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1. 发明授权

US5088697A Heat treating apparatus 失效
标题翻译：热处理设备
公开(公告)号：US5088697A
公开(公告)日：1992-02-18
申请号：US552897
申请日：1990-07-16
申请人： Seishi Murakami , Kozo Kai , Susumu Kato
发明人： Seishi Murakami , Kozo Kai , Susumu Kato
IPC分类号： C23C14/48 , C23C16/44 , C23C16/458 , C23C16/46 , C23C16/48 , C23F4/00 , C30B25/10 , C30B25/14 , H01L21/00 , H01L21/205 , H01L21/285 , H01L21/302 , H01L21/324
CPC分类号： H01L21/67103 , C23C16/4585 , C23C16/481 , C30B25/10 , C30B25/14
摘要： A susceptor is located in a treating space of a CVD apparatus with a wafer placed in contact with a first surface of a susceptor. The susceptor is heated by a heating source to impart the heat to the wafer. A treating gas is supplied into a treating space and decomposed in a course of a reaction to form a film on the wafer. A guard ring is located on a second surface of the susceptor which is situated around the first surface of the susceptor. The guard ring and wafer are heated by the susceptor in the same way. The surface of the susceptor is substantially not exposed between the guard ring and the wafer and a temperature on the exposed surface of the guard ring and that on the exposed surface of the wafer are nearly equal to each other.
摘要翻译：感受器位于CVD装置的处理空间中，其中晶片与基座的第一表面接触。感受器由加热源加热以将热量传递给晶片。将处理气体供应到处理空间中并在反应过程中分解，以在晶片上形成膜。保护环位于基座的第二表面上，该基座位于基座的第一表面周围。保护环和晶片以相同的方式被感受器加热。基座的表面基本上不暴露在保护环和晶片之间，并且保护环的暴露表面上的温度和晶片的暴露表面上的温度几乎相等。

2. 发明授权

US09070728B2 Method of lowering temperature of substrate table, computer-readable storage medium, and substrate processing system 有权
标题翻译：降低衬底台，计算机可读存储介质和衬底处理系统温度的方法
公开(公告)号：US09070728B2
公开(公告)日：2015-06-30
申请号：US12958955
申请日：2010-12-02
申请人： Kenichi Kobayashi , Youichi Nakayama , Kozo Kai , Kenji Shirasaka
发明人： Kenichi Kobayashi , Youichi Nakayama , Kozo Kai , Kenji Shirasaka
IPC分类号： F28F7/00 , H01L21/677 , C23C16/46 , H01L21/67
CPC分类号： H01L21/67745 , C23C16/46 , H01L21/67103 , H01L21/67109
摘要： A method of lowering a temperature of a substrate table uses a substrate W processing system including a first substrate table 2b; one or more processing chambers 1b, in each of which the first substrate table 2b is disposed, the processing chamber being configured to perform a predetermined process, with the substrate being placed on the first substrate table 2b; a substrate transfer apparatus 31 configured to transfer the substrate to the processing chamber 1b; a transfer chamber in which the substrate transfer apparatus 31 is disposed; and a second substrate table configured to cool the substrate. The method of lowering a temperature of a substrate table comprises the steps of first transfer in which the substrate W placed on the first substrate table 2b is transferred to the second substrate table by the substrate transfer apparatus 31, and second transfer in which the substrate placed on the second substrate table is transferred to the first substrate table 2b. By repeating the step of first transfer and the step of second transfer, a heat of the first substrate table 2b is absorbed by the substrate W placed on the first substrate table 2b, so that a temperature of the first substrate table 2b is lowered.
摘要翻译：降低衬底台的温度的方法使用包括第一衬底台2b的衬底W处理系统; 一个或多个处理室1b，其中每个处理室1b设置有第一衬底台2b，处理室被配置为执行预定处理，衬底被放置在第一衬底台2b上; 被配置为将衬底转移到处理室1b的衬底传送装置31; 传送室，其中设置有基板传送装置31; 以及被配置为冷却所述基板的第二基板台。降低衬底台的温度的方法包括以下步骤：第一转印，其中放置在第一衬底台2b上的衬底W通过衬底转移装置31转移到第二衬底台，第二次转印，其中衬底放置在第二衬底台上转移到第一衬底台2b。通过重复第一次转印步骤和第二次转印步骤，第一衬底台2b的热量被放置在第一衬底台2b上的衬底W吸收，使得第一衬底台2b的温度降低。

3. 发明申请

US20110114298A1 METHOD OF LOWERING TEMPERATURE OF SUBSTRATE TABLE, COMPUTER-READABLE STORAGE MEDIUM, AND SUBSTRATE PROCESSING SYSTEM 有权
标题翻译：降低基板温度的方法，计算机可读存储介质和基板处理系统
公开(公告)号：US20110114298A1
公开(公告)日：2011-05-19
申请号：US12958955
申请日：2010-12-02
申请人： Kenichi KOBAYASHI , Youichi Nakayama , Kozo Kai , Kenji Shirasaka
发明人： Kenichi KOBAYASHI , Youichi Nakayama , Kozo Kai , Kenji Shirasaka
IPC分类号： F28F7/00
CPC分类号： H01L21/67745 , C23C16/46 , H01L21/67103 , H01L21/67109
摘要： A method of lowering a temperature of a substrate table uses a substrate W processing system including a first substrate table 2b; one or more processing chambers 1b, in each of which the first substrate table 2b is disposed, the processing chamber being configured to perform a predetermined process, with the substrate being placed on the first substrate table 2b; a substrate transfer apparatus 31 configured to transfer the substrate to the processing chamber 1b; a transfer chamber in which the substrate transfer apparatus 31 is disposed; and a second substrate table configured to cool the substrate. The method of lowering a temperature of a substrate table comprises the steps of first transfer in which the substrate W placed on the first substrate table 2b is transferred to the second substrate table by the substrate transfer apparatus 31, and second transfer in which the substrate placed on the second substrate table is transferred to the first substrate table 2b. By repeating the step of first transfer and the step of second transfer, a heat of the first substrate table 2b is absorbed by the substrate W placed on the first substrate table 2b, so that a temperature of the first substrate table 2b is lowered.
摘要翻译：降低衬底台的温度的方法使用包括第一衬底台2b的衬底W处理系统; 一个或多个处理室1b，其中每个处理室1b设置有第一衬底台2b，处理室被配置为执行预定处理，衬底被放置在第一衬底台2b上; 被配置为将衬底转移到处理室1b的衬底传送装置31; 传送室，其中设置有基板传送装置31; 以及被配置为冷却所述基板的第二基板台。降低衬底台的温度的方法包括以下步骤：第一转印，其中放置在第一衬底台2b上的衬底W通过衬底转移装置31转移到第二衬底台，第二次转印，其中衬底放置在第二衬底台上转移到第一衬底台2b。通过重复第一次转印步骤和第二次转印步骤，第一衬底台2b的热量被放置在第一衬底台2b上的衬底W吸收，使得第一衬底台2b的温度降低。

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