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1. 发明专利

JP2010074167A Led light source having collimation optical element 有权
标题翻译：具有收缩光学元件的LED光源
公开(公告)号：JP2010074167A
公开(公告)日：2010-04-02
申请号：JP2009216627
申请日：2009-09-18
申请人： Schott Ag , ショットアクチエンゲゼルシャフトSchott AG
发明人： REICHEL STEFFEN , BIERTUEMPFEL RALF , VOGT HELGE
IPC分类号： H01L33/58 , G02B3/00 , G02B3/02 , G02B13/00
CPC分类号： G02B3/0031 , G02B3/0056
摘要： PROBLEM TO BE SOLVED: To provide a LED light source having a successful collimation effect. SOLUTION: The LED light source comprises a preferably aspheric glass lens having an aspect ratio of more than 0.1. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供具有成功的准直效果的LED光源。解决方案：LED光源包括具有大于0.1的纵横比的优选非球面玻璃透镜。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2007182372A Method for producing glass component having structured surface 审中-公开
标题翻译：用于生产具有结构化表面的玻璃组分的方法
公开(公告)号：JP2007182372A
公开(公告)日：2007-07-19
申请号：JP2006344697
申请日：2006-12-21
申请人： Schott Ag , ショットアクチエンゲゼルシャフトSchott AG
发明人： WOLFING BERND , BIERTUEMPFEL RALF
IPC分类号： C03B11/00 , C03B11/08 , G02B3/00
CPC分类号： C03B23/02 , C03B11/082 , C03B2215/414
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a glass component having a structured surface which is easy, enables the production of a high cost effect and is suitable for mass production.
SOLUTION: The method for producing a glass component having a structured surface is disclosed, wherein a form (10) is provided having a surface (20) from which at least one recess (16) extends, a glass substrate (12) is placed on the surface (20) of the form (10), is heated to a temperature above the glass transition temperature T
g and is pressed against the surface (20) of the form (10), to thereby generate a protrusion (18) at the glass substrate (12) without giving contact to the bottom of the recess (16).
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种容易制造具有结构化表面的玻璃组分的方法，能够实现高成本效果的生产并且适于批量生产。公开了一种具有结构化表面的玻璃部件的制造方法，其中，提供具有至少一个凹部（16）延伸的表面（20）的形式（10），玻璃基板（12）被放置在形式（10）的表面（20）上，被加热到高于玻璃化转变温度T SB SB的温度，并压靠在形式（10）的表面（20）上，从而在玻璃基板（12）处产生不与凹部（16）的底部接触的突起（18）。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007308366A Method for manufacturing glass-ceramic article with improved surface 审中-公开
标题翻译：用改进的表面制造玻璃陶瓷制品的方法
公开(公告)号：JP2007308366A
公开(公告)日：2007-11-29
申请号：JP2007130731
申请日：2007-05-16
申请人： Schott Ag , ショットアクチエンゲゼルシャフトSchott AG
发明人： WOELFING BERND , BIERTUEMPFEL RALF , BONITZ RALF , SEMAR WOLFGANG , SCHAEFER MARTIN , HAHN MICHAEL , SURGES NICOLE , BEST REINER , KRAUS THOMAS
IPC分类号： C03B29/08 , C03B32/02
CPC分类号： C03B29/08 , C03B13/04 , C03B32/02 , Y02P40/57
摘要： PROBLEM TO BE SOLVED: To provide a glass ceramic article with an improved surface with regard to roughness. SOLUTION: In a method for producing a glass ceramic panel (40), a green glass panel (10) is produced by hot forming and the green glass panel (10) is subsequently ceramized to form a glass ceramic, and the green glass panel (10) is fire-polished on at least one surface (11, 12) before or during the ceramizing. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种相对于粗糙度而具有改进的表面的玻璃陶瓷制品。解决方案：在玻璃陶瓷面板（40）的制造方法中，通过热成型制造绿色玻璃面板（10），然后将绿色玻璃面板（10）陶瓷化以形成玻璃陶瓷，并且绿色玻璃板（10）在陶瓷化之前或期间在至少一个表面（11,12）上进行火抛光。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007186415A Method and apparatus for manufacturing optical component by thermal molding 有权
标题翻译：用于通过热模制造光学元件的方法和装置
公开(公告)号：JP2007186415A
公开(公告)日：2007-07-26
申请号：JP2007003992
