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    • 2. 发明授权
    • Multilayer-structured bolometer and method of fabricating the same
    • 多层结构测辐射热计及其制造方法
    • US07667202B2
    • 2010-02-23
    • US12182456
    • 2008-07-30
    • Sang Hoon CheonHo Jun RyuWoo Seok YangSeong Mok ChoByoung Gon YuChang Auck Choi
    • Sang Hoon CheonHo Jun RyuWoo Seok YangSeong Mok ChoByoung Gon YuChang Auck Choi
    • G01J5/20
    • G01J5/20G01J5/02G01J5/023
    • Provided are a multilayer-structured bolometer and a method of fabricating the same. In the multilayer-structured bolometer, the number of support arms supporting the body of a sensor structure is reduced to one, and two electrodes are formed on the one support arm. Thus, the sensor structure is electrically connected with a substrate through the only one support arm. According to the multilayer-structured bolometer and method of fabricating the bolometer, the thermal conductivity of the sensor structure is considerably reduced to remarkably improve sensitivity to temperature, and also the pixel size of the bolometer is reduced to obtain high-resolution thermal images. In addition, the multilayer-structured bolometer can have a high fill-factor due to a sufficiently large infrared-absorbing layer, and thus can improve infrared absorbance.
    • 提供一种多层结构的测辐射热计及其制造方法。 在多层结构的测辐射热计中,支撑传感器结构的主体的支撑臂的数量减少到一个,并且在一个支撑臂上形成两个电极。 因此,传感器结构通过仅一个支撑臂与基板电连接。 根据多层结构的测辐射热计和制造测辐射热计的方法,传感器结构的导热性显着降低,显着提高了对温度的敏感性,还减小了测辐射热计的像素尺寸以获得高分辨率的热图像。 此外,由于具有足够大的红外线吸收层,多层结构的测辐射热计可以具有高的填充因子,因此可以提高红外吸收。
    • 7. 发明申请
    • BOLOMETER STRUCTURE, INFRARED DETECTION PIXEL EMPLOYING BOLOMETER STRUCTURE, AND METHOD OF FABRICATING INFRARED DETECTION PIXEL
    • 透镜结构,使用红外线检测像素的BOLOMETER结构,以及制作红外检测像素的方法
    • US20100148067A1
    • 2010-06-17
    • US12507372
    • 2009-07-22
    • Sang Hoon CHEONHo Jun RyuWoo Seok YangSeong Mok ChoByoung Gon YuChang Auck Choi
    • Sang Hoon CHEONHo Jun RyuWoo Seok YangSeong Mok ChoByoung Gon YuChang Auck Choi
    • G01J5/00C23F1/00
    • G01J5/20G01J5/02G01J5/022G01J5/024
    • Provided are a bolometer structure, an infrared detection pixel employing the bolometer structure, and a method of fabricating the infrared detection pixel.The infrared detection pixel includes a substrate including a read-out integrated circuit (ROIC) and on which a reflection layer for reflecting infrared light is stacked, a bolometer structure formed to be spaced apart from the substrate and including a temperature-sensitive resistive layer, a first metal layer formed in a pattern on one surface of the temperature-sensitive resistive layer, a second metal layer formed in a pattern complementary to the pattern of the first metal layer on the other surface of the temperature-sensitive resistive layer in order to complementarily absorb infrared light, and an insulating layer formed between the temperature-sensitive resistive layer and the first metal layer, and a metal pad receiving a change in resistance of the temperature-sensitive resistive layer according to infrared light absorbed by the first metal layer and the second metal layer from the second metal layer, and transferring the change in resistance to the ROIC.Thus, it is possible to improve responsivity, and implement a simple bolometer structure robust against stress. Consequently, process yield can be improved, and the volume, weight, price, etc., of application products can be reduced by reducing the volume of a bolometer structure.
    • 提供了一种测辐射热计结构,采用测辐射热计结构的红外检测像素,以及制造红外检测像素的方法。 红外线检测像素包括:基板,包括读出集成电路(ROIC),层叠用于反射红外光的反射层,形成为与基板间隔开并包括温度敏感电阻层的测辐射热计结构, 在温度敏感电阻层的一个表面上以图案形成的第一金属层,第二金属层,以与第一金属层的图案互补的图案形成在第一金属层的图案上,以在该温度敏感电阻层的另一个表面上,以便 互补吸收红外光,以及形成在所述耐温电阻层和所述第一金属层之间的绝缘层,以及金属焊盘,所述金属焊盘根据由所述第一金属层吸收的红外光接收所述耐温电阻层的电阻变化,以及 来自第二金属层的第二金属层,并且传递对ROIC的电阻变化。 因此,可以提高响应度,并且实现对应力的鲁棒的简单的测辐射热计结构。 因此,可以提高工艺产量,并且可以通过减小测辐射热计结构的体积来减少应用产品的体积,重量,价格等。