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1. 发明申请

US20050184381A1 Connection member and mount assembly and production method of the same 有权
标题翻译：连接构件和安装组装及生产方法相同
公开(公告)号：US20050184381A1
公开(公告)日：2005-08-25
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R13/24 , H05K1/00 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/34 , H05K3/36 , H05K3/40 , H01R27/02 , H01L23/48 , H01R12/00 , H01R25/00 , H01R31/00 , H01R33/88 , H01R33/90 , H01R33/92 , H01R33/94
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.
摘要翻译：提供了可以在没有通孔形成步骤的情况下制造的连接构件。连接构件100包括绝缘基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c; 至少一个布线20，其通过侧表面从上表面延伸到下表面。

2. 发明申请

US20080047137A1 Connection member and mount assembly and production method of the same 有权
标题翻译：连接构件和安装组装及生产方法相同
公开(公告)号：US20080047137A1
公开(公告)日：2008-02-28
申请号：US11826758
申请日：2007-07-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R43/20 , H01R12/00 , H01R13/24
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译：可以在没有通孔形成步骤的情况下制造连接构件。连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

3. 发明授权

US07258549B2 Connection member and mount assembly and production method of the same 有权
标题翻译：连接构件和安装组装及生产方法相同
公开(公告)号：US07258549B2
公开(公告)日：2007-08-21
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R12/00
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译：可以在没有通孔形成步骤的情况下制造连接构件。连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

4. 发明授权

US07748110B2 Method for producing connection member 有权
标题翻译：连接部件的制造方法
公开(公告)号：US07748110B2
公开(公告)日：2010-07-06
申请号：US11826758
申请日：2007-07-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H05K3/36
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译：可以在没有通孔形成步骤的情况下制造连接构件。连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

5. 发明授权

US07689129B2 System-in-package optical transceiver in optical communication with a plurality of other system-in-package optical transceivers via an optical transmission line 有权
标题翻译：通过光传输线与多个其它系统级封装光收发器进行光通信的系统级封装光收发器
公开(公告)号：US07689129B2
公开(公告)日：2010-03-30
申请号：US11201234
申请日：2005-08-10
申请人： Seiji Karashima , Seiichi Nakatani , Yoshiyuki Saito
发明人： Seiji Karashima , Seiichi Nakatani , Yoshiyuki Saito
IPC分类号： H04B10/00
CPC分类号： G06F15/16 , H04L12/00
摘要： A parallel computation apparatus as a multiprocessor includes functional modules as a plurality of processors having an optical communication function and capable of mutually cooperating, and an optical transmission line interconnecting the plurality of processors. Among the plurality of functional modules, the first functional module having a first information processing capacity has a function of determining whether information processing of a first information processing amount can be completed based on the first information processing capacity, and outputting a second information processing amount obtained by subtracting an information processing amount based on the first information processing capacity from the first information processing amount to at least one of the other functional modules.
摘要翻译：作为多处理器的并行计算装置包括具有光通信功能并且能够相互配合的多个处理器的功能模块以及互连多个处理器的光传输线。在多个功能模块中，具有第一信息处理能力的第一功能模块具有根据第一信息处理能力确定是否能够完成第一信息处理量的信息处理的功能，并且输出获得的第二信息处理量通过从第一信息处理量减去基于第一信息处理能力的信息处理量到至少一个其他功能模块。

6. 发明申请

US20060036831A1 Multiprocessor 有权
标题翻译：多处理器
公开(公告)号：US20060036831A1
公开(公告)日：2006-02-16
申请号：US11201234
申请日：2005-08-10
申请人： Seiji Karashima , Seiichi Nakatani , Yoshiyuki Saito
发明人： Seiji Karashima , Seiichi Nakatani , Yoshiyuki Saito
IPC分类号： G06F12/10 , G06F9/34
CPC分类号： G06F15/16 , H04L12/00
摘要： A parallel computation apparatus as a multiprocessor includes functional modules as a plurality of processors having an optical communication function and capable of mutually cooperating, and an optical transmission line interconnecting the plurality of processors. Among the plurality of functional modules, the first functional module having a first information processing capacity has a function of determining whether information processing of a first information processing amount can be completed based on the first information processing capacity, and outputting a second information processing amount obtained by subtracting an information processing amount based on the first information processing capacity from the first information processing amount to at least one of the other functional modules.
摘要翻译：作为多处理器的并行计算装置包括具有光通信功能并且能够相互配合的多个处理器的功能模块以及互连多个处理器的光传输线。在多个功能模块中，具有第一信息处理能力的第一功能模块具有根据第一信息处理能力确定是否能够完成第一信息处理量的信息处理的功能，并且输出获得的第二信息处理量通过从第一信息处理量减去基于第一信息处理能力的信息处理量到至少一个其他功能模块。