申请日：2007-01-12
申请人： Schott Ag , ショットアクチエンゲゼルシャフトSchott AG
发明人： BIERTUEMPFEL RALF , WOELFING BERND , SEMAR WOLFGANG
IPC分类号： C03B11/00 , C03B11/08 , G02B3/00
CPC分类号： C03B11/08 , C03B23/22 , C03B2215/414 , C03B2215/46 , C03B2215/60 , C03B2215/80
摘要： PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing an optical component from glass by which a very small optical component is easily handled and a pressing material is precisely positioned. SOLUTION: The method of manufacturing the optical component includes a step for introducing a glass fiber into a press metallic mold having at least 2 half dies and at least one press surface area for an optical element and tightly closing the metallic mold, a step for heating the metallic mold and the fiber until the temperature of the fiber outside area and the metallic mold reaches a pressing temperature, a step for blank-pressing the fiber to obtain the glass component having the optical element, a step for cooling the glass component so as to be less than a transition temperature Tg, and a step for taking out the glass component manufactured by blank pressing. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种从玻璃制造光学部件的方法和装置，通过该方法和装置可以容易地处理非常小的光学部件并且精确定位加压材料。解决方案：制造光学部件的方法包括将玻璃纤维引入具有至少2个半模的压模金属模具和用于光学元件的至少一个压制表面积并紧密地关闭金属模具的步骤将金属模具和纤维加热直到纤维外部区域和金属模具的温度达到压制温度的步骤，用于坯料压制纤维以获得具有光学元件的玻璃部件的步骤，用于冷却玻璃的步骤组分以小于转变温度Tg，以及取出通过坯料压制制造的玻璃组分的步骤。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2005320232A Method and apparatus for forming optical element, substrate and forming die 有权
标题翻译：用于形成光学元件，基板和成型模具的方法和装置
公开(公告)号：JP2005320232A
公开(公告)日：2005-11-17
申请号：JP2005125866
申请日：2005-04-25
申请人： Schott Ag , ショットアクチエンゲゼルシャフト
发明人： WOELFING BERND , PAWLOWSKI EDGAR , STOEHR ULRIKE , BIERTUEMPFEL RALF
IPC分类号： G02B3/00 , B29C43/02 , B29D11/00 , C03B11/00 , C03B11/08 , G02B3/02 , G02B5/18
CPC分类号： B29D11/00 , B29C43/021 , B29D11/00317 , B29D11/00365 , B29D11/00769 , B29L2011/0016 , C03B11/08 , C03B11/082 , C03B2215/41 , C03B2215/412 , C03B2215/65 , G02B5/18 , Y10S425/808 , Y10T428/24479
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for the thermal forming of an optical element where gas sealing at thermal forming can be efficiently prevented, the occurrence of a crater-like structure caused by it is controlled and the optical element can be produced more precisely and at an efficient cost. SOLUTION: The surface of a die 1 is shaped to be a recessed cavity 3 and a substrate 10, for example a glass preform, is shaped to be a projected and curved part 16. The curvature radius of the recessed cavity 3 is longer than that of the projected and curved part 16. The die 1 and the substrate 10 are pressed each other at the thermal forming and the interface between the substrate and the die and a process gas moves gradually from a central part 11 to the die 1 and the substrate 10 and then all process gases are exhausted from an annular gap between the die 1 and the substrate 10. The crater-like structure caused by the gas sealing at the thermal forming does not exist on the projected and curved surface 21 at the optical element 20. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种用于热成型的方法和装置，其中可以有效地防止在热成形下的气体密封，由此引起的火山口状结构的发生被控制，并且光学元件可以更精确地并且以有效的成本生产。解决方案：模具1的表面被成形为凹腔3，并且诸如玻璃预制件的基板10被成形为突出和弯曲的部分16.凹腔3的曲率半径为比投射和弯曲部分16的长度更长。模具1和基板10在热成型和基板与模具之间的界面处被彼此挤压，并且处理气体从中心部分11逐渐移动到模具1 并且然后所有处理气体从模具1和基板10之间的环形间隙排出。由热成型时的气体密封引起的火山口状结构不存在于投影和弯曲表面21上光学元件20.版权所有（C）2006，JPO＆NCIPI

