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1. 发明授权

US06768516B2 Semiconductor device constituting a CMOS camera system 有权
标题翻译：构成CMOS照相机系统的半导体装置
公开(公告)号：US06768516B2
公开(公告)日：2004-07-27
申请号：US09732925
申请日：2000-12-11
申请人： Satoshi Yamada , Michitaka Kimura , Naoto Ueda , Masatoshi Yasunaga
发明人： Satoshi Yamada , Michitaka Kimura , Naoto Ueda , Masatoshi Yasunaga
IPC分类号： H04N5225
CPC分类号： H04N5/2257 , H01L27/14618 , H01L27/14625 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H04N5/2253 , H04N5/2254 , H01L2924/00014
摘要： The invention is intended for rendering a CMOS camera compact and less costly. A semiconductor device constituting a CMOS camera system includes a lens unit which includes a wiring board having an image pick-up opening formed therein and a lens, and the lens is provided on one side of the wiring board and positioned opposite the image pick-up opening. An image pick-up semiconductor is provided on the other side of the wiring board, and is positioned opposite the image pick-up opening, and is connected to a connection section of the wiring board by means of flip-chip bonding. An image processing semiconductor is connected by means of flip-chip bonding to another connection section provided on the other side of the wiring board, and processes an image signal output from the image pick-up semiconductor.
摘要翻译：本发明旨在使CMOS相机紧凑且成本更低。构成CMOS照相机系统的半导体器件包括透镜单元，该透镜单元包括其中形成有摄像开口的布线板和透镜，并且透镜设置在布线板的一侧并与图像拾取器相对定位开放在接线板的另一侧设置摄像半导体，与摄像开口相对设置，并通过倒装芯片接合而与布线基板的连接部连接。图像处理半导体通过倒装芯片接合连接到设置在布线板的另一侧的另一连接部分，并处理从摄像半导体输出的图像信号。

2. 发明授权

US06544814B1 Method of manufacturing a packaged semiconductor device, and a semiconductor device manufactured thereby 有权
标题翻译：封装半导体器件的制造方法以及由此制造的半导体器件
公开(公告)号：US06544814B1
公开(公告)日：2003-04-08
申请号：US09494361
申请日：2000-01-31
申请人： Masatoshi Yasunaga , Michitaka Kimura , Satoshi Yamada
发明人： Masatoshi Yasunaga , Michitaka Kimura , Satoshi Yamada
IPC分类号： H01L2144
CPC分类号： H01L24/97 , H01L21/561 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/81 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/92247 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A plurality of semiconductor chips are mounted on an insulating substrate with bumps and through use of dielectric resin for mounting purposes. The semiconductor chips are sealed with transfer mold resin through a single operation while remaining on the insulating substrate. Then, the plurality of semiconductor chips are separated together with the insulating substrate and the mounting resin into individual semiconductor devices. The productivity and reliability of packaged semiconductor devices is improved.
摘要翻译：多个半导体芯片安装在具有凸块的绝缘基板上，并且通过使用用于安装目的的电介质树脂。半导体芯片通过一次操作用传输模塑树脂密封，同时保留在绝缘基板上。然后，将多个半导体芯片与绝缘基板和安装树脂一起分离成单独的半导体器件。提高了封装半导体器件的生产率和可靠性。

3. 发明授权

US06476502B2 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06476502B2
公开(公告)日：2002-11-05
申请号：US09517050
申请日：2000-03-02
申请人： Satoshi Yamada , Michitaka Kimura , Masatoshi Yasunaga
发明人： Satoshi Yamada , Michitaka Kimura , Masatoshi Yasunaga
IPC分类号： H01L2348
CPC分类号： H01L25/0657 , H01L25/0652 , H01L2224/0401 , H01L2224/05572 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06558 , H01L2225/06562 , H01L2225/06582 , H01L2225/06589 , H01L2924/0002 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2224/05552
摘要： An insulating resin sheet made from a thermosetting resin is provided on an insulating substrate in such a manner as to cover bonding pads provided on the insulating substrate. A lower chip is set on the insulating substrate in such a manner that bonding bumps connected to inner connection terminals of the lower chip break the insulating resin sheet 24 to be in contact with the bonding pads. The insulating resin sheet is thermally cured and subsequently the bonding bumps are melted.
摘要翻译：在绝缘基板上设置由热固性树脂制成的绝缘树脂片，以覆盖设置在绝缘基板上的接合焊盘。将下部芯片设置在绝缘基板上，使得与下部芯片的内部连接端子连接的接合凸块将绝缘树脂片材24与接合焊盘接触。绝缘树脂板被热固化，随后粘合凸块熔化。

