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1. 发明授权

US5131233A Gas-liquid forced turbulence cooling 失效
标题翻译：气液强制湍流冷却
公开(公告)号：US5131233A
公开(公告)日：1992-07-21
申请号：US666362
申请日：1991-03-08
申请人： Seymour R. Cray , Gregory J. Sherwood
发明人： Seymour R. Cray , Gregory J. Sherwood
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/20763 , G06F1/20 , G06F2200/201 , Y10S165/908 , Y10S165/911
摘要： A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation. Sensible heat gain to the cooling liquid and gas and latent heat of vaporization of the cooling liquid also occur in channels through and over the components. The flow of cooling gas propels the cooling liquid through the channels. The cooling system is advantageous for cooling electronic components such as integrated circuits which exhibit relatively high degree of energy and physical density, in supercomputers. The cooling system may also be advantageously combined with an immersion cooling system for the power supply components in the computer.
摘要翻译：冷却系统采用组合热力学循环中的冷却液体和冷却气体来克服发热部件致密组件的流动阻力，并通过引起湍流来改善热传递，从而减少热滞后和边界层形成的影响。对于冷却液体和气体的明显的热增益以及冷却液体的蒸发潜热也发生在穿过部件的通道中。冷却气体的流动推动冷却液通过通道。在超级计算机中，冷却系统有利于冷却表现出相当高的能量和物理密度的集成电路的电子部件。冷却系统还可以有利地与用于计算机中的电源组件的浸没冷却系统组合。

2. 发明授权

US5112232A Twisted wire jumper electrical interconnector 失效
标题翻译：双绞电线互连器
公开(公告)号：US5112232A
公开(公告)日：1992-05-12
申请号：US657653
申请日：1991-02-15
申请人： Seymour R. Cray , Nicholas J. Krajewski
发明人： Seymour R. Cray , Nicholas J. Krajewski
IPC分类号： H01L21/48 , H01L21/607 , H01R12/58 , H05K3/30 , H05K3/32 , H05K3/36
CPC分类号： H01L24/11 , H01L21/4853 , H01R12/523 , H05K3/308 , H05K3/328 , H05K3/36 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4943 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K2201/096 , H05K2201/1059 , H05K2201/10825 , H05K2201/10909 , H05K2201/10946 , H05K2203/0495 , H05K3/368
摘要： A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection aperture located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical interconnection of, and mechanical coupling between the printed circuit boards.This application is a division of co pending patent application Her. No. 07/347,507, filed May 4, 1989, now U.S. Pat. No. 5,014,419, issued May 14, 1991, U.S. Pat. application Ser. No. 07/347,507 was a continuation-in-part of application Ser. No. 07/053,142, filed May 21, 1989, now U.S. Pat. No. 5,054,192, issued Oct. 8, 1991. All of these applications and patents are assigned to the same assignee.
摘要翻译：一种用于通过使用由多丝线形成并且具有沿着销形成的扩大的鸟笼的双绞线跳线来互连电子电路板的方法和装置。引脚穿过电路板堆叠以将网格定位成与位于印刷电路板中的互连孔接触。保持架在孔中的摩擦接合提供印刷电路板之间的电互连和机械耦合。这个应用是她的共同未决专利申请的一个部门。 1989年5月4日提交的现在的美国专利No.07 / 347,507。 1991年5月14日授权的美国专利5,014,419。应用程序第07 / 347,507号是应用程序Ser的部分延续。 1989年5月21日提交的现在的美国专利No.07 / 053,142。 1991年10月8日授权的第5,054,192号。所有这些申请和专利都转让给同一受让人。

