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1. 发明申请

US20130168143A1 CIRCUIT BOARD 审中-公开
标题翻译：电路板
公开(公告)号：US20130168143A1
公开(公告)日：2013-07-04
申请号：US13454680
申请日：2012-04-24
申请人： Seung Wook Park , Mi Jin Park , Christian Romero , Young Do Kweon
发明人： Seung Wook Park , Mi Jin Park , Christian Romero , Young Do Kweon
IPC分类号： H05K1/09 , H05K1/02
CPC分类号： H05K1/025 , H05K1/0271 , H05K3/4644 , H05K2201/0355 , H05K2201/0792
摘要： Disclosed herein is a circuit board including: an insulating material; a build-up layer formed on one surface of the insulating material, and including at least one circuit layer and at least one insulating layer; and a metal layer formed on the other surface of the insulating material and electrically disconnected from the circuit layer.
摘要翻译：这里公开了一种电路板，包括：绝缘材料; 形成在所述绝缘材料的一个表面上并且包括至少一个电路层和至少一个绝缘层的堆积层; 以及形成在所述绝缘材料的另一个表面上并与所述电路层电连接的金属层。

2. 发明授权

US08581394B2 Semiconductor package module and electric circuit assembly with the same 有权
标题翻译：半导体封装模块与电路组件相同
公开(公告)号：US08581394B2
公开(公告)日：2013-11-12
申请号：US12897842
申请日：2010-10-05
申请人： Seung Wook Park , Young Do Kweon , Mi Jin Park
发明人： Seung Wook Park , Young Do Kweon , Mi Jin Park
IPC分类号： H01L23/34
CPC分类号： H01L23/3107 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L2224/13 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H05K1/11 , H05K1/141 , H05K1/142 , H05K1/184 , H05K3/326 , H05K3/368 , H05K2203/1327 , H05K2203/1572 , H01L2924/014
摘要： Disclosed herein is a semiconductor package module. The semiconductor package module includes a circuit substrate having an external connection pattern; electronic components mounted on the circuit substrate; a molding structure having a structure surrounding the circuit substrate so as to seal the electronic components from the external environment; and an external connection structure of which one portion is connected to the external connection pattern and the other portion is exposed to the outside of the molding structure.
摘要翻译：这里公开了半导体封装模块。半导体封装模块包括具有外部连接图案的电路基板; 安装在电路基板上的电子部件; 模制结构，其具有围绕所述电路基板的结构，以将所述电子部件与所述外部环境密封; 以及外部连接结构，其一部分连接到外部连接图案，另一部分暴露于模制结构的外部。

3. 发明申请

US20110309501A1 SEMICONDUCTOR PACKAGE MODULE AND ELECTRIC CIRCUIT ASSEMBLY WITH THE SAME 有权
标题翻译：半导体封装模块和电路与其组装
公开(公告)号：US20110309501A1
公开(公告)日：2011-12-22
申请号：US12897842
申请日：2010-10-05
申请人： Seung Wook Park , Young Do Kweon , Mi Jin Park
发明人： Seung Wook Park , Young Do Kweon , Mi Jin Park
IPC分类号： H01L23/48
CPC分类号： H01L23/3107 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L2224/13 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H05K1/11 , H05K1/141 , H05K1/142 , H05K1/184 , H05K3/326 , H05K3/368 , H05K2203/1327 , H05K2203/1572 , H01L2924/014
摘要： Disclosed herein is a semiconductor package module. The semiconductor package module includes a circuit substrate having an external connection pattern; electronic components mounted on the circuit substrate; a molding structure having a structure surrounding the circuit substrate so as to seal the electronic components from the external environment; and an external connection structure of which one portion is connected to the external connection pattern and the other portion is exposed to the outside of the molding structure.
摘要翻译：这里公开了半导体封装模块。半导体封装模块包括具有外部连接图案的电路基板; 安装在电路基板上的电子部件; 模制结构，其具有围绕所述电路基板的结构，以将所述电子部件与所述外部环境密封; 以及外部连接结构，其一部分连接到外部连接图案，另一部分暴露于模制结构的外部。

4. 发明申请

US20110176285A1 Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure 有权
标题翻译：互连结构，插入器，半导体封装以及制造互连结构的方法
公开(公告)号：US20110176285A1
公开(公告)日：2011-07-21
申请号：US12805628
申请日：2010-08-10
申请人： Seung Wook Park , Young Do Kweon , Seung Wan Shin , Mi Jin Park , Kyung Seob Oh
发明人： Seung Wook Park , Young Do Kweon , Seung Wan Shin , Mi Jin Park , Kyung Seob Oh
IPC分类号： H05K1/18 , H05K1/11 , H01B13/00
CPC分类号： H05K3/32 , H01L23/13 , H01L23/49805 , H01L2924/0002 , H05K2201/09145 , H05K2201/09154 , H05K2201/10378 , H05K2201/10674 , H01L2924/00
摘要： There is provided an interconnection structure. An interconnection structure according to an aspect of the invention may include: a plurality of side portions provided on one surface of a substrate part and a plurality of cavities located between the side portions and located further inward than the side portions; and electrode pattern portions provided on surfaces of the side portions and the cavities.
摘要翻译：提供互连结构。根据本发明的一个方面的互连结构可以包括：设置在基板部分的一个表面上的多个侧部和位于侧部之间并且位于比侧部更靠内侧的多个空腔; 以及设置在侧部和空腔的表面上的电极图案部分。

