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1. 发明授权

US5661223A Composition of phenolic resin-modified epoxy resin and straight chain polymer 失效
标题翻译：酚醛树脂改性环氧树脂和直链聚合物的组成
公开(公告)号：US5661223A
公开(公告)日：1997-08-26
申请号：US476578
申请日：1995-06-07
申请人： Seiji Oka , Mitsuhiro Nonogaki , Takumi Kikuchi , Takashi Takahama , Hiroyuki Nakajima , Michio Futakuchi
发明人： Seiji Oka , Mitsuhiro Nonogaki , Takumi Kikuchi , Takashi Takahama , Hiroyuki Nakajima , Michio Futakuchi
IPC分类号： C08G59/06 , C08G59/30 , C08G59/32 , C08L63/00 , H05K1/03 , C08L63/02
CPC分类号： C08L63/00 , C08G59/063 , C08G59/30 , C08G59/3218 , H05K1/0326
摘要： A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.
摘要翻译：用于层压体的树脂组合物包含100重量份通过（i）（1）缩水甘油化由溴化双酚A和双酚A或溴化双酚A和甲醛的共混物形成的聚合物的多官能环氧树脂（I）或（2）多官能环氧树脂和双酚A-高级环氧树脂与羟基：环氧当量比为0.05-0.5:1的溴化双酚A反应的混合物和（ii）双酚A-甲醛酚醛树脂，其具有相对于环氧树脂（i），羟基：环氧当量比为0.7-1.2:1的重均分子量为1,000-10,000; 和（II）1-60重量份的直链聚合物（c）如聚（醚）砜，芳族聚酯，苯氧基树脂，聚对苯二甲酸，聚醚酰亚胺或聚苯硫醚。

2. 发明授权

US5091481A Composition of polyepoxy compounds, linear polymer and aromatic diamine 失效
标题翻译：多羟基化合物，线性聚合物和芳族二胺的组合物
公开(公告)号：US5091481A
公开(公告)日：1992-02-25
申请号：US379333
申请日：1989-07-13
申请人： Hiroyuki Nakajima , Takashi Takahama , Fumiyuki Miyamoto , Seiji Oka , Toshio Isooka , Yoshihiro Maruyama , Yasushi Yamamoto
发明人： Hiroyuki Nakajima , Takashi Takahama , Fumiyuki Miyamoto , Seiji Oka , Toshio Isooka , Yoshihiro Maruyama , Yasushi Yamamoto
IPC分类号： B32B15/08 , B32B27/38 , C08G59/32 , C08G59/56 , C08J5/24 , C08L63/00 , H05K1/03
CPC分类号： C08G59/56 , C08G59/3218 , C08L63/00 , H05K1/0353
摘要： A resin composition for laminate, which comprises 100 parts by weight of a composition (B), from 0.5 to 10 parts by weight of dicyandiamide and from 1 to 100 parts by weight of a linear polymer, said composition (B) comprising (i) a composition (A) comprising from 20 to 80 parts by weight of a polyfunctional epoxy compound of the formula: ##STR1## wherein R is H or CH.sub.3 and n is an integer of from 0 to 5, and from 80 to 20 parts by weight of an epoxy compound having two epoxy groups in one molecule, and (ii) an aromatic diamino compound incorporated in the composition (A) in such an amount that its active hydrogen is from 0.3 to 0.8 equivalent per equivalent of terminal epoxy groups.

