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1. 发明授权

US5094037A Edge polisher 失效
标题翻译：边缘抛光机
公开(公告)号：US5094037A
公开(公告)日：1992-03-10
申请号：US588459
申请日：1990-09-26
申请人： Shunji Hakomori , Seiichi Maeda , Isao Nagahashi
发明人： Shunji Hakomori , Seiichi Maeda , Isao Nagahashi
IPC分类号： B24B9/06 , B24B29/04
CPC分类号： B24B9/065 , B24B29/04
摘要： Described herein is an edge polisher for polishing chamfered edge portions on the front and rear sides of work, including a first machining stage for polishing the front side of work and a second machining stage for polishing the rear side of work, along with mechanisms for supplying, positioning, transferring, reversing and ejecting work. In the first and second machining stages, a work is chucked on each of index units which are mounted on an intermittently rotating index table and revolved around a polishing drum located at the center of the index table, pressing chamfered edge portions of the works against the polishing drum to give a polishing treatment thereto.
摘要翻译：这里描述的是用于抛光工件前后侧的倒角边缘部分的边缘抛光机，包括用于抛光工件前侧的第一加工台和用于抛光工件后侧的第二加工台，以及用于供应的机构，定位，转让，倒转和退出工作。在第一加工阶段和第二加工阶段中，将工件夹在安装在间歇旋转的分度台上的每个分度单元上，并且围绕位于分度台的中心的抛光滚筒旋转，将工件的倒角边缘部分压在研磨滚筒以对其进行抛光处理。

2. 发明授权

US5097630A Specular machining apparatus for peripheral edge portion of wafer 失效
标题翻译：用于外围边缘部分的波峰加工设备
公开(公告)号：US5097630A
公开(公告)日：1992-03-24
申请号：US243979
申请日：1988-09-13
申请人： Seiichi Maeda , Isao Nagahashi
发明人： Seiichi Maeda , Isao Nagahashi
IPC分类号： B24B9/00 , B24B9/06 , H01L21/304
CPC分类号： B24B9/065
摘要： A specular machining apparatus for giving a specular machining or mirror-like surface to a peripheral edge portion, in particular a chamfered portion, of typically a semiconductor wafer such as a silicon wafer. This mirror-like surface is provided to smooth out the relatively rough surface formed by etching to remove a strained layer which is generated as a result of grinding work. The mirror-like surface tends to reject the attachment of dirt, which is desirable. The specular machining apparatus is of simple construction and easy to use, comprising a chuck table plus chuck means for holding a wafer having a chamfered peripheral edge portion. The chuck table rotates the wafer held by the chuck about the wafer axis. A polishing ring is disposed to be freely rotatable around an axis perpendicular to the axis of the wafer on the chuck table, to permit the polishing surface on the outer periphery to be accessable for polishing.

3. 发明授权

US4805348A Flat lapping machine 失效
标题翻译：平面研磨机
公开(公告)号：US4805348A
公开(公告)日：1989-02-21
申请号：US891241
申请日：1986-07-29
申请人： Hatsuyuki Arai , Isao Nagahashi , Seiichi Maeda , Kazumi Yasuda , Shiro Furusawa , Kazuhiko Hirata , Kastunori Nagao , Kazuhiko Kondo , Takaya Sanoki , Misuo Sugiyama , Shinichi Kusano
发明人： Hatsuyuki Arai , Isao Nagahashi , Seiichi Maeda , Kazumi Yasuda , Shiro Furusawa , Kazuhiko Hirata , Kastunori Nagao , Kazuhiko Kondo , Takaya Sanoki , Misuo Sugiyama , Shinichi Kusano
IPC分类号： B24B37/08 , B24B37/28 , B24B7/00
CPC分类号： B24B37/28 , B24B37/08
摘要： Described herein is a flat lapping machine capable of precision-abrading simultaneously flat surfaces on the front and rear sides of a work in the fashion of lapping, polishing and grinding machines. The present invention contemplates to provide a flat lapping machine which is simplified in construction as compared with conventional flap lapping machines having a large number of carriers in planetary motions, and which can stop the respective carriers easily in specific positions and directions at the end of a lapping operation. To this end, the present invention employs a large number of support gear mechanisms each constituted by a plural number of small gears and located at uniform intervals around a center gear, rotatably supporting the respective carriers in predetermined positions while the respective carriers are driven by the center gear.
摘要翻译：这里描述的是能够以研磨，抛光和研磨机器的方式同时精确研磨工件的前后两侧的平坦表面的平板研磨机。本发明旨在提供一种与具有行星运动中的大量载体的常规翼片研磨机相比，其结构简化的平板研磨机，其能够在特定位置和方向上容易地停止相应的载体研磨操作。为此，本发明采用大量支撑齿轮机构，每个支撑齿轮机构由多个小齿轮构成，并且围绕中心齿轮以均匀的间隔设置，可旋转地支撑各个载体在预定位置，同时各个载体由中心齿轮