3. 发明授权

US5014419A Twisted wire jumper electrical interconnector and method of making 失效
标题翻译：双绞线电连接器及其制造方法
公开(公告)号：US5014419A
公开(公告)日：1991-05-14
申请号：US347507
申请日：1989-05-04
申请人： Seymour R. Cray , Nicholas J. Krajewski
发明人： Seymour R. Cray , Nicholas J. Krajewski
IPC分类号： H01L21/48 , H01L21/607 , H01R11/01 , H01R12/52 , H01R43/16 , H05K3/30 , H05K3/32 , H05K3/36
CPC分类号： H01L24/11 , H01L21/4853 , H01R12/523 , H05K3/308 , H05K3/328 , H05K3/36 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4943 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K2201/096 , H05K2201/1059 , H05K2201/10825 , H05K2201/10909 , H05K2201/10946 , H05K2203/0495 , H05K3/368 , Y10T29/49126 , Y10T29/4914 , Y10T29/49144 , Y10T29/49153
摘要： A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection apertures located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical inter connection of, and mechanical coupling between the printed circuit boards.
摘要翻译：一种用于通过使用由多丝线形成并且具有沿着销形成的扩大的鸟笼的双绞线跳线来互连电子电路板的方法和装置。引脚穿过电路板堆叠，以将网格定位成与位于印刷电路板中的互连孔接触。保持架在孔中的摩擦接合提供印刷电路板之间的电连接和机械耦合。

4. 发明授权

US5349677A Apparatus for calculating delay when executing vector tailgating instructions and using delay to facilitate simultaneous reading of operands from and writing of results to same vector register 失效
标题翻译：用于在执行向量尾随指令时使用延迟来计算延迟的装置，并且使用延迟来促进同时读取操作数并将结果写入同一向量寄存器
公开(公告)号：US5349677A
公开(公告)日：1994-09-20
申请号：US683095
申请日：1991-04-10
申请人： Seymour R. Cray , James R. Bedell , Dennis W. Kuba , William T. Moore, Jr.
发明人： Seymour R. Cray , James R. Bedell , Dennis W. Kuba , William T. Moore, Jr.
IPC分类号： G06F17/16 , G06F9/312 , G06F15/76 , G06F15/78 , G06F9/34
CPC分类号： G06F15/8076
摘要： Improved performance is obtained in computers of the type having vector registers which communicate with one or more functional units and common memory. As elements of a vector are read from a vector register for transmission to common memory or as operands to a functional unit, the vector register immediately becomes available to receive and store elements of a vector from common memory or a functional unit. The element-by-element storing takes place simultaneously with the element-by-element reading, and trails the reading by at least one element so as to not overwrite elements yet to be read. Through the use of this technique a vector register can be loaded with a vector for a subsequent operation without having to wait for the completion of the previous operation which uses the same vector register.
摘要翻译：在具有与一个或多个功能单元和公共存储器通信的向量寄存器的类型的计算机中获得了改进的性能。由向量寄存器读取向量寄存器中的元素，以传输到公共存储器或作为功能单元的操作数，向量寄存器立即可用于从公共存储器或功能单元接收和存储向量的元素。逐个元件存储与逐个元素读取同时发生，并且通过至少一个元素追踪读取，以便不覆盖尚未被读取的元素。通过使用这种技术，向量寄存器可以加载一个向量，用于后续操作，而不必等待使用相同向量寄存器的先前操作的完成。

5. 发明授权

US5195237A Flying leads for integrated circuits 失效
标题翻译：集成电路飞线
公开(公告)号：US5195237A
公开(公告)日：1993-03-23
申请号：US814067
申请日：1991-12-24
申请人： Seymour R. Cray , Nicholas J. Krajewski
发明人： Seymour R. Cray , Nicholas J. Krajewski
IPC分类号： H01L21/48 , H01L21/607 , H01L23/538 , H01L25/065 , H05K3/30 , H05K3/32 , H05K3/36
CPC分类号： H01L24/11 , H01L21/4853 , H01L23/5384 , H01L23/5385 , H01L25/0655 , H01L25/0657 , H01R12/523 , H05K3/308 , H05K3/328 , H05K3/36 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/4943 , H01L2224/78301 , H01L2225/06517 , H01L2225/0652 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L24/45 , H01L24/49 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H05K2201/096 , H05K2201/1059 , H05K2201/10825 , H05K2201/10909 , H05K2201/10946 , H05K2203/0495 , H05K3/368 , Y10T29/4914 , Y10T29/49149 , Y10T29/49151 , Y10T29/4979
摘要： A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.
摘要翻译：一种使用在纯通孔内机械压缩的近纯软质退火金的电子电路互连的方法和装置。本发明的应用是将集成电路芯片直接连接到电路板上，通过将金线以与芯片表面基本垂直的方式与集成电路芯片的焊盘焊接在一起，将金线插入到通孔的通孔中一旦导线在穿透孔内被压缩就提供电气和机械连接的电路板。本发明还将其应用于夹层电路板组件的互连中，其中软金导线插入到电路板的轴向对齐的通孔中并被压缩，使得金引线在穿透孔内压缩和弯曲在电路板之间形成电连接。

