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1. 发明授权

US09809872B2 Dilute copper alloy material, dilute copper alloy wire, dilute copper alloy twisted wire and cable using the same, coaxial cable and composite cable, and method of manufacturing dilute copper alloy material and dilute copper alloy wire 有权
公开(公告)号：US09809872B2
公开(公告)日：2017-11-07
申请号：US12756551
申请日：2010-04-08
申请人： Seigi Aoyama , Toru Sumi , Shuji Sakai , Takahiro Sato , Hidenori Abe
发明人： Seigi Aoyama , Toru Sumi , Shuji Sakai , Takahiro Sato , Hidenori Abe
IPC分类号： C22C9/00 , B22D11/00 , H01B1/02 , C22F1/08 , B22D21/02
CPC分类号： C22C9/00 , B22D21/025 , C22F1/08 , H01B1/026
摘要： A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance of pure copper and inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO2, TiS or Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution. TiO, TiO2, TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are 500 nm or less in particle size.

2. 发明申请

US20100263905A1 DILUTE COPPER ALLOY MATERIAL, DILUTE COPPER ALLOY WIRE, DILUTE COPPER ALLOY TWISTED WIRE AND CABLE USING THE SAME, COAXIAL CABLE AND COMPOSITE CABLE, AND METHOD OF MANUFACTURING DILUTE COPPER ALLOY MATERIAL AND DILUTE COPPER ALLOY WIRE 有权
标题翻译：稀释铜合金材料，稀土铜合金线，稀土铜合金线和使用其的电缆，同轴电缆和复合电缆，以及制造稀土铜合金材料和稀土铜合金线的方法
公开(公告)号：US20100263905A1
公开(公告)日：2010-10-21
申请号：US12756551
申请日：2010-04-08
申请人： Seigi AOYAMA , Toru Sumi , Shuji Sakai , Takahiro Sato , Hidenori Abe
发明人： Seigi AOYAMA , Toru Sumi , Shuji Sakai , Takahiro Sato , Hidenori Abe
IPC分类号： H01B9/02 , H01B5/00 , H01B5/08 , H01B11/02 , C22C9/00 , B22D11/06
CPC分类号： C22C9/00 , B22D21/025 , C22F1/08 , H01B1/026
摘要： A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance consisting of pure copper and an inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO2, TiS or Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution. TiO, TiO2, TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are not more than 500 nm or less in particle size.
摘要翻译：稀铜合金材料基于稀铜合金材料的总质量包括2〜12质量ppm的硫，2〜30质量ppm的氧，4〜55质量ppm的钛，余量由纯铜和不可避免的杂质。硫和钛的一部分形成TiO，TiO 2，TiS或Ti-O-S的化合物或聚集体，硫和钛的另一部分形成固溶体。分布在稀铜合金材料的晶粒中的TiO，TiO 2，TiS和Ti-O-S分别不大于200nm，不大于1000nm，不大于200nm且不大于300nm 其粒径分布在稀铜合金材料的晶粒中的90％以上的粒子的粒径为500nm以下。

3. 发明授权

US09234263B2 Weldment 有权
标题翻译：焊接
公开(公告)号：US09234263B2
公开(公告)日：2016-01-12
申请号：US13317463
申请日：2011-10-19
申请人： Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama , Masayoshi Goto , Takahiko Hanada , Takahiro Sato , Hidenori Abe
发明人： Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama , Masayoshi Goto , Takahiko Hanada , Takahiro Sato , Hidenori Abe
IPC分类号： B32B15/20 , C22C9/00 , B23K31/00 , C22C1/02 , C22C1/10 , C22F1/00 , C22F1/08
CPC分类号： C22C9/00 , B23K31/00 , B32B15/20 , C22C1/02 , C22C1/1036 , C22F1/00 , C22F1/08 , Y10T428/1266 , Y10T428/12667 , Y10T428/12882 , Y10T428/12903 , Y10T428/1291
摘要： A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material. The dilute copper alloy material includes the pure copper, more than 2 mass ppm of oxygen, and the additive element,?
摘要翻译：焊件包括彼此焊接的金属材料。至少一种金属材料包括包含不可避免的杂质的纯铜，大于2质量ppm的氧，以及选自Mg，Zr，Nb，Fe，Si，Al，Ca，V，Ni ，Mn，Ti和Cr。一种焊接件的制造方法，其特征在于，以不低于1100℃，不高于1320℃的熔融铜温度，通过SCR连续铸造，熔融稀释的铜合金材料，形成熔融金属从熔融金属中，通过对铸造棒进行热轧而形成稀铜合金构件，并将稀铜合金构件焊接到金属材料上。稀铜合金材料包括纯铜，超过2质量ppm的氧和添加元素，