6. 发明申请

WO2008006504A3 METHOD FOR PRODUCING OPTOELECTRONIC COMPONENTS AND CORRESPONDINGLY PRODUCED PRODUCTS 审中-公开
标题翻译：用于制造光电子器件，因此生产的商品
公开(公告)号：WO2008006504A3
公开(公告)日：2008-06-19
申请号：PCT/EP2007005955
申请日：2007-07-05
申请人： SCHOTT AG , PAWLOWSKI EDGAR , BIERTUEMPFEL RALF , WOELFING BERND , FLEISSNER FRANK , AUCHTER-KRUMMEL PETRA , BRAUNECK ULF , HAYDEN JOSEPH S , FOTHERINGHAM ULRICH
发明人： PAWLOWSKI EDGAR , BIERTUEMPFEL RALF , WOELFING BERND , FLEISSNER FRANK , AUCHTER-KRUMMEL PETRA , BRAUNECK ULF , HAYDEN JOSEPH S , FOTHERINGHAM ULRICH
IPC分类号： H01L27/146 , C03B11/08 , C03C19/00
CPC分类号： H01L27/14625 , C03B11/082 , C03B17/06 , C03B2215/05 , C03B2215/414 , C03C17/02 , C03C19/00 , H01L27/14618 , H01L27/1462 , H01L27/14621 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L27/15 , H01L31/0203 , H01L31/0232 , H01L31/02325 , H01L33/005 , H01L33/58 , H01L2924/0002 , H01L2933/0058 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , H01L2924/00
摘要： The invention relates to the production of optoelectronic components, whereby optical components are applied to the wafer composite. For this purpose, the invention provides a method for producing optoelectronic components, especially image signal-detecting or image signal-transmitting components. According to said method, optical components are made available, picked up and placed on a wafer, the optical components being preferably positioned either one by one or in groups relative to the position of associated optoelectronic or optical components of the wafer or of the wafer to be connected therewith.
摘要翻译：本发明涉及生产光电元件，所述光学组件在晶片复合体施加。为了这个目的，在制造光电元件的方法，特别是图像信号检测或-gebender部件被提供，其中每个都设置，记录和放置晶片，其中，所述光学部件优选各自单独使用或以相对于光电或光学的位置组相关联的光学元件晶片或部件被定位这是贴合晶片。