3. 发明授权

US4882389A Electrical insulating resin 失效
标题翻译：电绝缘树脂
公开(公告)号：US4882389A
公开(公告)日：1989-11-21
申请号：US135078
申请日：1987-12-18
申请人： Makoto Doi , Hiroyukio Nakajima , Fumiyuki Miyamoto , Seiji Oka , Mitsuhiro Nonogaki
发明人： Makoto Doi , Hiroyukio Nakajima , Fumiyuki Miyamoto , Seiji Oka , Mitsuhiro Nonogaki
IPC分类号： C08F279/02 , H05K1/03
CPC分类号： C08F279/02 , H05K1/0326
摘要： A resin having a low dielectric constant obtained by heat-curing 100 parts by weight of a butadiene polymer containing in its polymer chain at least 50 mol% of a 1,2-butadiene unit having a double bond in its side chain and from 10 to 100 parts by weight of a vinyl compound having at least 3 vinyl groups in one molecule in the presence of an organic peroxide. Also disclosed is a resin having flame resistance obtained by heat-curing a blend of an organic peroxide with a composition comprising 100 parts by weight of a butadiene polymer containing in its polymer chain at least 50 mol% of a 1,2-butadiene unit having a double bond in its side chain, from 10 to 100 parts by weight of a vinyl compound having at least 3 vinyl groups in one molecule and at least one member selected from the compounds of the formulas I-IV: ##STR1## wherein X is H or CH.sub.3, Y is Br or Cl, A is --, --o--, --CO--, SO.sub.2, --CH.dbd.CH--, --C(CH.sub.3).sub.2 --or --(CH.sub.2 .sub.a --, ad each of m, n and a is an integer of from 1 to 4, in an amount of from 25 to 100 parts by weight in the case of the formulas I to III and from 25 to 200 parts by weight in the case of the formula IV.
摘要翻译：通过将100重量份的在其聚合物链中含有至少50摩尔％的侧链中具有双键的1,2-丁二烯单元的丁二烯聚合物加热固化而得到的介电常数低的树脂为10〜 100重量份在有机过氧化物存在下，在一个分子中具有至少3个乙烯基的乙烯基化合物。还公开了具有阻燃性的树脂，其通过将有机过氧化物的共混物热固化，所述组合物包含100重量份的在其聚合物链中含有至少50摩尔％的具有至少50摩尔％的1,2-丁二烯单元的丁二烯聚合物，其侧链中的双键，10至100重量份在一个分子中具有至少3个乙烯基的乙烯基化合物和至少一种选自式I-IV的化合物：（I）（IV）其中X为H或CH 3，Y为Br或Cl，A为 - ， - ， - CO - ，SO 2，-CH = CH- ，-C（CH 3）2 - 或 - （CH 2 - ，m，n和a各自为1至4的整数，其量为25至100重量份，在式I至在式IV的情况下为25至200重量份。

4. 发明授权

US4603180A Thermosetting resin composition 失效
标题翻译：热固性树脂组合物
公开(公告)号：US4603180A
公开(公告)日：1986-07-29
申请号：US746121
申请日：1985-06-18
申请人： Hiroyuki Nakajima , Fumiyuki Miyamoto , Masakazu Murayama , Seiji Oka , Eiki Jidai
发明人： Hiroyuki Nakajima , Fumiyuki Miyamoto , Masakazu Murayama , Seiji Oka , Eiki Jidai
IPC分类号： C08G59/00 , C08F283/10 , C08G59/12 , C08G59/18 , C08G59/20 , C08G59/28 , C08G59/40 , C08G59/42 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31 , C08G59/14 , C08L63/10
CPC分类号： C08G59/12 , C08F283/10 , C08L63/00 , Y10S525/93
摘要： A thermosetting resin composition, consists essentially of:(a) 100 parts by weight of a mixture of liquid acid anhydride and an imide ring-containing epoxy compound obtained from reaction of an epoxy compound having in one molecule thereof at least two epoxy groups and either one or both of imide ring-containing dicarboxylic acid compounds represented by the following general formulae (I) and (II): ##STR1## (where: R.sub.1 is a divalent organic radical) ##STR2## (where: R.sub.2 is a divalent organic radical): (b) 5 to 200 parts by weight of a tri-functional vinyl monomer; and(c) 0.1 to 10 parts by weight of phenoxy resin.
摘要翻译：一种热固性树脂组合物基本上由以下组成：（a）100重量份的液体酸酐和含酰亚胺环的环氧化合物的混合物，其由一分子中具有至少两个环氧基团的环氧化合物和（I）和（II）表示的含有酰亚胺环的二羧酸化合物中的一种或两种：其中：R1是二价有机基团。其中： R2是二价有机基团）：（b）5〜200重量份的三官能乙烯基单体; 和（c）0.1〜10重量份苯氧基树脂。

5. 发明授权

US4591623A Thermosetting resin composition 失效
标题翻译：热固性树脂组合物
公开(公告)号：US4591623A
公开(公告)日：1986-05-27
申请号：US743896
申请日：1985-06-12
申请人： Hiroyuki Nakajima , Fumiyuki Miyamoto , Masakazu Murayama , Seiji Oka , Eiki Jidai
发明人： Hiroyuki Nakajima , Fumiyuki Miyamoto , Masakazu Murayama , Seiji Oka , Eiki Jidai
IPC分类号： C08G59/00 , C08F2/44 , C08F283/10 , C08G59/18 , C08G59/40 , C08L63/00 , C08L63/02
CPC分类号： C08F283/10
摘要： A thermosetting resin composition, which is characterized by mixing 5 to 300 parts by weight of tri-functional vinyl monomer and 0.1 to 10 parts by weight of phenoxy resin with respect to 100 parts by weight in total of an epoxy compound containing in its molecule at least two epoxy groups and a curing agent for said epoxy compound.
摘要翻译：一种热固性树脂组合物，其特征在于相对于100重量份的总共含有其分子中的环氧化合物，混合5〜300重量份的三官能乙烯基单体和0.1〜10重量份的苯氧基树脂至少两个环氧基和用于所述环氧化合物的固化剂。

