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    • 1. 发明授权
    • Damping material and method for production thereof
    • 阻尼材料及其制造方法
    • US08198362B2
    • 2012-06-12
    • US12065107
    • 2006-08-28
    • Satoshi YoshinakaTakeo HayashiKazuaki MukasaTakuya MinezakiTakao Ota
    • Satoshi YoshinakaTakeo HayashiKazuaki MukasaTakuya MinezakiTakao Ota
    • C08L67/00C08K9/04
    • C08K3/34C08K3/04C08L67/02C08L91/06
    • Provided is a vibration damping material comprising: a polyester resin containing dicarboxylic acid constitutional units and diol constitutional units; and mica being dispersed in the polyester resin, wherein: (1) a ratio [(A1+B1)/(A0+B0)] of a total of (A1) a number of the dicarboxylic acid constitutional units having an odd number of carbon atoms in a polyester main chain and (B1) a number of the diol constitutional units having an odd number of carbon atoms in the polyester main chain with respect to a total of (A0) a number of total dicarboxylic acid constitutional units and (B0) a number of total diol constitutional units in the polyester resin is in the range of 0.5 to 1; and (2) an average particle diameter calculated from a volume-based particle diameter frequency distribution of the mica in the vibration damping material is 25 to 500 μm. The damping material has a high versatility, is lightweight, shows an excellent vibration damping property and can be produced easily with a batch mixer.
    • 本发明提供一种振动阻尼材料,其特征在于:含有二羧酸结构单元和二醇结构单元的聚酯树脂; 和云母分散在聚酯树脂中,其中:(1)(A1)与奇数碳的二羧酸结构单元的数量的比例[(A1 + B1)/(A0 + B0)] 聚酯主链中的原子和(B1)聚酯主链中具有奇数个碳原子的二醇结构单元相对于总二羧酸结构单元的总数(A0)和(B0) 聚酯树脂中的总二醇结构单元数为0.5〜1的范围; 和(2)由减振材料中的云母的基于体积的粒径频率分布计算出的平均粒径为25〜500μm。 阻尼材料具有很高的通用性,重量轻,显示出优异的振动阻尼性能,可以通过间歇式搅拌机轻松生产。
    • 2. 发明申请
    • DAMPING MATERIAL AND METHOD FOR PRODUCTION THEREOF
    • 阻尼材料及其生产方法
    • US20090278293A1
    • 2009-11-12
    • US12065107
    • 2006-08-28
    • Satoshi YoshinakaTakeo HayashiKazuaki MukasaTakuya MinezakiTakao Ota
    • Satoshi YoshinakaTakeo HayashiKazuaki MukasaTakuya MinezakiTakao Ota
    • F16F15/02C08K3/34H01B1/20
    • C08K3/34C08K3/04C08L67/02C08L91/06
    • Provided is a vibration damping material comprising: a polyester resin containing dicarboxylic acid constitutional units and diol constitutional units; and mica being dispersed in the polyester resin, wherein: (1) a ratio [(A1+B1)/(A0+B0)] of a total of (A1) a number of the dicarboxylic acid constitutional units having an odd number of carbon atoms in a polyester main chain and (B1) a number of the diol constitutional units having an odd number of carbon atoms in the polyester main chain with respect to a total of (A0) a number of total dicarboxylic acid constitutional units and (B0) a number of total diol constitutional units in the polyester resin is in the range of 0.5 to 1; and (2) an average particle diameter calculated from a volume-based particle diameter frequency distribution of the mica in the vibration damping material is 25 to 500 μm. The damping material has a high versatility, is lightweight, shows an excellent vibration damping property and can be produced easily with a batch mixer.
    • 本发明提供一种振动阻尼材料,其特征在于:含有二羧酸结构单元和二醇结构单元的聚酯树脂; 和云母分散在聚酯树脂中,其中:(1)(A1)与奇数碳的二羧酸结构单元的数量的比例[(A1 + B1)/(A0 + B0)] 聚酯主链中的原子和(B1)聚酯主链中具有奇数个碳原子的二醇结构单元相对于总二羧酸结构单元的总数(A0)和(B0) 聚酯树脂中的总二醇结构单元数为0.5〜1的范围; 和(2)从振动阻尼材料中的云母的基于体积的粒径频率分布计算出的平均粒径为25〜500μm。 阻尼材料具有很高的通用性,重量轻,显示出优异的振动阻尼性能,可以通过间歇式搅拌机轻松生产。
    • 3. 发明授权
    • Cyclohexanetricarboxylic monoester and its use
    • 环己烷单酯及其用途
    • US07323522B2
    • 2008-01-29
    • US10912048
    • 2004-08-06
    • Ryuji IdenoTakeshi KoyamaAtsushi OkoshiTakao Ota
    • Ryuji IdenoTakeshi KoyamaAtsushi OkoshiTakao Ota
    • C08L63/00B32B27/38H01L21/56
    • C08F222/1006Y10T428/31511
    • The cyclohexanetricarboxylic monoester of the present invention is represented by the following formula 1: wherein R is as defined in the specification. The cyclohexanetricarboxylic monoester is useful particularly as the curing agent for epoxy-containing compounds. A heat-curable resin composition comprising the cyclohexanetricarboxylic monoester and an epoxy-containing compound exhibits an excellent curability without using a curing accelerator and provides a colorless transparent cured product which is little discolored even under a long-term exposure to high-temperature conditions. Such a heat-curable resin composition is suitable as sealing materials for photoelectric transducers such as blue LED and white LED, shaped articles, coating materials, adhesives, etc.
