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1. 发明授权

US07675148B2 Power module having stacked flip-chip and method of fabricating the power module 有权
标题翻译：具有堆叠倒装芯片的电源模块和制造电源模块的方法
公开(公告)号：US07675148B2
公开(公告)日：2010-03-09
申请号：US12074225
申请日：2008-02-28
申请人： Seung-won Lim , O-Seob Jeon , Joon-seo Son , Keun-hyuk Lee , Yun-hwa Choi
发明人： Seung-won Lim , O-Seob Jeon , Joon-seo Son , Keun-hyuk Lee , Yun-hwa Choi
IPC分类号： H01L23/495
CPC分类号： H01L24/96 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49861 , H01L24/10 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/05001 , H01L2224/0557 , H01L2224/05571 , H01L2224/056 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/1308 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/83801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/13099 , H01L2924/00 , H01L2224/05099 , H01L2924/00012
摘要： Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method. The method includes forming bumps on power and control device chips on a wafer level; separately sawing the power and control device chips into individual chips; adhering the power device chip onto a thermal substrate and the control device chip onto an interconnecting substrate; combining a lead frame, the thermal substrate, and the interconnecting substrate with one another in a multi-jig; and sealing the power and control device chips, and the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.
摘要翻译：提供了具有堆叠倒装芯片的功率模块和制造功率模块的方法。电源模块包括引线框架; 控制装置部分，包括控制装置芯片; 功率器件部件，其包括电源器件芯片并且电连接到引线框架; 以及控制和功率器件部分分别设置在上部和下部的互连衬底，并且每个控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底之一。该方法包括在晶片级的功率和控制器件芯片上形成凸块; 将电源和控制芯片单独切割成单独的芯片; 将功率器件芯片粘附到热衬底上，并将控制器件芯片粘附到互连衬底上; 在多夹具中将引线框架，热基板和互连基板彼此组合; 并且密封功率和控制装置芯片，并且控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底中的一个。

2. 发明申请

US20080224285A1 Power module having stacked flip-chip and method of fabricating the power module 有权
标题翻译：具有堆叠倒装芯片的电源模块和制造电源模块的方法
公开(公告)号：US20080224285A1
公开(公告)日：2008-09-18
申请号：US12074225
申请日：2008-02-28
申请人： Seung-won Lim , O-Seob Jeon , Joon-seo Son , Keun-hyuk Lee , Yun-hwa Choi
发明人： Seung-won Lim , O-Seob Jeon , Joon-seo Son , Keun-hyuk Lee , Yun-hwa Choi
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L24/96 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49861 , H01L24/10 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/05001 , H01L2224/0557 , H01L2224/05571 , H01L2224/056 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/1308 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/83801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/13099 , H01L2924/00 , H01L2224/05099 , H01L2924/00012
摘要： Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method. The method includes forming bumps on power and control device chips on a wafer level; separately sawing the power and control device chips into individual chips; adhering the power device chip onto a thermal substrate and the control device chip onto an interconnecting substrate; combining a lead frame, the thermal substrate, and the interconnecting substrate with one another in a multi-jig; and sealing the power and control device chips, and the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.
摘要翻译：提供了具有堆叠倒装芯片的功率模块和制造功率模块的方法。电源模块包括引线框架; 控制装置部分，包括控制装置芯片; 功率器件部件，其包括电源器件芯片并且电连接到引线框架; 以及控制和功率器件部分分别设置在上部和下部的互连衬底，并且每个控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底之一。该方法包括在晶片级的功率和控制器件芯片上形成凸块; 将电源和控制芯片单独切割成单独的芯片; 将功率器件芯片粘附到热衬底上，并将控制器件芯片粘附到互连衬底上; 在多夹具中将引线框架，热基板和互连基板彼此组合; 并且密封功率和控制装置芯片，并且控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底中的一个。