6. 发明授权

US08610261B2 Power semiconductor device 有权
标题翻译：功率半导体器件
公开(公告)号：US08610261B2
公开(公告)日：2013-12-17
申请号：US12582246
申请日：2009-10-20
申请人： Seiji Oka , Yoshiko Obiraki , Takeshi Oi
发明人： Seiji Oka , Yoshiko Obiraki , Takeshi Oi
IPC分类号： H01L23/48
CPC分类号： H01L23/3735 , H01L23/041 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L25/072 , H01L25/162 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014 , H01L2924/181 , H01L2924/30105 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power semiconductor device includes a power semiconductor module having cylindrical conductors which are joined to a wiring pattern so as to be substantially perpendicular to the wiring pattern and whose openings are exposed at a surface of transfer molding resin, and an insert case having a ceiling portion and peripheral walls, the ceiling portion being provided with external terminals that are fitted into, and passed through, the ceiling portion, the external terminals having outer-surface-side connecting portions at the outer surface side of the ceiling portion and inner-surface-side connecting portions at the inner surface side of the ceiling portion. The power semiconductor module is set within the insert case such that the inner-surface-side connecting portions of the external terminals are inserted into the cylindrical conductors.
摘要翻译：功率半导体器件包括功率半导体模块，该功率半导体模块具有圆柱形导体，其连接到布线图案，以便基本上垂直于布线图案，并且其开口在传输模塑树脂的表面处露出;以及插入壳体，其具有顶部以及周壁，所述顶部设置有外部端子，所述外部端子嵌入并通过所述顶部，所述外部端子在所述顶部的外表面侧具有外表面侧连接部，在顶棚部分的内表面侧的侧连接部分。功率半导体模块设置在插入壳体内，使得外部端子的内表面侧连接部分插入圆柱形导体中。

7. 发明授权

US08334589B2 Power block and power semiconductor module using same 有权
公开(公告)号：US08334589B2
公开(公告)日：2012-12-18
申请号：US13008470
申请日：2011-01-18
申请人： Yoshihiro Yamaguchi , Seiji Oka , Osamu Usui , Takeshi Oi
发明人： Yoshihiro Yamaguchi , Seiji Oka , Osamu Usui , Takeshi Oi
IPC分类号： H01L23/492 , H01L23/02
摘要： A power block includes an insulating substrate, a conductive pattern formed on the insulating substrate, a power semiconductor chip bonded onto the conductive pattern by lead-free solder, a plurality of electrodes electrically connected to the power semiconductor chip and extending upwardly away from the insulating substrate, and a transfer molding resin covering the conductive pattern, the lead-free solder, the power semiconductor chip, and the plurality of electrodes, wherein surfaces of the plurality of electrodes are exposed at an outer surface of the transfer molding resin and lie in the same plane as the outer surface, the outer surface being located directly above the conductive pattern.

8. 发明授权

US08313986B2 Method of manufacturing power semiconductor device 有权
标题翻译：功率半导体器件制造方法
公开(公告)号：US08313986B2
公开(公告)日：2012-11-20
申请号：US13476425
申请日：2012-05-21
申请人： Seiji Oka , Yoshihiro Yamaguchi
发明人： Seiji Oka , Yoshihiro Yamaguchi
IPC分类号： H01L21/00
CPC分类号： H01L23/3121 , H01L21/565 , H01L24/28 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/49 , H01L2224/73265 , H01L2224/92247 , H01L2924/01013 , H01L2924/01014 , H01L2924/01068 , H01L2924/01079 , H01L2924/014 , H01L2924/10272 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacturing includes arranging an integral resin sleeve formed by integrating a plurality of sleeve parts so that the sleeve parts are respectively fitted with a plurality of electrode terminals. There is a press-fitting of the sleeve parts to the electrode terminals by performing mold clamping on molds to apply a force downward on the integral resin sleeve. Further, there is a filling of a molding resin into a hollow cavity of the molds.
摘要翻译：一种制造方法包括：通过集成多个套筒部件而形成的整体树脂套筒，使得套筒部件分别装配有多个电极端子。通过在模具上进行模具夹紧将套筒部件压配合到电极端子上，以将力向下施加在整体树脂套筒上。此外，将模制树脂填充到模具的中空腔中。

