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1. 发明授权

US08471380B2 Fluid cooled encapsulated microelectronic package 有权
公开(公告)号：US08471380B2
公开(公告)日：2013-06-25
申请号：US13229077
申请日：2011-09-09
申请人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
发明人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
IPC分类号： H01L23/46
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/0401
摘要： An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.

2. 发明授权

US08026597B2 Fluid cooled encapsulated microelectronic package 有权
标题翻译：流体冷却封装的微电子封装
公开(公告)号：US08026597B2
公开(公告)日：2011-09-27
申请号：US12316982
申请日：2008-12-17
申请人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
发明人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
IPC分类号： H01L23/46
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/0401
摘要： An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.
摘要翻译：封装的微电子封装包括直接耦合到一个或多个半导体芯片的流体传导冷却管，其中密封剂模制在半导体芯片上并且冷却管的靠近半导体芯片的部分。密封剂相对于半导体芯片固定冷却管，并且冷却管和密封剂设计成使其相对于半导体芯片的热膨胀系数的差异最小化。

3. 发明授权

US07364684B2 Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels 有权
标题翻译：制造具有流体携带密封剂通道的封装微电子封装的方法
公开(公告)号：US07364684B2
公开(公告)日：2008-04-29
申请号：US10919156
申请日：2004-08-16
申请人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
发明人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
IPC分类号： B29C45/14 , B28B7/30
CPC分类号： B29C45/14655 , B29C45/7207 , H01L23/4334 , H01L23/473 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are defined in part by heat producing components of the package so that coolant fluid directly contacts such components. The coolant fluid can be electrically conductive or non-conductive depending on the type of components being cooled. The coolant channels are formed by insert-molding a form in the encapsulant, and removing the form following the molding process. Alternately, the encapsulant is formed in two or more pieces that are joined to form the package, and the coolant channels are defined by recesses formed in at least one of the encapsulant pieces.
摘要翻译：一种制造流体冷却的微电子封装的方法，其中流体在至少部分地由围绕封装部件的密封剂中的空隙限定的流体输送通道中循环通过封装。优选地，密封剂通道部分地由包装的发热部件限定，使得冷却剂流体直接接触这些部件。取决于被冷却的部件的类型，冷却剂流体可以是导电的或不导电的。冷却剂通道通过将形式嵌入模塑在密封剂中而形成，并且在模制过程之后移除形式。替代地，密封剂形成为两个或更多个片段，其被连接以形成封装，并且冷却剂通道由形成在至少一个密封剂片中的凹部限定。

4. 发明申请

US20090108439A1 Fluid cooled encapsulated microelectronic package 有权
标题翻译：流体冷却封装的微电子封装
公开(公告)号：US20090108439A1
公开(公告)日：2009-04-30
申请号：US12316982
申请日：2008-12-17
申请人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
发明人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
IPC分类号： H01L23/46 , H01L23/34
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/0401
摘要： An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.
摘要翻译：封装的微电子封装包括直接耦合到一个或多个半导体芯片的流体传导冷却管，其中密封剂模制在半导体芯片上并且冷却管的靠近半导体芯片的部分。密封剂相对于半导体芯片固定冷却管，并且冷却管和密封剂设计成使其相对于半导体芯片的热膨胀系数的差异最小化。

5. 发明授权

US07485957B2 Fluid cooled encapsulated microelectronic package 有权
公开(公告)号：US07485957B2
公开(公告)日：2009-02-03
申请号：US11654318
申请日：2007-01-17
申请人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
发明人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
IPC分类号： H01L23/46
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/0401
摘要： An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.

6. 发明授权

US07205653B2 Fluid cooled encapsulated microelectronic package 有权
标题翻译：流体冷却封装的微电子封装
公开(公告)号：US07205653B2
公开(公告)日：2007-04-17
申请号：US10919625
申请日：2004-08-17
申请人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
发明人： Scott D. Brandenburg , Suresh K. Chengalva , Thomas A. Degenkolb
IPC分类号： H01L23/10 , H01L23/14 , H01L23/34
CPC分类号： H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/0401
摘要： An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.
摘要翻译：封装的微电子封装包括直接耦合到一个或多个半导体芯片的流体传导冷却管，其中密封剂模制在半导体芯片上并且冷却管的靠近半导体芯片的部分。密封剂相对于半导体芯片固定冷却管，并且冷却管和密封剂设计成使其相对于半导体芯片的热膨胀系数的差异最小化。