4. 发明授权

US5645472A Polishing device 失效
标题翻译：抛光装置
公开(公告)号：US5645472A
公开(公告)日：1997-07-08
申请号：US633195
申请日：1996-04-16
申请人： Isao Nagahashi , Yoshishige Takahashi
发明人： Isao Nagahashi , Yoshishige Takahashi
IPC分类号： B24B7/17 , B24B37/04 , B24B37/08 , G11B5/84 , G11B23/00
CPC分类号： B24B37/08 , B24B41/067 , B24B7/17 , G11B23/0021 , G11B5/8404
摘要： A polishing device is formed of a pair of rotatable and elevatable upper supporting members provided with ring shape polishing pads at lower surface peripheries thereof, a pair of rotatable lower supporting members provided with ring shape polishing pads at upper surface peripheries thereof, a rotatable and elevatable disc holding device for holding a disc to be polished, and an arm for supporting the upper supporting members and the disc holding device. The polishing device further includes driving devices for rotating the upper supporting members, the lower supporting members and the disc holding device, respectively. The disc is independently rotated in a direction opposite to a rotating direction of the upper and lower supporting members to improve polishing efficiency. By setting rotating speeds of the supporting members and the disc, a regular working mark can be formed on the disc.
摘要翻译：抛光装置由一对可旋转和可升高的上支撑构件形成，上支撑构件在其下表面周围设置有环形抛光垫，一对可旋转的下支撑构件，在其上表面周边设置有环形抛光垫，可旋转和可升高的用于保持要抛光的盘的盘保持装置，以及用于支撑上支撑构件和盘保持装置的臂。抛光装置还包括用于分别旋转上支撑构件，下支撑构件和盘保持装置的驱动装置。盘独立地沿与上支撑构件和下支撑构件的旋转方向相反的方向旋转，以提高抛光效率。通过设置支撑构件和盘的旋转速度，可以在盘上形成规则的工作标记。

5. 发明授权

US5498196A Wafer polishing method and apparatus 失效
公开(公告)号：US5498196A
公开(公告)日：1996-03-12
申请号：US245458
申请日：1994-05-18
申请人： Chris E. Karlsrud , Anthony G. Van Woerkom , Shigeru Odagiri , Isao Nagahashi
发明人： Chris E. Karlsrud , Anthony G. Van Woerkom , Shigeru Odagiri , Isao Nagahashi
IPC分类号： B24B37/08 , B24B37/34 , B24B49/16 , B24B51/00 , G05B19/418 , H01L21/304 , H01L21/677 , H01L21/683 , B24B37/04 , B24B7/22
CPC分类号： H01L21/6838 , B24B37/08 , B24B37/345 , B24B49/16 , B24B51/00 , G05B19/41825 , H01L21/67745 , H01L21/67751 , G05B2219/37399 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49356 , G05B2219/49361 , G05B2219/50007 , G05B2219/50362 , G05B2219/50371 , G05B2219/50381 , G05B2219/50388 , Y02P90/087
摘要： A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

