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1. 发明授权

US06854176B2 Process for manufacturing a composite polymeric circuit protection device 有权
标题翻译：制造复合聚合物电路保护装置的方法
公开(公告)号：US06854176B2
公开(公告)日：2005-02-15
申请号：US10017670
申请日：2001-12-12
申请人： Scott Hetherton , Wayne Montoya , Thomas Bruguier , Randy Daering , James Toth , Daniel A. Chandler , Matthew P. Galla
发明人： Scott Hetherton , Wayne Montoya , Thomas Bruguier , Randy Daering , James Toth , Daniel A. Chandler , Matthew P. Galla
IPC分类号： H01C1/14 , H01C7/02 , H01C7/18 , H01C13/02 , H01C17/00 , H01C17/28 , H05K3/00 , H05K3/40 , H01H69/02
CPC分类号： H01C1/1406 , H01C7/021 , H01C7/027 , H01C7/18 , H01C13/02 , H01C17/006 , H01C17/28 , H05K3/0052 , H05K3/403 , Y10T29/49107 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49169 , Y10T29/49798
摘要： A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31,51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior. Additional electrical components may be attached directly to the surface of the device or assembly.
摘要翻译：一种制造复合聚合物电路保护装置的方法，其中提供聚合物组件，然后再分成单独的装置（2）。组件通过提供第一和第二层压板（7,8）制成，每个层压板包括具有至少一个导电表面的层状聚合物元件，在一个层压板上的至少一个导电表面上提供图案，将层压板固定在（1），所述叠层中的至少一个的至少一个导电表面形成所述堆叠的外部导电表面（3），并且在导电表面之间形成多个电连接（31,51）的第一层压体和第二层压体的导电表面。层状聚合物元件可以是PTC导电聚合物组合物，使得由该方法制备的各个装置表现出PTC行为。附加的电气部件可以直接附接到装置或组件的表面。

2. 发明授权

US06640420B1 Process for manufacturing a composite polymeric circuit protection device 有权
标题翻译：制造复合聚合物电路保护装置的方法
公开(公告)号：US06640420B1
公开(公告)日：2003-11-04
申请号：US09395869
申请日：1999-09-14
申请人： Scott Hetherton , Wayne Montoya , Thomas Bruguier , Randy Daering
发明人： Scott Hetherton , Wayne Montoya , Thomas Bruguier , Randy Daering
IPC分类号： H01C702
CPC分类号： H01C1/1406 , H01C7/021 , H01C7/027 , H01C7/18 , H01C13/02 , H01C17/006 , H05K3/0052 , H05K3/403 , Y10T29/49082 , Y10T29/49083 , Y10T29/49085 , Y10T29/49091 , Y10T29/49098 , Y10T29/49101 , Y10T29/49105 , Y10T29/49128 , Y10T156/1092
摘要： A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.
摘要翻译：一种用于制造复合聚合物电路保护装置的方法，其中提供聚合物组件，然后再分成各个装置。该组件通过提供第一和第二层压体制成，每个层压体包括具有至少一个导电表面的层状聚合物元件，在一个层压板上的至少一个导电表面上提供图案，将层叠体固定在所需的叠层中至少一个所述层压体的至少一个导电表面形成所述堆叠的外部导电表面，并且在所述第一层压体的导电表面和所述第二层压体的导电表面之间形成多个电连接。层状聚合物元件可以是PTC导电聚合物组合物，使得由该方法制备的各个装置表现出PTC行为。

3. 发明申请

US20060132277A1 Electrical devices and process for making such devices 审中-公开
标题翻译：电气设备和制造这种设备的过程
公开(公告)号：US20060132277A1
公开(公告)日：2006-06-22
申请号：US11022352
申请日：2004-12-22
申请人： Scott Hetherton , Wayne Montoya , Thomas Bruguier , Randy Daering
发明人： Scott Hetherton , Wayne Montoya , Thomas Bruguier , Randy Daering
IPC分类号： H01F27/28
CPC分类号： H01C17/281 , H01C1/1406 , H01C1/148 , H01C7/027 , H01C7/18
摘要： A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31,51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.
摘要翻译：一种制造复合聚合物电路保护装置的方法，其中提供聚合物组件，然后再分成单独的装置（2）。组件通过提供第一和第二层压板（7,8）制成，每个层压板包括具有至少一个导电表面的层状聚合物元件，在一个层压板上的至少一个导电表面上提供图案，将层压板固定在（1），所述叠层中的至少一个的至少一个导电表面形成所述堆叠的外部导电表面（3），并且在导电表面之间形成多个电连接（31,51）的第一层压体和第二层压体的导电表面。层状聚合物元件可以是PTC导电聚合物组合物，使得由该方法制备的各个装置表现出PTC行为。

4. 发明授权

US07343671B2 Process for manufacturing a composite polymeric circuit protection device 有权
标题翻译：制造复合聚合物电路保护装置的方法
公开(公告)号：US07343671B2
公开(公告)日：2008-03-18
申请号：US10701992
申请日：2003-11-04
申请人： Scott Hetherton , Wayne Montoya , Thomas Bruguier , Randy Daering
发明人： Scott Hetherton , Wayne Montoya , Thomas Bruguier , Randy Daering
IPC分类号： H01C17/00
CPC分类号： H01C1/1406 , H01C7/021 , H01C7/027 , H01C7/18 , H01C13/02 , H01C17/006 , H05K3/0052 , H05K3/403 , Y10T29/49082 , Y10T29/49083 , Y10T29/49085 , Y10T29/49091 , Y10T29/49098 , Y10T29/49101 , Y10T29/49105 , Y10T29/49128 , Y10T156/1092
摘要： A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.
摘要翻译：一种用于制造复合聚合物电路保护装置的方法，其中提供聚合物组件，然后再分成各个装置。该组件通过提供第一和第二层压体制成，每个层压体包括具有至少一个导电表面的层状聚合物元件，在一个层压板上的至少一个导电表面上提供图案，将层叠体固定在所需的叠层中至少一个所述层压体的至少一个导电表面形成所述堆叠的外部导电表面，并且在所述第一层压体的导电表面和所述第二层压体的导电表面之间形成多个电连接。层状聚合物元件可以是PTC导电聚合物组合物，使得由该方法制备的各个装置表现出PTC行为。

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