3. 发明授权

US08766419B2 Power module having stacked flip-chip and method of fabricating the power module 有权
标题翻译：具有堆叠倒装芯片的电源模块和制造电源模块的方法
公开(公告)号：US08766419B2
公开(公告)日：2014-07-01
申请号：US12643901
申请日：2009-12-21
申请人： Seung-won Lim , O-Seob Jeon , Joon-seo Son , Keun-kyuk Lee , Yun-hwa Choi
发明人： Seung-won Lim , O-Seob Jeon , Joon-seo Son , Keun-kyuk Lee , Yun-hwa Choi
IPC分类号： H01L23/495 , H01L23/433 , H01L23/498 , H01L23/00
CPC分类号： H01L24/96 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49861 , H01L24/10 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/05001 , H01L2224/0557 , H01L2224/05571 , H01L2224/056 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/1308 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/83801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/13099 , H01L2924/00 , H01L2224/05099 , H01L2924/00012
摘要： Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method. The method includes forming bumps on power and control device chips on a wafer level; separately sawing the power and control device chips into individual chips; adhering the power device chip onto a thermal substrate and the control device chip onto an interconnecting substrate; combining a lead frame, the thermal substrate, and the interconnecting substrate with one another in a multi-jig; and sealing the power and control device chips, and the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.
摘要翻译：提供了具有堆叠倒装芯片的功率模块和制造功率模块的方法。电源模块包括引线框架; 控制装置部分，包括控制装置芯片; 功率器件部件，其包括电源器件芯片并且电连接到引线框架; 以及控制和功率器件部分分别设置在上部和下部的互连衬底，并且每个控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底之一。该方法包括在晶片级的功率和控制器件芯片上形成凸块; 将电源和控制芯片单独切割成单独的芯片; 将功率器件芯片粘附到热衬底上，并将控制器件芯片粘附到互连衬底上; 在多夹具中将引线框架，热基板和互连基板彼此组合; 并且密封功率和控制装置芯片，并且控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底中的一个。

4. 发明申请

US20100155914A1 Power Module Having Stacked Flip-Chip and Method of Fabricating the Power Module 有权
标题翻译：具有堆叠倒装芯片的功率模块和制造功率模块的方法
公开(公告)号：US20100155914A1
公开(公告)日：2010-06-24
申请号：US12643901
申请日：2009-12-21
申请人： Seung-won Lim , O-Seob Jeon , Joon-seo Son , Keun-kyuk Lee , Yun-hwa Choi
发明人： Seung-won Lim , O-Seob Jeon , Joon-seo Son , Keun-kyuk Lee , Yun-hwa Choi
IPC分类号： H01L23/495 , H01L23/34
CPC分类号： H01L24/96 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49861 , H01L24/10 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/05001 , H01L2224/0557 , H01L2224/05571 , H01L2224/056 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/1308 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/83801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/13099 , H01L2924/00 , H01L2224/05099 , H01L2924/00012
摘要： Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method. The method includes forming bumps on power and control device chips on a wafer level; separately sawing the power and control device chips into individual chips; adhering the power device chip onto a thermal substrate and the control device chip onto an interconnecting substrate; combining a lead frame, the thermal substrate, and the interconnecting substrate with one another in a multi-jig; and sealing the power and control device chips, and the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.
摘要翻译：提供了具有堆叠倒装芯片的功率模块和制造功率模块的方法。电源模块包括引线框架; 控制装置部分，包括控制装置芯片; 功率器件部件，其包括电源器件芯片并且电连接到引线框架; 以及控制和功率器件部分分别设置在上部和下部的互连衬底，并且每个控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底之一。该方法包括在晶片级的功率和控制器件芯片上形成凸块; 将电源和控制芯片单独切割成单独的芯片; 将功率器件芯片粘附到热衬底上，并将控制器件芯片粘附到互连衬底上; 在多夹具中将引线框架，热基板和互连基板彼此组合; 并且密封功率和控制装置芯片，并且控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底中的一个。

5. 发明申请

US20100189082A1 LOCATION TRACKING METHOD IN COORDINATOR-BASED WIRELESS NETWORK 有权
标题翻译：基于协调器的无线网络中的位置跟踪方法
公开(公告)号：US20100189082A1
公开(公告)日：2010-07-29
申请号：US12751131
申请日：2010-03-31
申请人： Yun-hwa Choi , Hyong-uk Choi
发明人： Yun-hwa Choi , Hyong-uk Choi
IPC分类号： H04W72/04 , H04J3/16
CPC分类号： H04W64/00 , H04B7/2612
摘要： A location tracking method in a coordinator-based wireless network is provided. The location tracking method in a coordinator-based wireless network includes transmitting a first frame including its own identifier and time information to the wireless network by a device associated with the wireless network in order to disclose its location information; and receiving a second frame including the location information of the device transmitted from the wireless network by the device, as a response to the first frame.
摘要翻译：提供了一种基于协调器的无线网络中的位置跟踪方法。基于协调器的无线网络中的位置跟踪方法包括：通过与无线网络相关联的设备向无线网络发送包括其自己的标识符和时间信息的第一帧，以便公开其位置信息; 以及作为对第一帧的响应，接收包括由设备从无线网络发送的设备的位置信息的第二帧。

