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1. 发明申请

US20080185128A1 Flat Plate-Type Heat Pipe 审中-公开
标题翻译：平板式热管
公开(公告)号：US20080185128A1
公开(公告)日：2008-08-07
申请号：US11815364
申请日：2006-01-10
申请人： Seok Hwan Moon , Gunn Hwang , Sang Choon Ko , Sung Weon Kang , Chang Auck Choi
发明人： Seok Hwan Moon , Gunn Hwang , Sang Choon Ko , Sung Weon Kang , Chang Auck Choi
IPC分类号： F28D15/02
CPC分类号： F28D15/046 , F28D15/0233 , F28F1/022
摘要： Provided is a flat plate-type heat pipe formed of a flat pipe having a predetermined through-hole formed therein and a plurality of grooves extending from an inner surface of the through-hole in a longitudinal direction so that, while the interior of the heat pipe is in a vacuum state, heat in the heat pipe is discharged to the exterior due to a phase change of between liquid and gaseous states of working fluid and the working fluid flows by a capillary force produced from the plurality of grooves, whereby it is possible to obtain a strong capillary force and an excellent cooling effect while it is manufactured through a simple process.
摘要翻译：本发明提供一种平面型热管，其由具有形成在其中的预定通孔的扁平管形成，以及沿着纵向方向从通孔的内表面延伸的多个槽，使得在热的内部管处于真空状态，由于工作流体的液态和气态之间的相变，热管中的热量被排出到外部，并且工作流体由多个槽产生的毛细管力流动，由此可以通过简单的工艺制造而获得强的毛细管力和优异的冷却效果。

2. 发明授权

US07971633B2 Loop type micro heat transport device 有权
标题翻译：环型微型热输送装置
公开(公告)号：US07971633B2
公开(公告)日：2011-07-05
申请号：US11577233
申请日：2005-12-09
申请人： Seok Hwan Moon , Gunn Hwang , Sung Weon Kang , Chang Auck Choi
发明人： Seok Hwan Moon , Gunn Hwang , Sung Weon Kang , Chang Auck Choi
IPC分类号： H05K7/20
CPC分类号： H05K7/20336 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.
摘要翻译：本发明提供一种环型微热输送装置，其特征在于，具有：下板，其具有用于在其上表面存储工作流体的储存器，与所述储存器间隔开的蒸发部，蒸发所述工作流体;以及冷凝部，蒸发部分以及与所述下板的上表面接合并形成在与所述蒸发部和所述冷凝部对应的位置的上板，并且包括具有蒸气管的蒸气空间，蒸发部蒸发的蒸汽通过所述蒸气管路被输送到所述蒸发部冷凝部件，其中工作流体循环通过储存器，蒸发部件和冷凝部件。因此，由于其简单的结构有助于使制造简单，并且提高冷却性能并且能够进行长距离的热输送，因此可以显着提高生产率。

3. 发明申请

US20070256814A1 Loop Type Micro Heat Transport Device 有权
标题翻译：环型微型传热装置
公开(公告)号：US20070256814A1
公开(公告)日：2007-11-08
申请号：US11577233
申请日：2005-12-09
申请人： Seok Hwan Moon , Gunn Hwang , Sung Weon Kang , Chang Auck Choi
发明人： Seok Hwan Moon , Gunn Hwang , Sung Weon Kang , Chang Auck Choi
IPC分类号： G06F1/20
CPC分类号： H05K7/20336 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.
摘要翻译：本发明提供一种环型微热输送装置，其特征在于，具有：下板，其具有用于在其上表面存储工作流体的储存器，与所述储存器间隔开的蒸发部，蒸发所述工作流体;以及冷凝部，蒸发部分以及与所述下板的上表面接合并形成在与所述蒸发部和所述冷凝部对应的位置的上板，并且包括具有蒸气管的蒸气空间，蒸发部蒸发的蒸汽通过所述蒸气管路被输送到所述蒸发部冷凝部件，其中工作流体循环通过储存器，蒸发部件和冷凝部件。因此，由于其简单的结构有助于使制造简单，并且提高冷却性能并且能够进行长距离的热输送，因此可以显着提高生产率。