7. 发明申请

US20050199420A1 Circuit board and method for manufacturing the same 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：US20050199420A1
公开(公告)日：2005-09-15
申请号：US11075578
申请日：2005-03-08
申请人： Yukihiro Ishimaru , Seiichi Nakatani , Yoshiyuki Saito
发明人： Yukihiro Ishimaru , Seiichi Nakatani , Yoshiyuki Saito
IPC分类号： H01L21/48 , H01L23/14 , H05K1/00 , H05K1/09 , H05K1/16 , H05K3/00 , H05K3/10 , H05K3/40 , H05K3/46
CPC分类号： H05K3/4038 , H05K1/167 , H05K3/105 , H05K3/4644 , H05K2201/0326 , H05K2203/107 , H05K2203/171 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： In a circuit board according to the present invention, on a substrate, in at least a portion of a phase change layer including a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, a conductive path is formed that has been put into an electrically conductive state by a phase change in the phase change layer, wherein the phase change material includes a chalcogenide semiconductor, changes between the electrically insulating state and the electrically conductive state by irradiation of laser light, goes into the electrically conductive state in a crystalline phase, and goes into the electrically insulating state in an amorphous phase. In this way, a conductive path is formed by irradiating laser light onto a phase change layer using phase change in a phase change layer formed from a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, and therefore very small-dimension minute vias and conductors can be formed. Furthermore, subsequent repair, rework, or trimming also is easy.
摘要翻译：在根据本发明的电路板中，在基板上，在包括能够在电绝缘状态和导电状态之间交替变化的相变材料的相变层的至少一部分中，导电路径为形成为通过相变层中的相变而导致导电状态，其中相变材料包括硫族化物半导体，通过激光的照射在电绝缘状态和导电状态之间的变化进入在结晶相中导电状态，并且在非晶相中进入电绝缘状态。以这种方式，通过使用在能够在电绝缘状态和导电状态之间交替变化的相变材料形成的相变层中的相变来将激光照射到相变层上形成导电路径，以及因此可以形成非常小尺寸的微通孔和导体。此外，随后的修理，返修或修整也很容易。

8. 发明申请

US20070124926A1 CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：US20070124926A1
公开(公告)日：2007-06-07
申请号：US11674454
申请日：2007-02-13
申请人： Yukihiro Ishimaru , Seiichi Nakatani , Yoshiyuki Saito
发明人： Yukihiro Ishimaru , Seiichi Nakatani , Yoshiyuki Saito
IPC分类号： H05K1/03
CPC分类号： H05K3/4038 , H05K1/167 , H05K3/105 , H05K3/4644 , H05K2201/0326 , H05K2203/107 , H05K2203/171 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： In a circuit board according to the present invention, on a substrate, in at least a portion of a phase change layer including a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, a conductive path is formed that has been put into an electrically conductive state by a phase change in the phase change layer, wherein the phase change material includes a chalcogenide semiconductor, changes between the electrically insulating state and the electrically conductive state by irradiation of laser light, goes into the electrically conductive state in a crystalline phase, and goes into the electrically insulating state in an amorphous phase. In this way, a conductive path is formed by irradiating laser light onto a phase change layer using phase change in a phase change layer formed from a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, and therefore very small-dimension minute vias and conductors can be formed. Furthermore, subsequent repair, rework, or trimming also is easy.
摘要翻译：在根据本发明的电路板中，在基板上，在包括能够在电绝缘状态和导电状态之间交替变化的相变材料的相变层的至少一部分中，导电路径为形成为通过相变层中的相变而导致导电状态，其中相变材料包括硫族化物半导体，通过激光的照射在电绝缘状态和导电状态之间的变化进入在结晶相中导电状态，并且在非晶相中进入电绝缘状态。以这种方式，通过使用在能够在电绝缘状态和导电状态之间交替变化的相变材料形成的相变层中的相变来将激光照射到相变层上形成导电路径，以及因此可以形成非常小尺寸的微通孔和导体。此外，随后的修理，返修或修整也很容易。

