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1. 发明授权

US5604513A Serial sampling video signal driving apparatus with improved color rendition 失效
标题翻译：具有改进的色彩再现的串行采样视频信号驱动装置
公开(公告)号：US5604513A
公开(公告)日：1997-02-18
申请号：US203620
申请日：1994-02-28
申请人： Seiki Takahashi , Hayato Takasago , Toshio Tobita , Hiroaki Ishitani , Takatomo Watanabe , Hiroaki Ideno , Mitiyasu Nounen
发明人： Seiki Takahashi , Hayato Takasago , Toshio Tobita , Hiroaki Ishitani , Takatomo Watanabe , Hiroaki Ideno , Mitiyasu Nounen
IPC分类号： H04N9/64 , G09G3/20 , G09G3/36 , H04N9/30 , G09G5/02
CPC分类号： G09G3/2003 , H04N9/30 , G09G3/3607
摘要： A serial sampling video signal driving apparatus receives a plurality of color video signals. A serial sampling video driver samples the color video signals one after the other in cyclic fashion, and provides the sampled values to drive a matrix-type color display. A delay circuit delays one or more of the color video signals at different phases before input to the serial sampling video driver, thereby compensating for differences in sampling times.
摘要翻译：串行采样视频信号驱动装置接收多个彩色视频信号。串行采样视频驱动器以循环方式逐个采样彩色视频信号，并提供采样值以驱动矩阵型彩色显示。在输入到串行采样视频驱动器之前，延迟电路将不同相位的一个或多个彩色视频信号延迟，从而补偿采样时间的差异。

2. 发明授权

US5069745A Process for preparing a combined wiring substrate 失效
标题翻译：制备组合布线基板的方法
公开(公告)号：US5069745A
公开(公告)日：1991-12-03
申请号：US571876
申请日：1990-08-24
申请人： Hirofumi Ohuchida , Eishi Gofuku , Hayato Takasago , Akira Ishizu , Toshio Tobita , Mitsuyuki Takada
发明人： Hirofumi Ohuchida , Eishi Gofuku , Hayato Takasago , Akira Ishizu , Toshio Tobita , Mitsuyuki Takada
IPC分类号： G02F1/1347 , G02F1/1333 , G02F1/1343 , G09F9/30 , G09F9/40 , H01R4/04 , H05K1/14 , H05K1/16 , H05K3/32
CPC分类号： H01R4/04 , G02F1/13336 , H05K1/142 , G02F1/1343 , H05K2203/107 , H05K3/321
摘要： A process for preparing a combined wiring substrate is carried out by bonding with an adhesive agent the end surfaces of the mutually opposing sides of a plurality of substrates each having a pattern of wiring on its major surface, and by connecting electrically parts of the pattern of wiring which oppose each other by interposing the bonding portion.
摘要翻译：用于制备组合布线基板的方法是通过使粘合剂与多个基板的相互相对的侧面的各自具有在其主表面上具有布线图案的端面粘接，并且通过将通过插入接合部分彼此相对的布线。

3. 发明授权

US5113274A Matrix-type color liquid crystal display device 失效
标题翻译：矩阵型彩色液晶显示装置
公开(公告)号：US5113274A
公开(公告)日：1992-05-12
申请号：US362942
申请日：1989-06-08
申请人： Seiki Takahashi , Hayato Takasago
发明人： Seiki Takahashi , Hayato Takasago
IPC分类号： H04N5/66 , G09G3/36 , H04N9/12 , H04N9/30
CPC分类号： G09G3/3607
摘要： A matrix-type color liquid crystal display device comprises display units each comprising each one of red (R), green (G) and blue (B) color pixels arranged in such a manner that R and B pixels on opposite sides of each G pixel belong also to adjacent display units. The R and B signals for that display unit to which the G pixel between R and B pixels of interest belongs are appropriately modified before they are applied to the R and B pixels, whereby the number of required pixels can be reduced.
摘要翻译：矩阵型彩色液晶显示装置包括显示单元，每个显示单元包括红色（R），绿色（G）和蓝色（B））彩色像素中的每一个，排列方式使得每个G像素的相对侧上的R和B像素也属于相邻的显示单元。在将R和B像素应用于R和B像素之前，适当地修改感兴趣的R和B像素之间的G像素所属的显示单元的R和B信号，从而可以减少所需像素的数量。

