专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20170144246A1 APPARATUS FOR THE MATERIAL-BONDED CONNECTION OF CONNECTION PARTNERS OF A POWER-ELECTRONICS COMPONENT 审中-公开
公开(公告)号：US20170144246A1
公开(公告)日：2017-05-25
申请号：US15356655
申请日：2016-11-20
申请人： Semikron Elektronik GmbH & Co., KG
发明人： Ingo BOGEN , Heiko BRAML , Christian GÖBL , Ulrich SAGEBAUM , Jürgen WINDISCHMANN
IPC分类号： B23K20/00 , B23K20/10 , B23K20/26 , B23K20/02
CPC分类号： B23K20/002 , B23K20/023 , B23K20/10 , B23K20/26 , H01L24/32 , H01L24/50 , H01L24/75 , H01L24/79 , H01L24/83 , H01L24/86 , H01L2224/32227 , H01L2224/73269 , H01L2224/75251 , H01L2224/75252 , H01L2224/75314 , H01L2224/75315 , H01L2224/75316 , H01L2224/7532 , H01L2224/75343 , H01L2224/75704 , H01L2224/7598 , H01L2224/79251 , H01L2224/79252 , H01L2224/79314 , H01L2224/79316 , H01L2224/7932 , H01L2224/79343 , H01L2224/83203 , H01L2224/8384 , H01L2224/86203 , H01L2924/00014 , H01L2924/00012
摘要： A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.

2. 发明申请

US20180233602A1 SEMICONDUCTOR DIODE AND ELECTRONIC CIRCUIT ARRANGEMENT HEREWITH 审中-公开
公开(公告)号：US20180233602A1
公开(公告)日：2018-08-16
申请号：US15866948
申请日：2018-01-10
申请人： SEMIKRON ELEKTRONIK GMBH & CO. KG
发明人： Christian GÖBL , Boris Rosensaft , Uwe Schilling , Wolfgang-Michael Schulz , Sven Teuber
IPC分类号： H01L29/872 , H01L29/06
CPC分类号： H01L29/872 , H01L29/0649 , H01L29/0657 , H01L29/8611 , H01L2224/40225
摘要： A semiconductor diode includes a semiconductor body, having a first main area formed from an inner area, on which a first contact layer is arranged, and from an edge area, a current path from the first contact layer to a second contact layer arranged on a second main area situated opposite the first main area, wherein the semiconductor diode, by virtue of the configuration of the first contact layer or of the semiconductor body, is formed such that upon current flow, such current flows through a current path having the greatest heating per unit volume, and which proceeds from a further partial area of the inner area, wherein the further partial area is arranged on the other side of a boundary of an inner partial area of the inner area, said inner partial area preferably being arranged centrally, with respect to an outer partial area adjoining said inner partial area.

3. 发明申请

US20170221785A1 Power semiconductor module having a pressure application body and arrangement therewith 有权
公开(公告)号：US20170221785A1
公开(公告)日：2017-08-03
申请号：US15422274
申请日：2017-02-01
申请人： Semikron Elektronik GmbH & Co., KG
发明人： Christian GÖBL , Clemens VENNEBUSCH
IPC分类号： H01L23/10 , H01L23/40 , H01L23/00 , H01L23/049 , H01L23/495 , H01L25/065
CPC分类号： H01L23/10 , H01L23/049 , H01L23/053 , H01L23/4006 , H01L23/4951 , H01L23/49517 , H01L23/49531 , H01L23/49568 , H01L23/49575 , H01L24/48 , H01L25/0655 , H01L2023/4025 , H01L2023/405 , H01L2023/4087 , H01L2224/48245 , H01L2224/48472 , H01L2924/00014 , H05K7/209 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要： A power semiconductor module having a pressure application body, a circuit carrier, which is embodied with a first conductor track, a power semiconductor element arranged thereon and an internal connecting device, and also having a housing which is embodied with a guide device arranged therein, with a connecting element. The connecting element is embodied as a bolt with first and second end sections and an intermediate section therebetween, wherein the first end section rests on the circuit carrier and is electrically conductively connected thereto; the second end section projects out of the housing through a cutout; and wherein the connecting element is arranged in the assigned guide device. The pressure application body has a first rigid partial body and a second elastic partial body, wherein the second partial body protrudes out of the first partial body in the direction of the housing.