    • 本发明的环己烷三羧酸单酯由下式1表示:其中R如说明书中所定义。 环己烷三羧酸单酯特别用作含环氧化合物的固化剂。 包含环己烷三羧酸单酯和含环氧化合物的热固化树脂组合物在不使用固化促进剂的情况下表现出优异的固化性,并提供即使在长期暴露于高温条件下几乎不变色的无色透明固化产物。 这种热固化性树脂组合物适用于蓝色LED和白色LED,成型制品,涂料,粘合剂等光电换能器的密封材料。
    • 5. 发明授权
    • Wiring-device mounting structure
    • 接线装置安装结构
    • US4733330A
    • 1988-03-22
    • US18397
    • 1987-02-25
    • Sadamasa TanakaTakao OtaMasaaki Nakamura
    • Sadamasa TanakaTakao OtaMasaaki Nakamura
    • H02G3/12H02B1/10
    • H02G3/121Y10S248/906
    • A wiring-device mounting structure wherein outer decorative and inner laying plates are coupled to each other through relatively short, hooked engaging projections on inner surface of the decorative plate which are engaged with mounds on the laying plate which are raised to be close at raised top face to the inner surface of the decorative plate when coupled and to provide at side wall a locking face for hooked ends of the projections, whereby the raised mounds positioned in coupling zone between the both plates can minimize coupling distance between them and also the length of the engaging projections, so as to maintain the projections to be highly durable.
    • 一种布线装置安装结构,其中外装饰和内衬板通过装饰板内表面上的相对较短的钩形接合突起彼此联接,所述接合突起与铺设板上的凸起接合,所述凸起被升高以接近凸起顶部 面对装饰板的内表面,并且在侧壁处设置用于突出部的钩状端部的锁定面,由此,位于两个板之间的联接区域中的凸起的土丘可以使它们之间的耦合距离最小化, 接合突起,以便将突起保持为高耐用性。
    • 6. 发明申请
    • Curing Agent for Epoxy Resins and Epoxy Resin Compositions
    • 环氧树脂固化剂和环氧树脂组合物
    • US20080306223A1
    • 2008-12-11
    • US11629187
    • 2005-05-17
    • Atsushi OkoshiRyuji IdenoTakao Ota
    • Atsushi OkoshiRyuji IdenoTakao Ota
    • C08L63/00C09K3/00
    • C08G59/4215C08L63/00
    • A curing agent for epoxy resins which comprises cyclohexanetricarboxylic acid anhydride (A) comprising trans,trans-1,2,4-cyclohexanetricarboxylic acid 1,2-anhydride expressed by formula (1) and aliphatic dicarboxylic acid anhydride (B) and an epoxy resin composition which comprises the curing agent and an epoxy resin are provided. The curing agent of the present invention can be handled easily since the curing agent is liquid at the ordinary temperature, exhibits an excellent curing property without addition of a curing accelerator and provides a cured product of an epoxy resin exhibiting excellent transmission of light and heat stability. The epoxy resin composition can be advantageously used for coating materials, adhesives, molded products, resins for encapsulating photo-semiconductors and coating fluids for protective films of color filters constituting liquid crystal display devices (LCD), solid state imaging devices (CCD) and electroluminescence (EL) devices.