5. 发明授权

US08582314B2 Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure 有权
标题翻译：互连结构，插入器，半导体封装以及制造互连结构的方法
公开(公告)号：US08582314B2
公开(公告)日：2013-11-12
申请号：US12805628
申请日：2010-08-10
申请人： Seung Wook Park , Young Do Kweon , Seung Wan Shin , Mi Jin Park , Kyung Seob Oh
发明人： Seung Wook Park , Young Do Kweon , Seung Wan Shin , Mi Jin Park , Kyung Seob Oh
IPC分类号： H05K1/11
CPC分类号： H05K3/32 , H01L23/13 , H01L23/49805 , H01L2924/0002 , H05K2201/09145 , H05K2201/09154 , H05K2201/10378 , H05K2201/10674 , H01L2924/00
摘要： There is provided an interconnection structure. An interconnection structure according to an aspect of the invention may include: a plurality of side portions provided on one surface of a substrate part and a plurality of cavities located between the side portions and located further inward than the side portions; and electrode pattern portions provided on surfaces of the side portions and the cavities.
摘要翻译：提供互连结构。根据本发明的一个方面的互连结构可以包括：设置在基板部分的一个表面上的多个侧部和位于侧部之间并且位于比侧部更靠内侧的多个空腔; 以及设置在侧部和空腔的表面上的电极图案部分。

6. 发明申请

US20110269413A1 Circuit board and method for manufacturing the same 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：US20110269413A1
公开(公告)日：2011-11-03
申请号：US12926280
申请日：2010-11-05
申请人： Seung Wook Park , Young Do Kweon , Mi Jin Park
发明人： Seung Wook Park , Young Do Kweon , Mi Jin Park
IPC分类号： H04B1/38 , H05K3/30
CPC分类号： H05K1/16 , H05K3/284 , H05K3/4629 , Y10T29/4913
摘要： There are provided a circuit board and a method for manufacturing the same. The circuit board according to the present invention includes: a first wiring pattern that is formed on one surface of the board; a second wiring pattern that is formed on the other surface of the board; an RF transmitter that is formed on one surface of the board and is connected to the first wiring pattern; and an RF receiver that is formed on the other surface of the board to be paired with the RF transmitter and is connected to the second wiring pattern, wherein the first wiring pattern and the second wiring pattern are electrically connected to each other by wireless communication from the RF transmitter to the RF receiver.
摘要翻译：提供了一种电路板及其制造方法。根据本发明的电路板包括：形成在板的一个表面上的第一布线图案; 形成在所述板的另一个表面上的第二布线图案; RF发射器，其形成在所述板的一个表面上并连接到所述第一布线图案; 以及RF接收器，其形成在所述板的另一表面上以与所述RF发射器配对并且连接到所述第二布线图案，其中所述第一布线图案和所述第二布线图案通过无线通信彼此电连接， RF发射机到RF接收机。

7. 发明授权

US08830689B2 Interposer-embedded printed circuit board 有权
标题翻译：插入式嵌入式印刷电路板
公开(公告)号：US08830689B2
公开(公告)日：2014-09-09
申请号：US13233851
申请日：2011-09-15
申请人： Jin Gu Kim , Mi Jin Park , Young Ho Kim , Seung Wook Park , Hee Kon Lee , Young Do Kweon
发明人： Jin Gu Kim , Mi Jin Park , Young Ho Kim , Seung Wook Park , Hee Kon Lee , Young Do Kweon
IPC分类号： H05K7/00 , H05K1/11 , H05K7/02 , H01L23/498 , H05K3/46 , H05K3/34
CPC分类号： H05K3/4694 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15311 , H05K1/112 , H05K3/3436 , H05K2203/041 , H01L2224/0401
摘要： Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of the substrate; an interposer disposed in the cavity and including a wiring region and an insulating region; and a circuit layer formed in the substrate and including a connection pattern connected with one side of the wiring region. The interposer-embedded printed circuit board is advantageous in that an interposer is embedded in a substrate, so that the thickness of a semiconductor package can be reduced, thereby keeping up with the trend of slimming the semiconductor package.
摘要翻译：本发明公开了一种嵌入式嵌入式印刷电路板，包括：基板，其具有在其一面形成并在基板的厚度方向上具有预定高度的空腔; 插入器，其设置在所述空腔中并且包括布线区域和绝缘区域; 以及形成在所述基板中并且包括与所述布线区域的一侧连接的连接图案的电路层。嵌入式嵌入式印刷电路板的优点在于，嵌入在衬底中，从而可以减小半导体封装的厚度，从而跟上半导体封装变窄的趋势。