4. 发明授权

US6104464A Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board 失效
标题翻译：用于液晶显示器的刚性电路板，包括切割以提供对所述板的灵活性
公开(公告)号：US6104464A
公开(公告)日：2000-08-15
申请号：US524567
申请日：1995-09-07
申请人： Kohei Adachi , Toru Kokogawa , Takanori Takaki , Hayato Takasago , Mitsumasa Mori , Atsushi Tanaka
发明人： Kohei Adachi , Toru Kokogawa , Takanori Takaki , Hayato Takasago , Mitsumasa Mori , Atsushi Tanaka
IPC分类号： G02F1/1333 , G02F1/13 , G02F1/1345 , H01L23/538 , H05K1/00 , H05K1/02 , H05K3/00 , H05K3/36
CPC分类号： H05K1/028 , G02F1/13452 , H01L23/5387 , H05K1/0278 , H01L2224/16225 , H01L2224/45144 , H01L2224/48227 , H01L2924/09701 , H01L2924/181 , H05K2201/0191 , H05K2201/09036 , H05K2201/09063 , H05K2201/0909 , H05K2201/09827 , H05K2201/10136 , H05K2203/0228 , H05K2203/302 , H05K3/0061 , H05K3/0064 , H05K3/0067 , H05K3/361 , H05K3/4691
摘要： A drive circuit module comprises a board formed of a hard base material having no flexibility, a circuit pattern formed on the board and having a plurality of input terminals and output terminals supported by a flexible insulation film, and a carrying section for carrying a drive LSI and the like on the circuit pattern; characterized in that the board is provided with at least one cutout on a surface opposite to the surface on which the circuit pattern of the board is formed, thereby making flexible the board in a direction in which the output terminal surface and the carrying section surface are different from each other.
摘要翻译：驱动电路模块包括由不具有柔性的硬质基材形成的板，形成在板上的电路图案，具有由柔性绝缘膜支撑的多个输入端子和输出端子，以及用于承载驱动LSI的承载部分电路图案等; 其特征在于，所述板在与所述基板的电路图案形成的表面相对的表面上设置有至少一个切口，从而使所述板沿着所述输出端子表面和所述承载部分表面是彼此不同。

5. 发明授权

US4943768A Testing device for electrical circuit boards 失效
标题翻译：电路板测试装置
公开(公告)号：US4943768A
公开(公告)日：1990-07-24
申请号：US369142
申请日：1989-06-21
申请人： Kenichi Niki , Tohru Kokogawa , Akira Ishizu , Hayato Takasago
发明人： Kenichi Niki , Tohru Kokogawa , Akira Ishizu , Hayato Takasago
IPC分类号： G01R1/073
CPC分类号： G01R1/07307
摘要： In a testing device for testing electric circuit board having test terminals on the board parallel to each other, conductor strips are arranged in conformity with the test terminals, and a pressing member is provided for pressing the conductor strips on the test terminals.
摘要翻译：在板上测试电路板上测试端子彼此平行的测试装置中，导体条与测试端子一致地设置，并且提供一个按压构件，用于按压测试端子上的导体条。

