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    • 1. 发明申请
    • Optical integrated device
    • 光学集成器件
    • US20060104575A1
    • 2006-05-18
    • US11099607
    • 2005-04-06
    • Seiichi IkedaSeimi Sasaki
    • Seiichi IkedaSeimi Sasaki
    • G02B6/36
    • G02B6/4204G02B6/4201G02B6/424G02B6/4244G02B6/4266G02B6/4271G02B6/4272
    • An optical integrated device in which application of an excessive stress or the appearance of a crack due to thermal expansion mismatching is prevented. A first ferrule is fixed to an optical waveguide chip. An optical fiber is inserted into the first ferrule to fix the optical fiber. A package contains the optical waveguide chip and the first ferrule. An opening is made in a sidewall of the package to pull out the optical fiber to the outside. A pipe is airtightly fixed around the opening. A second ferrule is inserted into the pipe and is airtightly fixed to an end of the pipe. The optical fiber pulled out to the outside of the package through the opening is inserted into the second ferrule to fix the optical fiber. The optical fiber without deflection is contained in the package by making a first expansion/contraction amount created due to the thermal expansion of the package and the thermal expansion of the pipe match a second expansion/contraction amount created due to the thermal expansion of the optical fiber and the thermal expansion of the second ferrule.
    • 防止由于热膨胀不匹配而产生过大应力或出现裂缝的光学集成装置。 第一套圈固定在光波导芯片上。 将光纤插入到第一套圈中以固定光纤。 封装包含光波导芯片和第一套圈。 在封装的侧壁中形成开口以将光纤拉出到外部。 管子气密地固定在开口周围。 将第二套圈插入管中并气密地固定到管的一端。 通过开口拉出到包装外部的光纤被插入到第二套圈中以固定光纤。 无偏转的光纤通过由于封装的热膨胀而产生的第一膨胀/收缩量包含在封装中,并且管的热膨胀与由于光学器件的热膨胀而产生的第二膨胀/收缩量相匹配 纤维和第二套圈的热膨胀。
    • 2. 发明授权
    • Optical integrated device
    • 光学集成器件
    • US07267492B2
    • 2007-09-11
    • US11099607
    • 2005-04-06
    • Seiichi IkedaSeimi Sasaki
    • Seiichi IkedaSeimi Sasaki
    • G02B6/36
    • G02B6/4204G02B6/4201G02B6/424G02B6/4244G02B6/4266G02B6/4271G02B6/4272
    • An optical integrated device in which application of an excessive stress or the appearance of a crack due to thermal expansion mismatching is prevented. A first ferrule is fixed to an optical waveguide chip. An optical fiber is inserted into the first ferrule to fix the optical fiber. A package contains the optical waveguide chip and the first ferrule. An opening is made in a sidewall of the package to pull out the optical fiber to the outside. A pipe is airtightly fixed around the opening. A second ferrule is inserted into the pipe and is airtightly fixed to an end of the pipe. The optical fiber pulled out to the outside of the package through the opening is inserted into the second ferrule to fix the optical fiber. The optical fiber without deflection is contained in the package by making a first expansion/contraction amount created due to the thermal expansion of the package and the thermal expansion of the pipe match a second expansion/contraction amount created due to the thermal expansion of the optical fiber and the thermal expansion of the second ferrule.
    • 防止由于热膨胀不匹配而产生过大应力或出现裂缝的光学集成装置。 第一套圈固定在光波导芯片上。 将光纤插入到第一套圈中以固定光纤。 封装包含光波导芯片和第一套圈。 在封装的侧壁中形成开口以将光纤拉出到外部。 管子气密地固定在开口周围。 将第二套圈插入管中并气密地固定到管的一端。 通过开口拉出到包装外部的光纤被插入到第二套圈中以固定光纤。 无偏转的光纤通过由于封装的热膨胀而产生的第一膨胀/收缩量包含在封装中,并且管的热膨胀与由于光学器件的热膨胀而产生的第二膨胀/收缩量相匹配 纤维和第二套圈的热膨胀。
    • 3. 发明授权
    • Optical transmission module and a method of producing the same
    • 光传输模块及其制造方法
    • US5727104A
    • 1998-03-10
    • US723022
    • 1996-09-30
    • Seimi SasakiKazuhiro Tanaka
    • Seimi SasakiKazuhiro Tanaka
    • G02B6/42H01L31/0232H01L33/48H04B10/00H04B10/25
    • G02B6/4248G02B6/423G02B6/4251G02B6/424
    • An optical transmission module which can provide hermetic sealing with reliability, is low in cost and excellent in mass productivity and a method of producing such an optical transmission module is provided. A sealing material is affixed to a cover section in advance. The sealing material is in the form of a film formed by screen printing along the joining portion between a body section and the cover section and having a thickness matching the amount of gap between the body section and the cover section at the joining portion. A conversion device is received in a recess of the body section, and an optical fiber is inserted into the body section from outside along a stepped portion and connected to the conversion device. With the cover section placed on the body section, the two are heated. As the sealing material, soldering paste is used, for example.