6. 发明授权

US5762543A Polishing apparatus with improved product unloading 失效
标题翻译：抛光机具有改进的产品卸载
公开(公告)号：US5762543A
公开(公告)日：1998-06-09
申请号：US564968
申请日：1995-11-30
申请人： Karl Kasprzyk , Isao Nagahashi
发明人： Karl Kasprzyk , Isao Nagahashi
IPC分类号： B24B37/08 , B24B37/34 , B24B5/313 , B24B7/08 , B24B7/17
CPC分类号： B24B37/08 , B24B37/345
摘要： In a polishing machine for polishing parts between a table and an upper polishing head, the upper polishing head includes push rods to clear the workpieces after a polishing operation. A push ring engages the push rods as a polishing head is being raised, holding the workpieces in position on the table.
摘要翻译：在用于在台面和上抛光头之间抛光部件的抛光机中，上抛光头包括推杆，以在抛光操作之后清除工件。当抛光头被抬起时，推环与推杆接合，将工件保持在工作台上就位。

7. 发明授权

US5498199A Wafer polishing method and apparatus 失效
标题翻译：晶圆抛光方法及装置
公开(公告)号：US5498199A
公开(公告)日：1996-03-12
申请号：US276158
申请日：1994-07-15
申请人： Chris E. Karlsrud , Anthony G. Van Woerkom , Shigeru Odagiri , Isao Nagahashi , Spencer Preston
发明人： Chris E. Karlsrud , Anthony G. Van Woerkom , Shigeru Odagiri , Isao Nagahashi , Spencer Preston
IPC分类号： B24B37/08 , B24B37/34 , B24B49/16 , B24B51/00 , G05B19/418 , H01L21/304 , H01L21/677 , H01L21/683 , B24B7/22
CPC分类号： B24B37/08 , B24B37/345 , B24B49/16 , B24B51/00 , G05B19/41825 , H01L21/67745 , H01L21/67751 , H01L21/6838 , G05B2219/37399 , G05B2219/45199 , G05B2219/45232 , G05B2219/49356 , G05B2219/49361 , G05B2219/50007 , G05B2219/50362 , G05B2219/50371 , G05B2219/50381 , G05B2219/50388 , Y02P90/087
摘要： A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
摘要翻译：晶片抛光装置包括具有多个晶片载体的晶片抛光组件，用于基本上同时抛光多个晶片抵靠旋转的抛光表面。待研磨的多个晶片通过分度台的晶片保持装置基本上同时装载到多个晶片载体中。类似地，多个抛光晶片基本上同时从多个晶片载体卸载到索引表的晶片保持装置中。晶片载体被单独计算机控制以进行精确的抛光，并且可以通过不同的晶片载体同时满足不同的抛光要求。

8. 发明授权

US5329732A Wafer polishing method and apparatus 失效
标题翻译：晶圆抛光方法及装置
公开(公告)号：US5329732A
公开(公告)日：1994-07-19
申请号：US898876
申请日：1992-06-15
申请人： Chris E. Karlsrud , Anthony G. Van Woerkom , Shigeru Odagiri , Isao Nagahashi
发明人： Chris E. Karlsrud , Anthony G. Van Woerkom , Shigeru Odagiri , Isao Nagahashi
IPC分类号： B24B37/08 , B24B37/34 , B24B49/16 , B24B51/00 , G05B19/418 , H01L21/304 , H01L21/677 , H01L21/683 , B24B7/22
CPC分类号： H01L21/6838 , B24B37/08 , B24B37/345 , B24B49/16 , B24B51/00 , G05B19/41825 , H01L21/67745 , H01L21/67751 , G05B2219/37399 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49356 , G05B2219/49361 , G05B2219/50007 , G05B2219/50362 , G05B2219/50371 , G05B2219/50381 , G05B2219/50388 , Y02P90/087
摘要： A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
摘要翻译：晶片抛光装置包括具有多个晶片载体的晶片抛光组件，用于基本上同时抛光多个晶片抵靠旋转的抛光表面。待研磨的多个晶片通过分度台的晶片保持装置基本上同时装载到多个晶片载体中。类似地，多个晶片载体基本上同时卸载到索引表的晶片保持装置中。晶片载体被单独计算机控制以精确抛光，并且不同的抛光要求可以通过不同的晶片载体同时满足。