6. 发明授权

US4643798A Composite and circuit board having conductive layer on resin layer and method of manufacturing 失效
标题翻译：在树脂层上具有导电层的复合电路板和制造方法
公开(公告)号：US4643798A
公开(公告)日：1987-02-17
申请号：US721460
申请日：1985-04-09
申请人： Mitsuyuki Takada , Yoshiyuki Morihiro , Hayato Takasago
发明人： Mitsuyuki Takada , Yoshiyuki Morihiro , Hayato Takasago
IPC分类号： H05K3/12 , H05K3/18 , H05K3/38 , B44C1/22 , C03C15/00
CPC分类号： C23C18/2006 , C23C18/22 , H05K3/185 , H05K3/387 , H05K2201/0209 , H05K2201/0215 , H05K2203/0773 , H05K2203/107
摘要： In manufacturing a composite having a conductive layer on the surface of a resin layer, first the resin layer of a mixture of a resin material and filler elements is formed on a substrate and the resin material of the surface of the resin layer is selectively etched with respect to the filler elements to expose a portion of the filler elements, and then the filler elements, as exposed on the selectively etched surface of the resin layer, are selectively etched with respect to the resin material to form unevenness. Then catalyst nuclei are formed for electroless plating on the selectively etched surface having the unevenness and then a conductive metallic layer is formed by an electroless plating process on the selectively etched surface having unevenness. As a result, a composite of the above described structure is provided.
摘要翻译：在制造在树脂层的表面具有导电层的复合体时，首先在基板上形成树脂材料和填充材料的混合物的树脂层，并且用树脂层表面的树脂材料选择性地蚀刻具有树脂层表面的树脂材料相对于填充元件暴露一部分填充元件，然后暴露在树脂层的选择性蚀刻表面上的填充元素相对于树脂材料被选择性地蚀刻以形成不均匀性。然后在具有不平坦度的选择性蚀刻表面上形成催化剂核以进行化学镀，然后通过在具有凹凸的选择性蚀刻表面上的无电镀处理形成导电金属层。结果，提供了上述结构的复合材料。

7. 发明授权

US4993148A Method of manufacturing a circuit board 失效
标题翻译：制造电路板的方法
公开(公告)号：US4993148A
公开(公告)日：1991-02-19
申请号：US406401
申请日：1989-09-12
申请人： Kohei Adachi , Mitsuyuki Takada , Atsushi Endo , Eishi Gofuku , Hayato Takasago
发明人： Kohei Adachi , Mitsuyuki Takada , Atsushi Endo , Eishi Gofuku , Hayato Takasago
IPC分类号： H01L21/58 , H01L21/60 , H01L23/14 , H01L23/373 , H05K1/02 , H05K1/05 , H05K1/18 , H05K3/10 , H05K3/46
CPC分类号： H01L24/32 , H01L23/142 , H01L23/3736 , H01L24/29 , H01L24/48 , H01L24/83 , H05K1/021 , H01L2224/05644 , H01L2224/2919 , H01L2224/32013 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48644 , H01L2224/73265 , H01L2224/8319 , H01L2224/83805 , H01L2224/8385 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/20752 , H01L2924/351 , H05K1/0206 , H05K1/056 , H05K1/182 , H05K2201/0154 , H05K2201/09745 , H05K2203/049 , H05K3/108 , H05K3/4644 , Y10T29/4913
摘要： A method is provided for forming a circuit board which comprises a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.
摘要翻译：提供一种用于形成电路板的方法，该电路板包括铜板和形成在铜板上的感光聚酰亚胺树脂的绝缘层，绝缘层留下铜板的要安装LSI的表面的暴露部分。在对铜板的露出面施加Au电镀之后，LSI被固定地安装。具有接合焊盘的连接图案通过在绝缘层上的铜电镀形成。接合焊盘和LSI通过Au引线接合在施加在接合焊盘上的Au电镀上连接。