9. 发明授权

US6108511A Toner collecting and reusing device for use in an image forming apparatus and a method thereof 失效
标题翻译：用于图像形成装置的调色剂收集和再利用装置及其方法
公开(公告)号：US6108511A
公开(公告)日：2000-08-22
申请号：US289961
申请日：1999-04-13
申请人： Akio Kutsuwada , Seiji Oka , Tetsuo Yamaoka , Keisuke Hayashi , Shinji Tamaki
发明人： Akio Kutsuwada , Seiji Oka , Tetsuo Yamaoka , Keisuke Hayashi , Shinji Tamaki
IPC分类号： G03G21/10
CPC分类号： G03G21/10
摘要： An image forming apparatus including a plurality of filters for obtaining reusable toner from used toner scraped off of an image carrier. Also included is a reusable toner container for storing the reusable toner, and a toner transfer device for transferring the reusable toner stored in the reusable toner container to a developing device so that the reusable toner is reused by the developing device. The plurality of filters have a different mesh-size and are positioned in a used toner stream in an order based on the different mesh-size.
摘要翻译：一种图像形成装置，包括用于从图像载体刮掉的废粉末获得可重复使用的调色剂的多个过滤器。还包括用于存储可重复使用的调色剂的可重复使用的调色剂容器和用于将存储在可重复使用的调色剂容器中的可重复使用的调色剂转移到显影装置的调色剂转移装置，使得可再利用的调色剂被显影装置再利用。多个过滤器具有不同的网格尺寸，并且基于不同的网格尺寸按顺序定位在用过的调色剂流中。

10. 发明授权

US5822664A Developing machine which uses a developing agent including a toner and magnetic particles 失效
标题翻译：显影机，其使用包括调色剂和磁性颗粒的显影剂
公开(公告)号：US5822664A
公开(公告)日：1998-10-13
申请号：US581498
申请日：1995-12-29
申请人： Seiji Oka , Hajime Oyama , Yasushi Akiba , Kiyonori Tsuda
发明人： Seiji Oka , Hajime Oyama , Yasushi Akiba , Kiyonori Tsuda
IPC分类号： G03G15/08 , G03G15/09
CPC分类号： G03G15/09 , G03G15/0896 , G03G2215/0609
摘要： A developing machine is provided which includes a supporting case (2); a developing sleeve (4) mounted within the supporting case (2), for carrying a developing agent (3); a magnetic roller (15) mounted within the developing sleeve (4); a projection (5d) for thinning a layer of the developing agent (3) carried on the developing sleeve (4) and regulating the amount of the developing agent (3); a drift portion A having a predetermined capacity, in which the developing agent (3) stopped by the projection (5d) drifts about; a toner containing portion (5b) having a toner supplying opening 5c which faces the developing sleeve (4) and is contiguous to the drift portion A on the upstream side of a direction in which the developing agent (3) on the developing sleeve (4) is carried; a developing agent storage case (5) attachable to and detachable from the supporting case (2), including the developing sleeve (4) and the toner containing portion (5b); and a developing agent retrieving device for a scraping the developing agent (3) lying on the developing sleeve (14) and retrieving the scraped developing agent (3) into the toner containing portion (5b).
摘要翻译：提供一种包括支撑壳体（2）的显影机器; 安装在所述支撑壳体（2）内的用于承载显影剂（3）的显影套筒（4）; 安装在显影套筒（4）内的磁性辊（15）; 用于使承载在显影套筒（4）上的显影剂（3）的层变薄并调节显影剂（3）的量的突起（5d）; 具有由突起（5d）停止的显影剂（3）漂移的具有预定容量的漂移部分A; 调色剂容纳部分（5b）具有面向显影套筒（4）的调色剂供应开口5c，并且在显影剂套筒（4）上的显影剂（3）的方向的上游侧与漂移部分A相邻）可拆卸自支撑壳体的显影剂储存盒（5），包括显影套筒（4）和调色剂容纳部分（5b）; 以及用于刮取位于显影套筒（14）上的显影剂（3）并将刮下的显影剂（3）回收到调色剂容纳部分（5b）中的显影剂回收装置。

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