7. 发明申请

WO2008006418A8 METHOD FOR PACKAGING COMPONENTS 审中-公开
标题翻译：方法包装零部件的
公开(公告)号：WO2008006418A8
公开(公告)日：2010-10-07
申请号：PCT/EP2007004602
申请日：2007-05-24
申请人： SCHOTT AG , MUND DIETRICH , SEIDEMANN VOLKER , PAWLOWSKI EDGAR , BIERTUEMPFEL RALF , WOELFING BERND , FLEISSNER FRANK , AUCHTER-KRUMMEL PETRA , BRAUNECK ULF , HAYDEN JOSEPH S , FOTHERINGHAM ULRICH
发明人： MUND DIETRICH , SEIDEMANN VOLKER , PAWLOWSKI EDGAR , BIERTUEMPFEL RALF , WOELFING BERND , FLEISSNER FRANK , AUCHTER-KRUMMEL PETRA , BRAUNECK ULF , HAYDEN JOSEPH S , FOTHERINGHAM ULRICH
IPC分类号： H01L21/56
CPC分类号： B81C1/00333 , H01L21/50 , H01L21/6835 , H01L27/14618 , H01L2221/68363 , H01L2924/16235
摘要： The invention relates to a method for producing packaged components. In this case, the invention is based on the object of making it easier to put on covers having lateral dimensions which are smaller than the lateral dimensions of the parts removed from the functional substrate, such as particularly from a functional wafer. To this end, a plate-like top substrate is mounted on a support substrate. Trenches are then added on the exposed side of the plate-like top substrate which divide the plate-like top substrate, so that a composite part is obtained having the support substrate and individual top parts which are isolated from one another by the trenches but which are connected to one another by means of the support substrate. The top parts of the composite part are connected to a functional substrate having a multiplicity of components, so that the trenches run along isolation areas on the functional substrate between functional areas of the components, and the top parts cover the functional areas. The connection between the top parts and the support substrate is then broken and the support substrate is removed, so that a composite is obtained having the functional substrate and a multiplicity of top parts which cover functional areas.
摘要翻译：本发明涉及一种用于封装部件的制备方法。本发明是基于盖的应用与横向尺寸是较小的，以促进比由功能晶片零件从基板分离这样的特定功能的横向尺寸的物体上。为此，板örmiges覆盖基板被安装在载体基板上。然后有被使得与载体衬底，并通过彼此分离沟槽中的个体，但所述支撑基板上而得到的复合部件接合盖部件被分离板状盖基板插入在板形盖基板的沟槽的暴露侧。复合部件的盖部分被连接到具有多个部件的功能性基板，使得沿着分割区域中的沟槽的部件的覆盖所述功能区域中的功能区域和覆盖部件之间的功能性基板上延伸然后覆盖部分与所述支撑基板和所述支撑基板解决了化合物去除，使得复合与功能基板和多个覆盖的功能区域覆盖的部分，被获得。

8. 发明专利

DE102004038727A1 未知
公开(公告)号：DE102004038727A1
公开(公告)日：2006-02-23
申请号：DE102004038727
申请日：2004-08-10
申请人： SCHOTT AG
发明人： BIERTUEMPFEL RALF , ROSANKA PIOTR , STOEHR ULRIKE , WOELFING BERND , SEMAR WOLFGANG , LEIB JUERGEN
IPC分类号： B29D11/00 , G02B3/00 , G02B3/02

9. 发明专利

NL2003523C LED LIGHT SOURCE WITH COLLIMATION OPTICS. 未知
公开(公告)号：NL2003523C
公开(公告)日：2010-06-17
申请号：NL2003523
申请日：2009-09-22
申请人： SCHOTT AG
发明人： REICHEL STEFFEN , BIERTUEMPFEL RALF , VOGT HELGE
IPC分类号： G02B3/00
CPC分类号： G02B3/0031 , G02B3/0056

10. 发明专利

DE102006032047A1 Optoelectronic component e.g. image signal-detecting component, manufacturing method for e.g. digital fixed image camera, involves positioning components either one by one or in groups relative to position of associated components of wafer 未知
公开(公告)号：DE102006032047A1
公开(公告)日：2008-01-24
申请号：DE102006032047
申请日：2006-07-10
申请人： SCHOTT AG
发明人： PAWLOWSKI EDGAR , BIERTUEMPFEL RALF , WOELFING BERND , FLEISSNER FRANK , AUCHTER-KRUMMEL PETRA , BRAUNECK ULF , HAYDEN JOSEPH S , FOTHERINGHAM ULRICH
IPC分类号： H01L31/0232 , H01L27/146 , H01L33/00
摘要： The method involves providing optical components, and receiving and placing the components on a glass wafer (13), where the component is a plane-parallel substrate and has spectrally filtered characteristics and ultraviolet (UV) and/or infrared (IR) blocking properties. The components are positioned either one by one or in groups relative to the position of associated optoelectronic or optical components of the wafer or the wafer to be connected with the components. An independent claim is also included for a method of packing an optoelectronic component.

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