7. 发明授权

US07440282B2 Heat sink electronic package having compliant pedestal 有权
标题翻译：散热片电子封装，具有合适的基座
公开(公告)号：US07440282B2
公开(公告)日：2008-10-21
申请号：US11434644
申请日：2006-05-16
申请人： Scott D. Brandenburg , Suresh K. Chengalva , David W. Zimmerman
发明人： Scott D. Brandenburg , Suresh K. Chengalva , David W. Zimmerman
IPC分类号： H05K7/20
CPC分类号： H01L23/3675 , H01L21/563 , H01L24/72 , H01L25/0655 , H01L25/072 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a thermally conductive heat sink assembled over the electronic device. The heat sink includes compliant pedestals each having a contact surface for contacting a surface of an electronic device to conduct thermal energy away from the electronic device. The package is held together such that the heat sink is in contact with the surface of an electronic device such that each compliant pedestal applies a compressive force to the surface of the electronic device.
摘要翻译：提供了一种用于从电子设备散热的电子封装。该封装包括基板和安装在基板上的电子器件。该封装还具有组装在电子设备上的导热散热器。散热器包括柔性基座，每个基座具有用于接触电子设备的表面以将热能远离电子设备的接触表面。封装被保持在一起，使得散热器与电子设备的表面接触，使得每个柔性基座对电子设备的表面施加压缩力。

8. 发明授权

US07307841B2 Electronic package and method of cooling electronics 有权
公开(公告)号：US07307841B2
公开(公告)日：2007-12-11
申请号：US11191822
申请日：2005-07-28
申请人： Carl W. Berlin , Suresh K. Chengalva , Scott D. Brandenburg , Bruce A. Myers
发明人： Carl W. Berlin , Suresh K. Chengalva , Scott D. Brandenburg , Bruce A. Myers
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/473 , H01L23/44 , H01L2224/16225 , H01L2224/48091 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H05K7/20236 , H05K7/20909 , H01L2924/00014 , H01L2924/00
摘要： An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, such as a liquid, is located in the housing in heat transfer relationship with the electronic devices. A fluid circulator, such as a piezo fan, is located in the housing in contact with the dielectric liquid for circulating the dielectric liquid to cool the electronic devices.

9. 发明授权

US07230832B2 Cooled electronic assembly and method for cooling a printed circuit board 有权
标题翻译：冷却电子组件和冷却印刷电路板的方法
公开(公告)号：US07230832B2
公开(公告)日：2007-06-12
申请号：US11155371
申请日：2005-06-17
申请人： Scott D. Brandenburg , Suresh K. Chengalva
发明人： Scott D. Brandenburg , Suresh K. Chengalva
IPC分类号： H05K7/20 , F16L39/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board.
摘要翻译：冷却的电子组件包括集成电路器件载体（例如印刷电路板），器件（例如倒装芯片），液体泵，成型材料，热交换器和盖。该装置和液体泵电连接到集成电路装置载体。模制材料被模制到装置，液体泵和集成电路装置载体上。盖具有流体地连接到热交换器的冷却剂通道，其中盖附接到模制材料。冷却剂通道和热交换器一起至少部分地限定了封闭的冷却剂回路。液体泵可操作地连接到封闭的冷却剂回路。一种用于冷却印刷电路板的方法包括将液体冷却剂放置在封闭的冷却剂回路中并通过印刷电路板电激活液体泵。

10. 发明授权

US06807731B2 Method for forming an electronic assembly 有权
标题翻译：电子组件的形成方法
公开(公告)号：US06807731B2
公开(公告)日：2004-10-26
申请号：US10114658
申请日：2002-04-02
申请人： Scott D. Brandenburg , Bruce A. Myers , Jeenhuei S. Tsai , Suresh K. Chengalva
发明人： Scott D. Brandenburg , Bruce A. Myers , Jeenhuei S. Tsai , Suresh K. Chengalva
IPC分类号： H05K330
CPC分类号： H05K5/065 , H05K1/0203 , H05K3/284 , H05K9/0045 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49171 , Y10T29/49172
摘要： An overmolded electronic assembly having an electromagnetic interference shield, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body. The shield effectively reduces the amount of electromagnetic interference (“EMI”) emissions from penetrating within the assembly to the circuit board without substantially increasing the cost of the unit. Thus, an electronic assembly having improved vibration, moisture, and EMI emission resistance is achieved as compared with traditional overmolded or metal assemblies. Further, because the shield can be formed on the electronic assembly in one continuous processing step, a substantial savings in time and cost for the manufacturing process is also realized.
摘要翻译：一种包覆成型的电子组件，其具有金属薄膜或薄片形式的电磁干扰屏蔽件，该电磁干扰屏蔽件耦合到包覆成型体的顶部或内部。屏蔽有效地减少了组件内电路干扰（“EMI”）的发射量，而不会大大增加设备的成本。因此，与传统的包覆成型或金属组件相比，实现了具有改善的振动，湿度和EMI排放电阻的电子组件。此外，由于可以在一个连续的处理步骤中在电子组件上形成屏蔽，所以也实现了制造过程的显着节省时间和成本。

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