9. 再颁专利

USRE37622E1 Wafer polishing method and apparatus 失效
标题翻译：晶圆抛光方法及装置
公开(公告)号：USRE37622E1
公开(公告)日：2002-04-02
申请号：US08792936
申请日：1997-01-24
申请人： Chris E. Karlsrud , Anthony G. Van Woerkom , Shigeru Odagiri , Isao Nagahashi
发明人： Chris E. Karlsrud , Anthony G. Van Woerkom , Shigeru Odagiri , Isao Nagahashi
IPC分类号： B24B3704
CPC分类号： H01L21/6838 , B24B37/08 , B24B37/345 , B24B49/16 , B24B51/00 , G05B19/41825 , G05B2219/37399 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49356 , G05B2219/49361 , G05B2219/50007 , G05B2219/50362 , G05B2219/50371 , G05B2219/50381 , G05B2219/50388 , H01L21/67745 , H01L21/67751 , Y02P90/087
摘要： A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
摘要翻译：晶片抛光装置包括具有多个晶片载体的晶片抛光组件，用于基本上同时抛光多个晶片抵靠旋转的抛光表面。待研磨的多个晶片通过分度台的晶片保持装置基本上同时装载到多个晶片载体中。类似地，多个晶片载体基本上同时卸载到索引表的晶片保持装置中。晶片载体被单独计算机控制以精确抛光，并且不同的抛光要求可以通过不同的晶片载体同时满足。

10. 发明授权

US06089959A Polishing method and polishing apparatus 有权
标题翻译：抛光方法和抛光装置
公开(公告)号：US06089959A
公开(公告)日：2000-07-18
申请号：US255682
申请日：1999-02-23
申请人： Isao Nagahashi
发明人： Isao Nagahashi
IPC分类号： B24B37/08 , B24B7/00 , B24B5/00
CPC分类号： B24B37/08
摘要： There is provided a polishing apparatus and a polishing method for use with the apparatus. The apparatus includes a lower turn table having a polishing surface on its upper surface, an upper turn table having a polishing surface on its lower surface, and in addition, an intermediate turn table having polishing surfaces on its upper and lower surfaces and interposed between the lower turn table and the upper turn table. The apparatus further includes a carrier rotating mechanism adaptable to rotate a disk-like carrier rotating on its axis while revolve the disk-like carrier around the rotational axis of the turn tables, and a table rotating mechanism for rotating the turn tables. The carriers can be prepared not only on the lower turn table but the intermediate turn table, and works can be loaded on the carriers prepared on the lower and intermediate turn tables. The works polished at a unit of machine operation is so many that productivity is improved.
摘要翻译：提供了一种用于该装置的抛光装置和抛光方法。该装置包括在其上表面上具有抛光表面的下转台，在其下表面上具有抛光表面的上转台，此外，还具有在其上表面和下表面上具有抛光表面的中间转台，下转台和上转台。该装置还包括一个行星架旋转机构，该转动机构适于旋转在其轴上旋转的盘状载体，同时围绕转台的旋转轴线旋转盘状载体;以及台旋转机构，用于旋转转台。载体不仅可以在下转台上制作，而且可以在中间转台上进行准备，并且可以将载荷装载到在下转台和中转轮上准备的载体上。在机器操作单元抛光的作品是如此之多，以至于提高了生产率。

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