4. 发明授权

US08261617B2 Micro piezoresistive pressure sensor and manufacturing method thereof 有权
标题翻译：微压阻式压力传感器及其制造方法
公开(公告)号：US08261617B2
公开(公告)日：2012-09-11
申请号：US12745745
申请日：2008-04-21
申请人： Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
发明人： Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
IPC分类号： G01L9/06 , B23P17/04
CPC分类号： G01L9/0042 , Y10T29/42 , Y10T29/49
摘要： A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.
摘要翻译：提供一种微型半导体型压力传感器及其制造方法。微型半导体型压力传感器通过蚀刻衬底的空腔形成区域以形成多个沟槽来实现，通过热氧化工艺氧化多个沟槽以形成空腔形成氧化物层，形成膜在形成空腔的氧化物层和衬底的上部上形成一层形成材料层，在膜形成材料层中形成多个蚀刻孔，通过多个蚀刻孔去除腔形成氧化物层，以形成埋入腔在所述基板中，在所述膜形成材料层的上部形成膜增强层，以形成用于封闭所述空腔的膜，并且在所述膜的上部形成由压阻材料制成的敏感膜。

5. 发明申请

US20100251826A1 MICRO PIEZORESISTIVE PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF 有权
标题翻译：微型PIEZORESISTIVE压力传感器及其制造方法
公开(公告)号：US20100251826A1
公开(公告)日：2010-10-07
申请号：US12745745
申请日：2008-04-21
申请人： Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
发明人： Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
IPC分类号： G01L9/06 , H01L41/22
CPC分类号： G01L9/0042 , Y10T29/42 , Y10T29/49
摘要： A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.
摘要翻译：提供一种微型半导体型压力传感器及其制造方法。微型半导体型压力传感器通过蚀刻衬底的空腔形成区域以形成多个沟槽来实现，通过热氧化工艺氧化多个沟槽以形成空腔形成氧化物层，形成膜在形成空腔的氧化物层和衬底的上部上形成一层形成材料层，在膜形成材料层中形成多个蚀刻孔，通过多个蚀刻孔去除腔形成氧化物层，以形成埋入腔在所述基板中，在所述膜形成材料层的上部形成膜增强层，以形成用于封闭所述空腔的膜，并且在所述膜的上部形成由压阻材料制成的敏感膜。

6. 发明申请

US20090188110A1 MICRO HEAT PIPE WITH POLIGONAL CROSS-SECTION MANUFACTURED VIA EXTRUSION OR DRAWING 审中-公开
标题翻译：微型热管，通过挤压或拉拔制造出具有极性交叉部分
公开(公告)号：US20090188110A1
公开(公告)日：2009-07-30
申请号：US12414595
申请日：2009-03-30
申请人： Seok Hwan Moon , Ho Gyeong Yun , Sang Choon Ko , Gunn Hwang , Tae Goo Choy , Chi Hoon Jun , Youn Tae Kim
发明人： Seok Hwan Moon , Ho Gyeong Yun , Sang Choon Ko , Gunn Hwang , Tae Goo Choy , Chi Hoon Jun , Youn Tae Kim
IPC分类号： B21D53/02
CPC分类号： B23P15/26 , B21C23/085 , B21C37/151 , B21C37/155 , B23P2700/09 , F28D15/0233 , F28D2015/0225 , F28F1/022 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A method for fabricating a metal micro heat pipe with a polygonal cross-section to allow working fluid to flow by capillary force generated at edges of the polygonal of the micro heat pipe. The polygonal cross-section is formed of a single metal layer via a single drawing process. The micro heat pipe is formed of a single metal plate.
摘要翻译：一种用于制造具有多边形横截面的金属微热管的方法，以允许工作流体通过在微热管的多边形的边缘处产生的毛细管力流动。多边形横截面通过单个拉丝工艺由单个金属层形成。微热管由单个金属板形成。

7. 发明申请

US20100050771A1 CAPACITIVE ACCELEROMETER 有权
标题翻译：电容式加速度计
公开(公告)号：US20100050771A1
公开(公告)日：2010-03-04
申请号：US12517068
申请日：2007-12-05
申请人： Chang-Han Je , Gunn Hwang , Sung-Hae Jung , Myung-Lae Lee , Chang-Auck Choi
发明人： Chang-Han Je , Gunn Hwang , Sung-Hae Jung , Myung-Lae Lee , Chang-Auck Choi
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P15/0802
摘要： A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.
摘要翻译：常规的电容加速度计在减小感测电极和参考电极之间的距离方面具有局限性，并且需要一种复杂的过程和用于校正由过程误差引起的间隙差异的单独方法。然而，本发明的电容加速度计具有高的灵敏度，可以通过在参考电极和感测电极之间保持非常窄的距离来简单地制造，并且可以使得不需要通过去除或大幅度地减少功能性来单独校正每个制造的加速度计差异由于过程错误。