8. 发明授权

US08987888B2 Semiconductor package and semiconductor package module having the same 有权
标题翻译：半导体封装和半导体封装模块具有相同的功能
公开(公告)号：US08987888B2
公开(公告)日：2015-03-24
申请号：US13368439
申请日：2012-02-08
申请人： Mi Jin Park , Christian Romero , Seung Wook Park
发明人： Mi Jin Park , Christian Romero , Seung Wook Park
IPC分类号： H01L23/48 , H01L23/52 , H01L23/498
CPC分类号： H01L23/49827 , H01L23/49838 , H01L2224/16225 , H01L2224/73265
摘要： Disclosed herein is a semiconductor package including: a semiconductor chip having a bonding pad; and a first substrate including a rerouting layer having short type rerouting patterns electrically connected with the bonding pad and formed to be seamlessly connected with each other and a plurality of open type rerouting patterns separately formed on the same layer as the short type rerouting patterns and connection terminals for signal connection each formed on the open type rerouting patterns.
摘要翻译：这里公开了一种半导体封装，包括：具有焊盘的半导体芯片; 以及第一基板，其包括具有与所述接合焊盘电连接并且形成为彼此无缝连接的短型重路由图案的重新路由层以及分开形成在与所述短路重新路由图案和连接相同的层上的多个开放式重新布线图案用于信号连接的端子各自形成在开放式重新路由模式上。

9. 发明授权

US08373537B2 Resistor having parallel structure and method of fabricating the same 有权
标题翻译：具有平行结构的电阻器及其制造方法
公开(公告)号：US08373537B2
公开(公告)日：2013-02-12
申请号：US12923574
申请日：2010-09-28
申请人： Mi Jin Park , Young Do Kweon , Jin Gu Kim
发明人： Mi Jin Park , Young Do Kweon , Jin Gu Kim
IPC分类号： H01C1/012
CPC分类号： H01C7/003 , H01C1/01 , H01C7/06 , Y10T29/49082 , Y10T29/49099
摘要： There are provided a resistor and a method of fabricating the same. The resistor includes: a substrate; a lower resistant material layer formed on the upper portion of the substrate; an insulating layer to be stacked on the upper portion of the lower resistant material layer; an upper resistant material layer to be stacked on the upper portion of the insulating layer; and two penetration parts vertically penetrating through the insulating layer, wherein the penetration part is filled with a resistant material having the same component as that of the lower resistant material layer and the upper resistant material layer to electrically connect the upper resistant material layer to the lower resistant material layer.
摘要翻译：提供了一种电阻器及其制造方法。电阻器包括：基板; 在所述基板的上部形成有较低阻力的材料层; 绝缘层，堆叠在下阻抗材料层的上部; 层叠在绝缘层的上部的上部电阻材料层; 和穿过绝缘层的两个穿透部分，其中穿透部分填充有与下阻力材料层和上阻力材料层具有相同成分的电阻材料，以将上部阻力材料层与下部电阻材料层电连接耐材料层。

10. 发明申请

US20110273266A1 Resistor having parallel structure and method of fabricating the same 有权
标题翻译：具有平行结构的电阻器及其制造方法
公开(公告)号：US20110273266A1
公开(公告)日：2011-11-10
申请号：US12923574
申请日：2010-09-28
申请人： Mi Jin Park , Young Do Kweon , Jin Gu Kim
发明人： Mi Jin Park , Young Do Kweon , Jin Gu Kim
IPC分类号： H01C1/012 , H01C17/06
CPC分类号： H01C7/003 , H01C1/01 , H01C7/06 , Y10T29/49082 , Y10T29/49099
摘要： There are provided a resistor and a method of fabricating the same. More particularly, there are provided a resistor having a parallel structure capable of easily implementing a resistance value when forming a resistor directly on a wafer during a wafer process, and a method of fabricating the same.The resistor includes: a substrate; a lower resistant material layer formed on the upper portion of the substrate; an insulating layer to be stacked on the upper portion of the lower resistant material layer; an upper resistant material layer to be stacked on the upper portion of the insulating layer; and two penetration parts vertically penetrating through the insulating layer, wherein the penetration part is filled with a resistant material having the same component as that of the lower resistant material layer and the upper resistant material layer to electrically connect the upper resistant material layer to the lower resistant material layer.
摘要翻译：提供了一种电阻器及其制造方法。更具体地说，提供了一种具有平行结构的电阻器及其制造方法，该并联结构能够在晶片工艺期间直接在晶片上形成电阻时容易地实现电阻值。电阻器包括：基板; 在所述基板的上部形成有较低阻力的材料层; 绝缘层，堆叠在下阻抗材料层的上部; 层叠在绝缘层的上部的上部电阻材料层; 和穿过绝缘层的两个穿透部分，其中穿透部分填充有与下阻力材料层和上阻力材料层具有相同成分的电阻材料，以将上部阻力材料层与下部电阻材料层电连接耐材料层。

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