9. 发明申请

US20110113873A1 APPARATUS AND METHOD FOR MONITORING SLIDING STATE OF PISTON 失效
标题翻译：用于监测活塞滑动状态的装置和方法
公开(公告)号：US20110113873A1
公开(公告)日：2011-05-19
申请号：US13000781
申请日：2009-06-23
申请人： Yoshiyuki Saito , Kouji Moriyama
发明人： Yoshiyuki Saito , Kouji Moriyama
IPC分类号： G01M15/04 , G01K1/00
CPC分类号： F02D41/22 , F02B77/083 , F02B77/089 , F02D35/025 , F02F5/00 , G01M15/05 , Y02T10/40
摘要： The present invention is an apparatus and a method for monitoring a sliding state of a piston ring. The present invention detects a cycle of rotation of a piston ring based on a temperature at a predetermined site of a cylinder liner, and determines a sign of burning of a piston based on a state of the rotation. As a result, it is possible to detect a sign of burning of a piston by an apparatus less expensive than apparatuses using a conventional technique of detecting a capacitance.
摘要翻译：本发明是用于监测活塞环的滑动状态的装置和方法。本发明基于气缸套的预定位置处的温度来检测活塞环的旋转周期，并且基于旋转状态确定活塞的燃烧的符号。结果，可以通过比使用传统的电容检测技术的装置更便宜的装置来检测活塞燃烧的符号。

10. 发明授权

US07886085B2 Removable memory device, phase synchronizing method, phase synchronizing program, medium recording the same, and host terminal 有权
标题翻译：可移动存储设备，相位同步方法，相位同步程序，介质记录和主机终端
公开(公告)号：US07886085B2
公开(公告)日：2011-02-08
申请号：US12295051
申请日：2007-02-20
申请人： Hiroshi Suenaga , Osamu Shibata , Noriaki Takeda , Toru Iwata , Takaharu Yoshida , Yoshiyuki Saito
发明人： Hiroshi Suenaga , Osamu Shibata , Noriaki Takeda , Toru Iwata , Takaharu Yoshida , Yoshiyuki Saito
IPC分类号： G06F13/00 , G06F3/00
CPC分类号： H04L7/10 , G06F1/12 , H04L7/0008 , H04L7/033 , H04L7/044 , H04L7/046
摘要： An object of the present invention is to provide a technique to improve the data transmission efficiency which allows correct reception of the data at the same time. A removable memory device that transmits/receives data to and from a host terminal, which includes: a clock reception section that receives a transmission/reception clock, which is used for transmitting/receiving data between the host terminal and the removable memory device, from the host terminal; a phase synchronization pattern generation section that generates a phase synchronization pattern, which is for adjusting a phase of internal reception clock which the host terminal incorporates for receiving data from the removable memory device, based on the transmission/reception clock; and a transmission section that transmits the generated phase synchronization pattern to the host terminal, and in which the phase synchronization pattern includes a first level signal which lasts for at least two cycles, and a second level signal which follows the first level signal and lasts for one cycle, is provided.
摘要翻译：本发明的目的是提供一种提高数据传输效率的技术，其允许同时正确地接收数据。一种向主机终端发送/接收数据的可移动存储装置，包括：接收用于在主机终端和可移动存储装置之间发送/接收数据的发送/接收时钟的时钟接收部分，主机终端; 相位同步模式生成部，其基于所述发送接收时钟生成相位同步模式，所述相位同步模式用于调整所述主机终端结合的用于从所述可移动存储装置接收数据的内部接收时钟的相位; 以及发送部，其将所生成的相位同步模式发送到所述主机终端，并且所述相位同步模式包括持续至少两个周期的第一电平信号，以及在所述第一电平信号之后持续的第二电平信号，提供一个循环。

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