    • 可以提供气密密封的可靠性的光传输模块成本低,批量生产率优异,并且提供了制造这种光传输模块的方法。 密封材料预先固定到盖部。 密封材料是通过沿主体部分和盖部分之间的接合部分的丝网印刷而形成的膜的形式,并且具有与接合部分处的主体部分和盖部分之间的间隙量相匹配的厚度。 转换装置被容纳在主体部分的凹部中,并且光纤沿着台阶部分从外部插入主体部分中,并连接到转换装置。 将盖子放置在主体部分上,两者被加热。 作为密封材料,例如使用焊膏。
    • 4. 发明授权
    • Optical link module connection system
    • 光链路模块连接系统
    • US5647042A
    • 1997-07-08
    • US613001
    • 1996-03-08
    • Ryoichi OchiaiKazunori MiuraSeimi SasakiGoji Nakagawa
    • Ryoichi OchiaiKazunori MiuraSeimi SasakiGoji Nakagawa
    • G02B6/42H01L31/0232G02B6/38
    • G02B6/4292G02B6/421G02B6/3636G02B6/3652G02B6/3692
    • An optical link module connection system for connecting an optical fiber to an optical link module that performs conversion between an electrical signal and an optical signal. The system is aimed at reduction of the manufacturing cost of printed circuit boards containing those fiber-optic products by allowing an automated soldering process to be applied thereto. The system will also facilitate the product handling as well as storage and improve the board space utilization by shortening the length of the optical fiber. While optoelectronic conversion means comprises a first ferrule, coupling means consists of a second ferrule, a split sleeve, etc. The first ferrule is inserted into the split sleeve in the coupling means so as to contact the second ferrule, thus completing an optical path between a first optical fiber and a second optical fiber. The optoelectronic conversion means will be soldered to a printed circuit board before being joined to the coupling means. That is, when soldering the printed circuit board, the second optical fiber having only a poor heat resistance is not yet mounted on the board, thus allowing automated soldering equipment to be used for the process.
    • 一种用于将光纤连接到执行电信号和光信号之间的转换的光链路模块的光链路模块连接系统。 该系统旨在通过允许对其进行自动焊接工艺来降低包含这些光纤产品的印刷电路板的制造成本。 该系统还将通过缩短光纤的长度来促进产品处理以及存储和提高电路板空间利用率。 虽然光电转换装置包括第一套圈,联接装置由第二套圈,分体套筒等组成。第一套圈在联接装置中插入分开的套筒中,以便接触第二套圈,从而完成第二套圈之间的光路, 第一光纤和第二光纤。 在连接到耦合装置之前,光电转换装置将焊接到印刷电路板。 也就是说,当焊接印刷电路板时,仅具有差的耐热性的第二光纤尚未安装在电路板上,从而允许自动焊接设备用于该工艺。
    • 10. 发明授权
    • Optical device and manufacturing method thereof
    • 光学元件及其制造方法
    • US07572070B2
    • 2009-08-11
    • US11777343
    • 2007-07-13
    • Seimi Sasaki
    • Seimi Sasaki
    • G02B6/42
    • G02B6/30G02B6/381
    • The present invention is an optical device achieving miniaturization, functional integration, and cost reduction, and comprises an optical element chip, an optical fiber assembly comprised of an optical fiber, a first ferrule, and a second ferrule, a package containing and enveloping the optical element chip and having an opening for introducing the optical fiber assembly, and a support pipe mounted on an extension of the opening to support an introductory part of the optical fiber into the package together with the second ferrule constituting the optical fiber assembly to be introduced into the package and to hermetically seal the package, wherein the second ferrule is fixed inside the support pipe, one end thereof protrudes toward an inner part of the package, and another end substantially protrudes at a tip part of the support pipe by a length required for the airtight fixing.
    • 本发明是实现小型化,功能集成和成本降低的光学装置,并且包括光学元件芯片,包括光纤,第一套圈和第二套圈的光纤组件,包含并包围光学元件的封装 元件芯片,并具有用于引入光纤组件的开口;以及支撑管,其安装在开口的延伸部上,以与构成要引入的光纤组件的第二套圈一起将光纤的入口部分支撑到封装中 所述包装件并且密封所述包装,其中所述第二套圈固定在所述支撑管内,其一端朝向所述包装的内部部分突出,并且所述另一端部在所述支撑管的顶端部基本上突出所需的长度 密封固定。