6. 发明授权

US5054192A Lead bonding of chips to circuit boards and circuit boards to circuit boards 失效
标题翻译：将电路板与电路板导线连接到电路板
公开(公告)号：US5054192A
公开(公告)日：1991-10-08
申请号：US53142
申请日：1987-05-21
申请人： Seymour R. Cray , Nicholas J. Krajewski
发明人： Seymour R. Cray , Nicholas J. Krajewski
IPC分类号： H01L21/48 , H01L21/60 , H01L21/607 , H01L23/50 , H01R12/52 , H05K3/30 , H05K3/32 , H05K3/36
CPC分类号： H01L24/11 , H01L21/4853 , H01R12/523 , H05K3/308 , H05K3/328 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45144 , H01L2224/4943 , H01L2224/78301 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12033 , H01L2924/14 , H05K2201/096 , H05K2201/1059 , H05K2201/10825 , H05K2201/10909 , H05K2201/10946 , H05K2203/0495 , H05K3/368 , Y10T29/49135 , Y10T29/4914 , Y10T29/49153
摘要： A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the hold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.
摘要翻译：一种使用在纯通孔内机械压缩的近纯软质退火金的电子电路互连的方法和装置。本发明的应用是将集成电路芯片直接连接到电路板上，通过将金线以与芯片表面基本垂直的方式与集成电路芯片的焊盘焊接在一起，将金线插入到通孔的通孔中一旦导线在穿透孔内被压缩就提供电气和机械连接的电路板。本发明还应用于夹层电路板组件的互连中，其中软金导线插入到电路板的轴向对齐的通孔中并被压缩，使得保持引线在穿通孔内压缩和弯曲在电路板之间形成电连接。

7. 发明授权

US5045975A Three dimensionally interconnected module assembly 失效
标题翻译：三维互连模块组件
公开(公告)号：US5045975A
公开(公告)日：1991-09-03
申请号：US386290
申请日：1989-07-27
申请人： Seymour R. Cray , Nicholas J. Krajewski
发明人： Seymour R. Cray , Nicholas J. Krajewski
IPC分类号： H01L21/48 , H01L21/607 , H05K3/30 , H05K3/32 , H05K3/36
CPC分类号： H01L24/11 , H01L21/4853 , H01R12/523 , H05K3/308 , H05K3/328 , H05K3/36 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45015 , H01L2224/45144 , H01L2224/4943 , H01L2224/78301 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L24/45 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01041 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H05K2201/096 , H05K2201/1059 , H05K2201/10825 , H05K2201/10909 , H05K2201/10946 , H05K2203/0495 , H05K3/368 , Y10S428/901 , Y10T29/49126 , Y10T29/4914
摘要： A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the disc and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.
摘要翻译：一种使用在纯通孔内机械压缩的近纯软质退火金的电子电路互连的方法和装置。本发明的应用是将集成电路芯片直接连接到电路板上，通过将金线以与盘的表面基本垂直的方式将金线焊接到集成电路芯片的焊盘上，并将金引线插入到通孔的通孔中一旦导线在穿透孔内被压缩就提供电气和机械连接的电路板。本发明还将其应用于夹层电路板组件的互连中，其中软金导线插入到电路板的轴向对齐的通孔中并被压缩，使得金引线在穿透孔内压缩和弯曲在电路板之间形成电连接。

