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1. 发明专利

JP2009031117A Heating/cooling module 审中-公开
标题翻译：加热/冷却模块
公开(公告)号：JP2009031117A
公开(公告)日：2009-02-12
申请号：JP2007195354
申请日：2007-07-27
申请人： Sei Hybrid Kk , Seiハイブリッド株式会社
发明人： KIHARA FUMIYUKI , MIKUMO AKIRA , NATSUHARA MASUHIRO , NAKADA HIROHIKO
IPC分类号： G01R31/26 , H01L21/02 , H01L21/66 , H05B3/10 , H05B3/74
摘要： PROBLEM TO BE SOLVED: To provide a heating/cooling module which will not be damaged, even if it is heated or cooled in a short time, whereby a heating amount of a heater for heating a semiconductor chip mounted thereon can be increased.
SOLUTION: This heating/cooling module comprises a ceramics heater 1 for heating an object to be processed mounted thereon, a cooling mechanism 3 for cooling the ceramics heater 1, and a support body 2 placed between the ceramics heater 1 and the cooling mechanism 3. The support body 2 is so configured that a heater-side support body 2a and a cooling mechanism-side support body 2b, made of different materials, are combined. Interposer layers 4, 4 which is to be constituted of a soft material with thermal conductivity of 1 W/mK or larger are, preferably, interposed in between the heater-side support body 2a and the cooling mechanism-side support body 2b and in between the cooling mechanism-side support body 2b and the cooling mechanism 3, respectively.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使在短时间内加热或冷却也能够提供不会损坏的加热/冷却模块，从而可以增加用于加热安装在其上的半导体芯片的加热器的加热量。解决方案：该加热/冷却模块包括用于加热安装在其上的被处理物体的陶瓷加热器1，用于冷却陶瓷加热器1的冷却机构3和放置在陶瓷加热器1和冷却之间的支撑体2 支撑体2构成为，由不同材料构成的加热器侧支撑体2a和冷却机构侧支撑体2b组合。由导热率为1W / mK以上的软质材料构成的插入层4,4优选设置在加热器侧支撑体2a和冷却机构侧支撑体2b之间，冷却机构侧支撑体2b和冷却机构3。版权所有（C）2009，JPO＆INPIT

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