4. 发明申请

US20120100390A1 Weldment and method of manufacturing the same 有权
标题翻译：焊接及其制造方法
公开(公告)号：US20120100390A1
公开(公告)日：2012-04-26
申请号：US13317463
申请日：2011-10-19
申请人： Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama , Masayoshi Goto , Takahiko Hanada , Takahiro Sato , Hidenori Abe
发明人： Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama , Masayoshi Goto , Takahiko Hanada , Takahiro Sato , Hidenori Abe
IPC分类号： B32B15/20 , B23K31/00
CPC分类号： C22C9/00 , B23K31/00 , B32B15/20 , C22C1/02 , C22C1/1036 , C22F1/00 , C22F1/08 , Y10T428/1266 , Y10T428/12667 , Y10T428/12882 , Y10T428/12903 , Y10T428/1291
摘要： A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material. The dilute copper alloy material includes the pure copper, more than 2 mass ppm of oxygen, and the additive element,
摘要翻译：焊件包括彼此焊接的金属材料。至少一种金属材料包括包含不可避免的杂质的纯铜，大于2质量ppm的氧，以及选自Mg，Zr，Nb，Fe，Si，Al，Ca，V，Ni ，Mn，Ti和Cr。一种焊接件的制造方法，其特征在于，以不低于1100℃，不高于1320℃的熔融铜温度，通过SCR连续铸造，熔融稀释的铜合金材料，形成熔融金属从熔融金属中，通过对铸造棒进行热轧而形成稀铜合金构件，并将稀铜合金构件焊接到金属材料上。稀铜合金材料包括纯铜，大于2质量ppm的氧和添加元素，

5. 发明申请

US20140000932A1 SOFT DILUTE-COPPER ALLOY WIRE, SOFT DILUTE-COPPER ALLOY TWISTED WIRE, AND INSULATED WIRE, COAXIAL CABLE, AND COMPOSITE CABLE USING THESE 有权
标题翻译：软二次铜合金线，软质二次铜合金线，绝缘线，同轴电缆及复合电缆
公开(公告)号：US20140000932A1
公开(公告)日：2014-01-02
申请号：US14005224
申请日：2012-03-16
申请人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
发明人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
IPC分类号： H01B7/04
CPC分类号： H01B7/04 , C22C1/02 , C22C9/00 , C22F1/08 , H01B1/026
摘要： Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 μm or less in a surface layer having a depth of 50 μm from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.
摘要翻译：提供一种柔软的稀铜合金线和软的稀铜铜合金绞线，具有高导电性和高弯曲寿命，并且与无氧铜线相比可以限制使用时的断开，并且还提供了绝缘线，同轴电缆，复合电缆采用软弱铜铜合金线和软铜铜合金绞合线。软铜铜合金线材通过伸长加工进行退火处理，该软质稀铜铜合金材料包含选自由Ti，Mg，Zr，Nb，Ca，V，Ni，Hf组成的组的铜和添加元素， Fe，Mn，Cr等不可避免的杂质作为平衡，其中，软质铜 - 铜合金线的表面的深度为50μm的表面层的平均粒径为20μm以下，伸长率值比经过上述退火处理的无氧铜线的平均伸长率高1％以上。

6. 发明申请

US20120097420A1 Audio/video cable 有权
标题翻译：音频/视频电缆
公开(公告)号：US20120097420A1
公开(公告)日：2012-04-26
申请号：US13317462
申请日：2011-10-19
申请人： Seigi Aoyama , Toru Sumi , Masayoshi Goto
发明人： Seigi Aoyama , Toru Sumi , Masayoshi Goto
IPC分类号： H01B11/02
CPC分类号： H01B1/026
摘要： An audio/video cable includes a plurality of parallel arranged insulated wires or twisted pair insulated wires each including a copper conductor and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains. The surface layer includes a crystal structure such that an average crystal grain size from a surface of the surface layer up to a depth of 50 μm toward inside of the soft dilute copper alloy material is not more than 20 μm.
摘要翻译：音频/视频电缆包括多个平行布置的绝缘电线或双绞线绝缘电线，每根电线包括铜导体和形成在其周边上的绝缘层。铜导体包括含有纯铜，添加元素和不可避免的杂质作为平衡的软的稀铜合金材料。软的稀铜合金材料包括具有表面层中的晶粒小于内部晶粒的晶粒尺寸分布的再结晶结构。表面层包括晶体结构，使得从软表面层的表面到柔性稀铜合金材料的内部的平均晶粒尺寸直到50μm的深度不大于20μm。

7. 发明授权

US10030287B2 Soft-dilute-copper-alloy material, soft-dilute-copper-alloy wire, soft-dilute-copper-alloy sheet, soft-dilute-copper-alloy stranded wire, and cable, coaxial cable and composite cable using same 有权
公开(公告)号：US10030287B2
公开(公告)日：2018-07-24
申请号：US13577400
申请日：2011-02-08
申请人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
发明人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
IPC分类号： C22C9/00 , C22F1/08 , H01B1/02 , B21C1/00 , C22C1/10
摘要： A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 μm in a surface layer up to a depth of 50 μm from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.