8. 发明授权

US4965863A Gallium arsenide depletion made MESFIT logic cell 失效
标题翻译：砷化镓耗尽使得MESFIT逻辑电池
公开(公告)号：US4965863A
公开(公告)日：1990-10-23
申请号：US104758
申请日：1987-10-02
申请人： Seymour R. Cray
发明人： Seymour R. Cray
IPC分类号： H01L21/8232 , H01L27/06 , H03K19/0185 , H03K19/0952 , H03K19/0956
CPC分类号： H01L27/0605 , H03K19/018535 , H03K19/0956
摘要： A gallium arsenide logic design system is described for designing custom or semi-custom LSI integrated circuits using standard cells from a cell library. D-MESFET transistors and Schottky diodes are used for implementing the cell types in gallium arsenide to produce performance levels of less than 150 pico-second per gate propagation delay. Each integrated circuit die is built from a cell library containing three standard cells. The limitation on the number of standard cells used for logic design allows for fast and efficient turnaround time between logic design and fabrication. A minumum number of masks are required for implementing the custom integrated circuit due to the efficient design of the cell types. The placement and interconnect of the cells on the die are also performed in an efficient manner due to the predefined allowable locations for cell placement and the predefined allowable route channels for the interconnect. A clock amplifier cell is described for the cell library which differentially phase corrects a two-phase clock signal to ensure that the two clock lines are perfectly out of phase at all times. The combination of this strictly controlled two-phase clock with the gallium arsenide cell designs allows digital logic implementations at an LSI level to operate at 1-GHz clock frequencies.
摘要翻译：描述了砷化镓逻辑设计系统，用于使用来自单元库的标准单元来设计定制或半定制的LSI集成电路。 D-MESFET晶体管和肖特基二极管用于实现砷化镓中的电池类型，以产生每栅极传播延迟小于150皮秒的性能水平。每个集成电路管芯由包含三个标准单元的单元库构建。用于逻辑设计的标准单元数量的限制允许在逻辑设计和制造之间快速有效的周转时间。由于电池类型的有效设计，需要最少数量的掩模来实现定制集成电路。由于用于单元布置的预定义的可允许位置和用于互连的预定义的可允许路线通道，芯片上的单元的放置和互连也以有效的方式执行。对于单元库描述时钟放大器单元，其对差分相位校正两相时钟信号，以确保两个时钟线始终完全异相。这种严格控制的两相时钟与砷化镓电池设计的组合允许LSI级别的数字逻辑实现在1 GHz时钟频率下工作。

9. 外观设计

USD333127S Computer cabinet 失效
公开(公告)号：USD333127S
公开(公告)日：1993-02-09
申请号：US480580
申请日：1990-02-15
申请人： Seymour R. Cray , Nicholas J. Krajewski , David J. Johnson , Eugene N. Reshanov , Johannes N. Gaston
设计人： Seymour R. Cray , Nicholas J. Krajewski , David J. Johnson , Eugene N. Reshanov , Johannes N. Gaston

10. 发明授权

US5184400A Method for manufacturing a twisted wire jumper electrical interconnector 失效
标题翻译：双绞电线互连器的制造方法
公开(公告)号：US5184400A
公开(公告)日：1993-02-09
申请号：US822628
申请日：1992-01-17
申请人： Seymour R. Cray , Nicholas J. Krajewski
发明人： Seymour R. Cray , Nicholas J. Krajewski
IPC分类号： H01L21/48 , H01L21/607 , H01R43/02 , H05K3/30 , H05K3/32 , H05K3/36
CPC分类号： H01L24/11 , H01L21/4853 , H01R12/523 , H05K3/308 , H05K3/328 , H05K3/36 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4943 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K2201/096 , H05K2201/1059 , H05K2201/10825 , H05K2201/10909 , H05K2201/10946 , H05K2203/0495 , H05K3/368 , Y10T29/4921 , Y10T29/49213
摘要： A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection apertures located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical inter connection of, and mechanical coupling between the printed circuit boards.
摘要翻译：一种用于通过使用由多丝线形成并且具有沿着销形成的扩大的鸟笼的双绞线跳线来互连电子电路板的方法和装置。引脚穿过电路板堆叠，以将网格定位成与位于印刷电路板中的互连孔接触。保持架在孔中的摩擦接合提供印刷电路板之间的电连接和机械耦合。

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