4. 发明申请

US20160120038A1 Method for producing a switching device with a moisture-tight and electrically insulating cover and for producing an arrangement therewith 有权
标题翻译：一种具有防潮和电绝缘盖的开关装置的制造方法以及用于制造其的装置
公开(公告)号：US20160120038A1
公开(公告)日：2016-04-28
申请号：US14924679
申请日：2015-10-27
申请人： Semikron Elektronik GmbH & Co., KG
发明人： Christian GÖBL , Heinrich HEILBRONNER
IPC分类号： H05K3/32 , H05K3/10
CPC分类号： H05K3/32 , H01L23/3121 , H01L23/367 , H01L23/49811 , H01L23/49833 , H01L23/4985 , H01L24/50 , H01L24/86 , H01L25/07 , H01L2224/32225 , H01L2224/73269 , H01L2224/8384 , H05K3/10 , H01L2924/00014
摘要： A method for producing a power electronic switching device comprising a substrate, having a power semiconductor component arranged thereon; a connection device, and terminal devices. The method comprises: Providing the substrate with an insulation ply and conductor tracks electrically insulated from one another, wherein a power semiconductor component is arranged on a conductor track and is cohesively connected thereto; Arranging the connection device embodied as a film stack; Arranging a thin pressure- and temperature-resistant and moisture-blocking insulation layer along a surface contour of the connection device and comprising a covering section and an overlap section, which overlaps the connection device circumferentially and covers the substrate in a circumferential contact region; Cohesively connecting the connection device to the substrate, whereby the connection device connects the switching device in a circuit-conforming manner internally; Connecting the covering section to the connection device; Connecting the overlap section to the contact region.
摘要翻译：一种电力电子开关器件的制造方法，其特征在于，具有配置有功率半导体元件的基板，连接装置和终端装置。该方法包括：为衬底提供彼此电绝缘的绝缘层和导体轨道，其中功率半导体部件布置在导体轨道上并与其粘结连接; 布置作为胶片堆叠的连接装置; 沿着连接装置的表面轮廓布置薄的耐压和耐温和防潮的绝缘层，并且包括覆盖部分和重叠部分，所述覆盖部分和重叠部分周向地与连接装置重叠并且在周向接触区域中覆盖基板; 将连接装置与衬底粘合地连接，由此连接装置在内部以电路符合的方式连接开关装置; 将覆盖部分连接到连接装置; 将重叠部分连接到接触区域。

5. 发明申请

US20150069599A1 Power electronic switching device and assembly 有权
标题翻译：电力电子开关装置及组装
公开(公告)号：US20150069599A1
公开(公告)日：2015-03-12
申请号：US14120385
申请日：2014-05-14
申请人： Semikron Elektronik GmbH & Co., KG
发明人： Christian GÖBL
IPC分类号： H01L23/367 , H01L23/433 , H01L23/31
CPC分类号： H01L23/367 , H01L23/3107 , H01L23/3735 , H01L23/433 , H01L23/4985 , H01L24/72 , H01L25/072 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： A switching device having a substrate, a power semiconductor component, a connecting device, load connection devices and a pressure device. Substrate has electrically insulated conductor tracks. A power semiconductor component is arranged on a conductor track. Connecting device is formed as a film composite having an electrically conductive film and an electrically insulating film, and has first and second main surfaces. Switching device is connected in an internally circuit-conforming manner by connecting device. The pressure device has a pressure body with a first recess, a pressure element being arranged so that it projects out of the recess, wherein the pressure element presses onto a section of the second main surface of film composite and, in this case, the section is arranged within the surface of the power semiconductor component in projection along the normal direction of the power semiconductor component.
摘要翻译：具有基板，功率半导体部件，连接装置，负载连接装置和压力装置的开关装置。基板具有电绝缘导体轨迹。功率半导体元件布置在导体轨道上。连接装置形成为具有导电膜和电绝缘膜的膜复合体，并且具有第一和第二主表面。开关器件通过连接器件以内部电路连接方式连接。压力装置具有带有第一凹部的压力体，压力元件布置成使其从凹部突出，其中压力元件压在膜复合材料的第二主表面的一部分上，并且在这种情况下，沿着功率半导体部件的法线方向突出设置在功率半导体部件的表面内。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式