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1. 发明授权

US07646603B2 Noise-reducing attachment apparatus for heat exchanger door of an electronics rack of a data center 失效
标题翻译：数据中心电子机架的换热器门减噪装置
公开(公告)号：US07646603B2
公开(公告)日：2010-01-12
申请号：US12030484
申请日：2008-02-13
申请人： Seth E. Bard , Robert N. Boyes, Jr. , Gerard F. Muenkel , Matthew A. Nobile
发明人： Seth E. Bard , Robert N. Boyes, Jr. , Gerard F. Muenkel , Matthew A. Nobile
IPC分类号： H05K7/20 , F28D15/00 , G10K11/04
CPC分类号： H05K7/20181 , H05K7/20745 , H05K7/20754
摘要： A noise-reducing attachment apparatus for a heat exchanger door is provided for facilitating attenuation of noise emanating from an electronics rack. The apparatus includes a frame structure configured to coupled to the heat exchanger door. The door includes in air opening and air-to-liquid heat exchanger, and air passing through the air opening also passes across the heat exchanger. The air opening facilitates passage of external air through the electronics rack. The frame structure defines in part an airflow channel through the apparatus, wherein air passing through the air opening also passes through the airflow channel when the apparatus is operatively coupled to the door. An acoustically absorptive material, which is coupled to the frame structure and at least partially defines the airflow opening through the apparatus, is selected and positioned to attenuate noise emanating from the electronics rack when the apparatus is coupled to the heat exchanger door.
摘要翻译：提供了一种用于热交换器门的降噪附件装置，用于促进从电子机架发出的噪声的衰减。该装置包括构造成联接到热交换器门的框架结构。门包括在空气开口和空气对液体热交换器中，并且通过空气开口的空气也穿过热交换器。空气开口便于外部空气通过电子机架。框架结构部分地限定穿过设备的气流通道，其中当设备可操作地联接到门时，通过空气开口的空气也通过气流通道。耦合到框架结构并且至少部分地限定通过设备的气流开口的吸声材料被选择和定位成当设备耦合到热交换器门时，衰减从电子机架排出的噪声。

2. 发明授权

US07644631B1 Electronics cabinet acoustical and thermal test device 失效
标题翻译：电子柜声学和热测试装置
公开(公告)号：US07644631B1
公开(公告)日：2010-01-12
申请号：US12351297
申请日：2009-01-09
申请人： Seth E. Bard , Robert N. Boyes, Jr. , Ethan E. Cruz , Matthew A. Nobile
发明人： Seth E. Bard , Robert N. Boyes, Jr. , Ethan E. Cruz , Matthew A. Nobile
IPC分类号： G01F1/00
CPC分类号： G01M99/002
摘要： An electronics component cabinet cover test device includes a housing that defines a test apparatus provided with first and second openings. A cover member is mounted to one of the openings, and an air moving device is arranged in the test apparatus. The air moving device includes an air inlet and an air outlet and generates airflow within the test apparatus. A sensor capable of measuring a characteristic of the airflow is mounted within the test apparatus. An airflow impedance device mounted to the inlet or the outlet of the air moving device. The airflow impedance device is configured to simulate an airflow obstruction. A controller establishes a flow rate of air from the air moving device and receives airflow data corresponding to the characteristic of the airflow from the sensor to determine one of an acoustical performance characteristic and a thermal performance characteristic of the cover member.
摘要翻译：电子部件柜盖测试装置包括限定具有第一和第二开口的测试装置的壳体。一个盖构件安装在一个开口上，并且空气移动装置设置在测试装置中。空气移动装置包括空气入口和空气出口，并在测试装置内产生气流。能够测量气流特性的传感器安装在测试装置内。安装在空气移动装置的入口或出口的气流阻抗装置。气流阻抗装置被配置为模拟气流阻塞。控制器建立来自空气移动装置的空气流量，并接收与来自传感器的气流特性对应的气流数据，以确定盖构件的声学性能特性和热性能特性之一。

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