    • 环氧树脂固化剂,其包含由式(1)表示的反式,反式-1,2,4-环己烷三羧酸1,2-酐和脂族二羧酸酐(B)的环己烷三羧酸酐(A)和环氧树脂 提供了包含固化剂和环氧树脂的组合物。 本发明的固化剂可以容易地处理,因为固化剂在常温下为液体,在不加入固化促进剂的情况下表现出优异的固化性能,并且提供具有优异的光和热稳定性透过性的环氧树脂的固化产物 。 环氧树脂组合物可以有利地用于涂覆材料,粘合剂,模塑产品,用于封装光半导体的树脂和用于构成液晶显示装置(LCD),固态成像装置(CCD)和电致发光的彩色滤光片的保护膜的涂布液 (EL)设备。
    • 7. 发明授权
    • Injection molding apparatus for molding multi-layered articles
    • 用于成型多层制品的注塑设备
    • US06322344B1
    • 2001-11-27
    • US09158537
    • 1998-09-22
    • Katsuya MaruyamaTakeshi HaraYoshihiro TeradaTakao Ota
    • Katsuya MaruyamaTakeshi HaraYoshihiro TeradaTakao Ota
    • B29C4513
    • B29C45/1643B29B2911/1402B29B2911/14026B29B2911/1404B29B2911/1408B29B2911/14086B29B2911/14093B29B2911/1412B29B2911/14126B29B2911/14146B29B2911/14153B29B2911/14593B29B2911/14653B29B2911/14713B29C45/1603B29C45/1646
    • An injection molding apparatus for injection molding a multi-layered article is disclosed. The apparatus comprises; (a) a mold having a cavity block provided with a cavity and a hot runner block, (b) at least a first injection cylinder and a second injection cylinder, (c) a first resin-flow-passage for connecting an inside of the first injection cylinder and the cavity, and (d) a second resin-flow-passage for connecting an inside of the second injection cylinder and the cavity. The injection molding apparatus has a structure in which those portions of the first and second resin-flow-passages which are located within the mold are provided in the hot runner block, and the first resin-flow-passage and the second resin-flow-passage meet with each other in a junction portion upstream to a gate portion opened to the cavity. The injection molding apparatus is provided with a back flow device for letting first molten resin in the first resin-flow-passage flow into the second resin-flow-passage after second molten resin is injected into the cavity through the second resin-flow-passage. The back flow device is operable in response to pressure which the first molten resin in the first resin-flow-passage exerts on second molten resin in the second resin-flow-passage.
    • 公开了一种注射成型多层制品的注射成型装置。 该装置包括: (a)模具,其具有设置有空腔的模腔和热流道块,(b)至少第一注射缸和第二注射缸,(c)第一树脂流动通道,用于连接 第一注射缸和空腔,以及(d)用于连接第二注射缸和腔的内部的第二树脂流动通道。 注射成型装置具有这样的结构,其中位于模具内的第一和第二树脂流动通道的那些部分设置在热流道块中,并且第一树脂流动通道和第二树脂流动通道的第二树脂流动通道, 通道在开口于腔的门部分的上游的接合部分中相互相遇。 注射成型装置设置有后向流动装置,用于在第二树脂流动通道中将第一熔融树脂通过第二树脂流动通道注入第二树脂流动通道之后进入第二树脂流动通道 。 回流装置可响应于第一树脂流动通道中的第一熔融树脂在第二树脂流动通道中的第二熔融树脂上施加的压力而操作。
    • 8. 发明授权
    • Curing agent for epoxy resins and epoxy resin compositions
    • 环氧树脂固化剂和环氧树脂组合物
    • US08703010B2
    • 2014-04-22
    • US11629187
    • 2005-05-17
    • Atsushi OkoshiRyuji IdenoTakao Ota
    • Atsushi OkoshiRyuji IdenoTakao Ota
    • C09K3/00C08G59/14
    • C08G59/4215C08L63/00
    • A curing agent for epoxy resins which comprises cyclohexanetricarboxylic acid anhydride (A) comprising trans,trans-1,2,4-cyclohexanetricarboxylic acid 1,2-anhydride expressed by formula (1) and aliphatic dicarboxylic acid anhydride (B) and an epoxy resin composition which comprises the curing agent and an epoxy resin are provided. The curing agent of the present invention can be handled easily since the curing agent is liquid at the ordinary temperature, exhibits an excellent curing property without addition of a curing accelerator and provides a cured product of an epoxy resin exhibiting excellent transmission of light and heat stability. The epoxy resin composition can be advantageously used for coating materials, adhesives, molded products, resins for encapsulating photo-semiconductors and coating fluids for protective films of color filters constituting liquid crystal display devices (LCD), solid state imaging devices (CCD) and electroluminescence (EL) devices.
    • 环氧树脂固化剂,其包含由式(1)表示的反式,反式-1,2,4-环己烷三羧酸1,2-酐和脂族二羧酸酐(B)的环己烷三羧酸酐(A)和环氧树脂 提供了包含固化剂和环氧树脂的组合物。 本发明的固化剂可以容易地处理,因为固化剂在常温下为液体,在不加入固化促进剂的情况下表现出优异的固化性能,并且提供具有优异的光和热稳定性透过性的环氧树脂的固化产物 。 环氧树脂组合物可以有利地用于涂覆材料,粘合剂,模塑产品,用于封装光半导体的树脂和用于构成液晶显示装置(LCD),固态成像装置(CCD)和电致发光的彩色滤光片的保护膜的涂布液 (EL)设备。