对较低的操作状态时，基本上限制气流穿过外壳。

9. 发明申请

US20100321873A1 SYSTEMS AND METHODS FOR PROVIDING AIRFLOW 有权
标题翻译：用于提供气流的系统和方法
公开(公告)号：US20100321873A1
公开(公告)日：2010-12-23
申请号：US12489867
申请日：2009-06-23
申请人： Shailesh N. Joshi
发明人： Shailesh N. Joshi
IPC分类号： G06F1/20 , H05K5/02 , F04D29/66 , H05K7/20
CPC分类号： F04D25/166 , F04D29/664 , G06F1/20 , H05K7/20772
摘要： An exemplary embodiment of the present invention provides a computer system. The system includes an enclosure configured to house a plurality of electronic devices. The system also includes a fan coupled to the enclosure and configured to provide a flow of cooling air through the enclosure to cool the electronic devices. The system also includes a first airflow path configured to allow the cooling air to exit the enclosure and attenuate noise generated in the enclosure. The system also includes an auxiliary outlet configured to provide a second airflow path if the first airflow path is obstructed.
摘要翻译：本发明的示例性实施例提供一种计算机系统。该系统包括被配置为容纳多个电子设备的外壳。该系统还包括耦合到外壳并被配置为提供通过外壳的冷却空气流以冷却电子设备的风扇。该系统还包括构造成允许冷却空气离开外壳并且衰减在外壳中产生的噪声的第一气流路径。该系统还包括辅助出口，该辅助出口构造成在第一气流路径被阻塞时提供第二气流路径。

10. 发明申请

US20110007476A1 SYSTEMS AND METHODS FOR PROVIDING HEAT TRANSFER 有权
标题翻译：用于提供热传递的系统和方法
公开(公告)号：US20110007476A1
公开(公告)日：2011-01-13
申请号：US12500873
申请日：2009-07-10
申请人： Shailesh N. Joshi , Wen-Chieh Tang , Daniel T. Thompson
发明人： Shailesh N. Joshi , Wen-Chieh Tang , Daniel T. Thompson
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20727 , F28F3/02 , F28F13/12 , G06F1/20 , H05K7/20154
摘要： There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating device. The thermally conductive plate has surface features configured to promote turbulent airflow over the thermally conductive plate, the thickness of the surface features being approximately equal to or less than the thickness of the plate.
摘要翻译：提供了一种散热装置。示例性的散热装置包括适于邻近至少一个发热装置设置的导热板。导热板具有被配置为促进导热板上的湍流气流的表面特征，表面特征的厚度大致等于或小于板的厚度。

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