8. 发明授权

US09734937B2 Soft dilute-copper alloy wire, soft dilute-copper alloy twisted wire, and insulated wire, coaxial cable, and composite cable using these 有权
公开(公告)号：US09734937B2
公开(公告)日：2017-08-15
申请号：US14005224
申请日：2012-03-16
申请人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
发明人： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
IPC分类号： H01B7/04 , C22C9/00 , H01B1/02 , C22F1/08 , C22C1/02
CPC分类号： H01B7/04 , C22C1/02 , C22C9/00 , C22F1/08 , H01B1/026
摘要： Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 μm or less in a surface layer having a depth of 50 μm from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.

9. 发明授权

US08596333B2 Method of making copper wire rod with low semi-softening temperature, method of making copper wire and copper wire 有权
标题翻译：低半软化温度的铜线棒的制造方法，铜线和铜线的制造方法
公开(公告)号：US08596333B2
公开(公告)日：2013-12-03
申请号：US12659453
申请日：2010-03-09
申请人： Seigi Aoyama , Toru Sumi
发明人： Seigi Aoyama , Toru Sumi
IPC分类号： B22D11/00 , C22B15/00
CPC分类号： B21B1/463 , B21B3/00 , B22D11/0602 , C22C9/00 , C22F1/08
摘要： A method of making a copper wire rod with low semi-softening temperature includes melting a raw material copper to have a copper melt, adjusting concentrations of oxygen and sulfur included in the copper melt to be not more than 20 ppm and not more than 6 ppm, respectively, continuously casting the adjusted copper melt at temperature not higher than 1120° C. to have a cast bar, and hot-rolling the cast bar in a temperature range of 850° C. to 550° C.
摘要翻译：制造低半软化温度的铜线材的方法包括将原料铜熔化成铜熔体，将铜熔体中包含的氧和硫的浓度调节为不大于20ppm且不大于6ppm 分别在不高于1120℃的温度下连续铸造调整后的铜熔体，制成铸棒，在850℃〜550℃的温度范围内进行热轧。

10. 发明申请

US20130022831A1 SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE 审中-公开
标题翻译：软质稀土铜合金线，软质稀土铜合金板和软质稀土铜合金线
公开(公告)号：US20130022831A1
公开(公告)日：2013-01-24
申请号：US13553762
申请日：2012-07-19
申请人： Hideyuki Sagawa , Seigi Aoyama , Hiromitsu Kuroda , Toru Sumi , Keisuke Fujito
发明人： Hideyuki Sagawa , Seigi Aoyama , Hiromitsu Kuroda , Toru Sumi , Keisuke Fujito
IPC分类号： B32B5/02
CPC分类号： H01B1/026 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L2224/05624 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/48824 , H01L2924/00011 , H01L2924/00015 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/10253 , Y10T428/12431 , H01L2224/45664 , H01L2224/45618 , H01L2224/45655 , H01L2224/45644 , H01L2224/45669 , H01L2224/45639 , H01L2924/01022 , H01L2924/0104 , H01L2924/01041 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01024 , H01L2924/00014 , H01L2924/01204 , H01L2924/01205 , H01L2924/20755 , H01L2224/45124 , H01L2924/013 , H01L2924/00 , H01L2924/2011 , H01L2924/01006 , H01L2924/01004 , H01L2924/01033 , H01L2924/01008 , H01L2924/01016
摘要： A soft dilute copper alloy wire is composed of a soft dilute copper alloy material containing an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Cu, V, Ni, Mn, and Cr, and balance comprising Cu. An average size of crystal grains lying from a surface of the soft dilute copper alloy wire at least to a depth of 20% of a wire diameter is not greater than 20 μm.
摘要翻译：软的稀铜合金线由含有选自Ti，Mg，Zr，Nb，Cu，V，Ni，Mn和Cr组成的组的添加元素的软的稀铜合金材料构成，余量为Cu。从软的稀铜合金线的表面至少达到线径的20％的深度的晶粒的平均尺寸不大于20μm。

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