6. 发明授权

US07551594B2 Method of allocating frequency subband and apparatus adopting the same 有权
标题翻译：分配频率子带的方法及其采用的方法
公开(公告)号：US07551594B2
公开(公告)日：2009-06-23
申请号：US10942948
申请日：2004-09-17
申请人： Yun-hwa Choi , Hyong-uk Choi
发明人： Yun-hwa Choi , Hyong-uk Choi
IPC分类号： H04Q7/24
CPC分类号： H04W16/14 , H04B1/7163 , H04W72/0453 , H04W84/18
摘要： A method of allocating frequency subbands in an ultrawideband (UWB) wireless communication system and an apparatus adopting the same are provided. The method of allocating frequency subbands to a device in a communication system, the method including: (a) determining whether usage of a first frequency band including upper frequency subbands is necessary; and (b) if it is determined that the usage of the first frequency band is necessary, not setting usage permission for the first frequency band to the device and not granting access to the first frequency band if a request for usage of the first frequency band is received from the device. When generation of a new piconet is necessary or generation of a new piconet is requested in a multi-piconet environment, since subbands of a high frequency group are allocated through negotiation, frequency resources are efficiently managed.
摘要翻译：提供了一种在超宽带（UWB）无线通信系统中分配频率子带的方法和采用该方法的装置。将频率子带分配给通信系统中的设备的方法，所述方法包括：（a）确定是否需要包括高频子带的第一频带的使用; 以及（b）如果确定需要第一频带的使用，则不对设备使用第一频带的使用许可，并且如果第一频带的使用请求不准予对第一频带的访问从设备接收。当需要新的微微网的生成或者在多微微网环境中请求新的微微网的生成时，由于通过协商来分配高频组的子带，所以能够有效地管理频率资源。

7. 发明授权

US07957340B2 Method of allocating frequency subband and apparatus adopting the same 有权
标题翻译：分配频率子带的方法及其采用的方法
公开(公告)号：US07957340B2
公开(公告)日：2011-06-07
申请号：US11865421
申请日：2007-10-01
申请人： Yun-hwa Choi , Hyong-uk Choi
发明人： Yun-hwa Choi , Hyong-uk Choi
IPC分类号： H04W4/00
CPC分类号： H04W16/14 , H04B1/7163 , H04W72/0453 , H04W84/18
摘要： A method of allocating frequency subbands in an ultrawideband (UWB) wireless communication system and an apparatus adopting the same are provided. The method of allocating frequency subbands to a device in a communication system, the method including: (a) determining whether usage of a first frequency band including upper frequency subbands is necessary; and (b) if it is determined that the usage of the first frequency band is necessary, not setting usage permission for the first frequency band to the device and not granting access to the first frequency band if a request for usage of the first frequency band is received from the device. When generation of a new piconet is necessary or generation of a new piconet is requested in a multi-piconet environment, since subbands of a high frequency group are allocated through negotiation, frequency resources are efficiently managed.
摘要翻译：提供了一种在超宽带（UWB）无线通信系统中分配频率子带的方法和采用该方法的装置。将频率子带分配给通信系统中的设备的方法，所述方法包括：（a）确定是否需要包括高频子带的第一频带的使用; 以及（b）如果确定需要第一频带的使用，则不对设备使用第一频带的使用许可，并且如果第一频带的使用请求不准予对第一频带的访问从设备接收。当需要新的微微网的生成或者在多微微网环境中请求新的微微网的生成时，由于通过协商来分配高频组的子带，所以能够有效地管理频率资源。

8. 发明申请

US20050276310A1 Method for ultra wideband communication, and ultra wideband transmitter and receiver 审中-公开
标题翻译：超宽带通信方式，超宽带发射机和接收机
公开(公告)号：US20050276310A1
公开(公告)日：2005-12-15
申请号：US11147258
申请日：2005-06-08
申请人： Yun-hwa Choi , Jae-hyon Kim
发明人： Yun-hwa Choi , Jae-hyon Kim
IPC分类号： H04J1/00 , H04B1/7176 , H04J13/00 , H04L25/49 , H04L27/00 , H04L27/26 , H04B1/69
CPC分类号： H04B1/7176
摘要： A method and apparatus for ultra wideband (UWB) communication are provided. The method includes generating a UWB signal having different types of data segments composed of at least one bit, the data segments being mapped to different central frequencies according to the types of the data segments, transmitting the UWB signal to a device through a wireless medium, receiving, by the device, the UWB signal transmitted through the wireless medium, and determining a data segment mapped to a central frequency of the received UWB signal.
摘要翻译：提供了一种用于超宽带（UWB）通信的方法和装置。该方法包括：生成具有由至少一个比特构成的不同类型的数据段的UWB信号，根据数据段的类型将数据段映射到不同的中心频率，通过无线介质将UWB信号发送到设备，通过该设备接收通过无线介质传输的UWB信号，以及确定映射到所接收的UWB信号的中心频率的数据段。