8. 发明授权

US4898805A Method for fabricating hybrid integrated circuit 失效
标题翻译：制造混合集成电路的方法
公开(公告)号：US4898805A
公开(公告)日：1990-02-06
申请号：US224175
申请日：1988-07-25
申请人： Mitsuyuki Takada , Hayato Takasago , Yoichiro Onishi
发明人： Mitsuyuki Takada , Hayato Takasago , Yoichiro Onishi
IPC分类号： H01B1/16 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/18 , H05K3/24 , H05K3/46
CPC分类号： H05K3/246 , H01L21/4846 , H01L21/4867 , H05K1/0306 , H05K1/092 , H05K2201/0347 , H05K3/184 , H05K3/4644
摘要： A method for fabricating a hybrid IC substrate comprises the steps of baking a conductor of a first group on an insulating ceramic substrate, forming an insulating porous active layer including a glass component and a small amount of a metal component having a catalytic action for electroless plating, forming a resist pattern on the active layer by using a photomask, and forming a conductor of a second group by electroless plating on a portion of the active layer not covered with the resist, whereby a portion of the active layer sandwiched between the conductors of the first and second groups is rendered conductive and a portion of the active layer in direct contact with the insulating substrate is maintained as an insulator.
摘要翻译：一种制造混合IC基板的方法包括以下步骤：在绝缘陶瓷基板上烘烤第一组的导体，形成包括玻璃成分和少量金属组分的绝缘多孔活性层，所述金属组分具有用于化学镀的催化作用通过使用光掩模在有源层上形成抗蚀剂图案，并且通过在未被抗蚀剂覆盖的有源层的一部分上通过化学镀形成第二组的导体，由此将有源层的一部分夹在导体之间使第一和第二组导电，并且将与绝缘基板直接接触的有源层的一部分保持为绝缘体。

9. 发明授权

US4854230A Screen printing apparatus 失效
标题翻译：丝网印刷设备
公开(公告)号：US4854230A
公开(公告)日：1989-08-08
申请号：US193222
申请日：1988-05-11
申请人： Kenichi Niki , Tetsuro Makita , Hayato Takasago
发明人： Kenichi Niki , Tetsuro Makita , Hayato Takasago
IPC分类号： B41F15/08 , B41F15/40 , B41F15/44 , H05K3/12
CPC分类号： H05K3/1233 , B41F15/44 , H05K2203/0126
摘要： A screen printing apparatus comprising a screen having an opening or openings of a desired print pattern and having a lower surface being positioned adjacent to a substrate to be printed, and a nonflexible squeegee comprising a cavity for containing a material to be printed on the substrate. The cavity is defined by the interior surfaces of surrounding walls extending generally vertically from the lower extremities at which the squeegee directly contacts the upper surface of the screen. While the squeegee travels with respect to the screen the material to be printed flows from the cavity into the openings of the screen, and thereby onto the substrate. The squeegee may be formed of stainless steel, a ceramic material or a synthetic resin.
摘要翻译：一种丝网印刷设备，包括具有所需打印图案的开口或开口的屏幕，并且具有邻近待印刷的基板定位的下表面;以及非柔性刮板，包括用于容纳待印刷材料的空腔。空腔由围绕壁的内表面限定，该内壁从刮板直接接触屏幕上表面的下端大致垂直地延伸。当刮板相对于筛网移动时，待印刷的材料从空腔流入屏幕的开口，从而流到基板上。刮板可以由不锈钢，陶瓷材料或合成树脂形成。

10. 发明授权

US4783642A Hybrid integrated circuit substrate and method of manufacturing the same 失效
标题翻译：混合集成电路基板及其制造方法
公开(公告)号：US4783642A
公开(公告)日：1988-11-08
申请号：US49261
申请日：1987-05-13
申请人： Mitsuyuki Takada , Yoshiyuki Morihiro , Hayato Takasago
发明人： Mitsuyuki Takada , Yoshiyuki Morihiro , Hayato Takasago
IPC分类号： H01C17/065 , H01L21/70 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/18 , H05K3/24 , H01C1/012
CPC分类号： H05K3/246 , H01C17/065 , H01L21/705 , H05K1/167 , H05K1/0306 , H05K1/092 , H05K2203/0709 , H05K2203/072 , H05K2203/1453 , H05K2203/1461 , H05K3/182 , Y10T29/49099
摘要： A hybrid integrated circuit substrate contains an insulating substrate. On predetermined positions of the upper surface of the substrate, there are formed resistors and activation layers to be in contact with ends of the resistors. On predetermined positions of the upper surfaces of the activation layers, there are formed conductor layers electrically connected with the ends of the resistors.
摘要翻译：混合集成电路基板包含绝缘基板。在基板的上表面的预定位置上，形成有与电阻器端部接触的电阻和激活层。在激活层的上表面的预定位置处，形成与电阻器的端部电连接的导体层。

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