8. 发明授权

US08359758B2 Circuit for calculating a three-dimensional inclination angle 有权
标题翻译：用于计算三维倾斜角的电路
公开(公告)号：US08359758B2
公开(公告)日：2013-01-29
申请号：US12672997
申请日：2008-04-15
申请人： Sung Sik Lee , Myung Lae Lee , Chang Han Je , Gunn Hwang , Chang Auck Choi
发明人： Sung Sik Lee , Myung Lae Lee , Chang Han Je , Gunn Hwang , Chang Auck Choi
IPC分类号： G01C9/00
CPC分类号： G01C9/00 , G01C9/06
摘要： A three-dimensional inclination angle calculation circuit is provided. The three-dimensional inclination angle calculation circuit includes: X-axis, Y-axis, and Z-axis vibration sensors which change X-axis, Y-axis, and Z-axis electrostatic capacitances according to three-dimensional positions of a measured plane with respect to a reference plane, respectively; X-axis, Y-axis, and Z-axis position value acquisition units which acquire X-axis, Y-axis, and Z-axis position values corresponding to the X-axis, Y-axis, and Z-axis electrostatic capacitances, respectively; and an inclination angle calculation unit which calculates an inclination angle of the measured plane with respect to the reference plane based on the X-axis, Y-axis, and Z-axis position values. Accordingly, it is possible to very easily calculate an inclination angle according to a three-dimensional position of a to-be-measured apparatus by using an existing vibration sensor.
摘要翻译：提供三维倾斜角计算电路。三维倾斜角计算电路包括：根据测量平面的三维位置改变X轴，Y轴和Z轴静电电容的X轴，Y轴和Z轴振动传感器分别相对于参考平面; 获取对应于X轴，Y轴和Z轴静电电容的X轴，Y轴和Z轴位置值的X轴，Y轴和Z轴位置值获取单元，分别; 以及倾斜角计算单元，其基于X轴，Y轴和Z轴位置值计算测量平面相对于参考平面的倾斜角度。因此，通过使用现有的振动传感器，可以非常容易地计算出被测量装置的三维位置的倾斜角度。

9. 发明授权

US08113054B2 Capacitive accelerometer 有权
标题翻译：电容式加速度计
公开(公告)号：US08113054B2
公开(公告)日：2012-02-14
申请号：US12517068
申请日：2007-12-05
申请人： Chang-Han Je , Gunn Hwang , Sung-Hae Jung , Myung-Lae Lee , Chang-Auck Choi
发明人： Chang-Han Je , Gunn Hwang , Sung-Hae Jung , Myung-Lae Lee , Chang-Auck Choi
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P15/0802
摘要： A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.
摘要翻译：常规的电容加速度计在减小感测电极和参考电极之间的距离方面具有局限性，并且需要一种复杂的过程和用于校正由过程误差引起的间隙差异的单独方法。然而，本发明的电容加速度计具有高的灵敏度，可以通过在参考电极和感测电极之间保持非常窄的距离来简单地制造，并且可以使得不需要通过去除或大幅度地减少功能性来单独校正每个制造的加速度计差异由于过程错误。

10. 发明授权

US08035176B2 MEMS package and packaging method thereof 失效
标题翻译： MEMS封装及其封装方法
公开(公告)号：US08035176B2
公开(公告)日：2011-10-11
申请号：US12517557
申请日：2007-07-25
申请人： Sung-Hae Jung , Myung-Lae Lee , Gunn Hwang , Chang-Kyu Kim , Chang-Han Je , Chang-Auck Choi
发明人： Sung-Hae Jung , Myung-Lae Lee , Gunn Hwang , Chang-Kyu Kim , Chang-Han Je , Chang-Auck Choi
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： B81C1/0023 , B81B2207/012 , B81B2207/096 , B81C2203/0118 , H01L2224/13
摘要： Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS structures, first sealing parts formed at an edge of the substrate, and connectors formed on the first pad electrodes and the first sealing parts; and a MEMS driving electronic device including second pad electrodes and second sealing parts respectively corresponding to the first pad electrodes and the first sealing parts to be sealed with and bonded to the MEMS device through the connectors to form an air gap having a predetermined width.
摘要翻译：提供了微机电系统（MEMS）封装以及封装MEMS封装的方法。 MEMS封装包括：包括形成在衬底上的MEMS结构的MEMS器件，驱动MEMS结构的第一焊盘电极，形成在衬底边缘的第一密封部分和形成在第一焊盘电极和第一密封部分上的连接器; 以及MEMS驱动电子器件，其包括分别对应于第一焊盘电极和第一密封部分的第二焊盘电极和第二密封部分，以通过连接器密封并结合到MEMS器件，以形成具有预定宽度的气隙。

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