9. 发明申请

US20050195883A1 Method and apparatus for ultra wideband communication 审中-公开
标题翻译：用于超宽带通信的方法和装置
公开(公告)号：US20050195883A1
公开(公告)日：2005-09-08
申请号：US11056481
申请日：2005-02-14
申请人： Yun-hwa Choi , In-hwan Kim
发明人： Yun-hwa Choi , In-hwan Kim
IPC分类号： H04L27/26 , H04B1/69
CPC分类号： H04B1/7176
摘要： A method and apparatus for Ultra Wideband (UWB) communication, wherein in a UWB transmission method, a codeword stream is generated by performing spread spectrum used in Direct Sequence Code Division Multiple Access (DS CDMA) on a bitstream, followed by performing Orthogonal Frequency Division Multiplexing (OFDM) modulation .on the codeword stream. In a UWB reception method, UWB signals are received and subjected to UWB demodulation to obtain OFDM signals. The obtained OFDM signals are subjected to OFDM demodulation to obtain a codeword stream. Then, spread spectrum used in the DS CDMA is performed on the codeword stream, thereby generating a bitstream. The method and apparatus provide UWB communication having characteristics of both of Multi-Band OFDM (ODM) and Direct Sequence Code Division Multiple Access (DS CDMA).
摘要翻译：一种用于超宽带（UWB）通信的方法和装置，其中在UWB传输方法中，通过在比特流上执行直接序列码分多址（DS CDMA）中使用的扩展频谱，然后执行正交频分码字流中的多路复用（OFDM）调制。在UWB接收方法中，UWB信号被接收并进行UWB解调以获得OFDM信号。对获得的OFDM信号进行OFDM解调以获得码字流。然后，在码字流中执行在DS CDMA中使用的扩展频谱，从而生成比特流。该方法和装置提供具有多频带OFDM（ODM）和直接序列码分多址（DS CDMA）两者的特征的UWB通信。

10. 发明申请

US20050068930A1 Method of allocating frequency subband and apparatus adopting the same 有权
标题翻译：分配频率子带的方法及其采用的方法
公开(公告)号：US20050068930A1
公开(公告)日：2005-03-31
申请号：US10942948
申请日：2004-09-17
申请人： Yun-hwa Choi , Hyong-uk Choi
发明人： Yun-hwa Choi , Hyong-uk Choi
IPC分类号： H04B7/26 , H04J1/00 , H04W16/14 , H04W84/18
CPC分类号： H04W16/14 , H04B1/7163 , H04W72/0453 , H04W84/18
摘要： A method of allocating frequency subbands in an ultrawideband (UWB) wireless communication system and an apparatus adopting the same are provided. The method of allocating frequency subbands to a device in a communication system, the method including: (a) determining whether usage of a first frequency band including upper frequency subbands is necessary; and (b) if it is determined that the usage of the first frequency band is necessary, not setting usage permission for the first frequency band to the device and not granting access to the first frequency band if a request for usage of the first frequency band is received from the device. When generation of a new piconet is necessary or generation of a new piconet is requested in a multi-piconet environment, since subbands of a high frequency group are allocated through negotiation, frequency resources are efficiently managed.
摘要翻译：提供了一种在超宽带（UWB）无线通信系统中分配频率子带的方法和采用该方法的装置。将频率子带分配给通信系统中的设备的方法，所述方法包括：（a）确定是否需要包括高频子带的第一频带的使用; 以及（b）如果确定需要第一频带的使用，则不对设备使用第一频带的使用许可，并且如果第一频带的使用请求不准予对第一频带的访问从设备接收。当需要新的微微网的生成或者在多微微网环境中请求新的微微网的生成时，由于通过协商来分配高频组的子带，所以能够有效地管理频率资源。

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