4. 发明授权

US06462425B1 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06462425B1
公开(公告)日：2002-10-08
申请号：US09429635
申请日：1999-10-29
申请人： Toshihiro Iwasaki , Masatoshi Yasunaga , Satoshi Yamada , Kozo Harada , Michitaka Kimura
发明人： Toshihiro Iwasaki , Masatoshi Yasunaga , Satoshi Yamada , Kozo Harada , Michitaka Kimura
IPC分类号： H01L2940
CPC分类号： H01L21/563 , H01L2224/05001 , H01L2224/05022 , H01L2224/051 , H01L2224/05572 , H01L2224/1134 , H01L2224/131 , H01L2224/13109 , H01L2224/13113 , H01L2224/13118 , H01L2224/1312 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13164 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2224/13099 , H01L2924/01014 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device allowing a mounting of a semiconductor substrate with narrow electrode pad interval on an insulated circuit board while securing a favorable insulation characteristic and a manufacturing method thereof are obtained. The semiconductor device includes an electrode pad formed on a semiconductor substrate; a connecting underlying metal film connected to the electrode pad; a connecting conductor establishing electrical conduction between the connecting underlying metal film and a terminal electrode on an insulated circuit board; and non-conductive resin surrounding the connecting conductor and filling a gap between the substrate and the insulated circuit board. Here, the connecting underlying metal film is not covered by the connecting conductor at least in a peripheral region including an outer peripheral portion thereof
摘要翻译：获得能够在确保良好的绝缘特性的同时将具有窄电极焊盘间隔的半导体衬底安装在绝缘电路板上的半导体器件及其制造方法。半导体器件包括形成在半导体衬底上的电极焊盘; 连接到电极焊盘的连接底层金属膜; 连接导体，其在连接的底层金属膜和绝缘电路板上的端子电极之间建立导电; 以及围绕连接导体的非导电树脂，并填充衬底和绝缘电路板之间的间隙。这里，至少在包括其外周部分的周边区域中，连接基底金属膜不被连接导体覆盖

5. 发明授权

US08605277B2 Method of inspecting semiconductor device 有权
标题翻译：检测半导体器件的方法
公开(公告)号：US08605277B2
公开(公告)日：2013-12-10
申请号：US13244434
申请日：2011-09-24
申请人： Satoshi Yamada , Takashi Karashima , Kenya Hironaga , Masatoshi Yasunaga , Yuji Fujimoto
发明人： Satoshi Yamada , Takashi Karashima , Kenya Hironaga , Masatoshi Yasunaga , Yuji Fujimoto
IPC分类号： G01N21/00
CPC分类号： G01N21/95684 , G01B11/306 , G01N21/93 , H01L23/3128 , H01L2224/48227 , H01L2924/01322 , H01L2924/15311 , H01L2924/3511 , H01L2924/00
摘要： Reliability of a semiconductor device is improved. In a flatness inspection of BGA (semiconductor device), there is formed a flatness standard where a permissible range in the direction of (+) of flatness at normal temperature is smaller than a permissible range in the direction of (−). With use of the above flatness standard, a flatness inspection of the semiconductor device at normal temperature is performed to determine whether the mounted item is non-defective or defective. With the above process, defective mounting caused by a package warp when heated during reflow soldering etc. is reduced and reliability of BGA is improved. At the same time, flatness management of a substrate-type semiconductor device with better consideration of a mounting state can be performed.
摘要翻译：提高了半导体器件的可靠性。在BGA（半导体器件）的平坦度检查中，形成了平坦度标准，其中常温平面度（+）方向上的允许范围小于（ - ）方向的允许范围。使用上述平面度标准，进行半导体器件在常温下的平坦度检查，以确定安装的物品是否是有缺陷的或有缺陷的。通过上述处理，在回流焊接等期间加热时由包装翘曲引起的安装不良导致BGA的可靠性提高。同时，可以进行更好地考虑安装状态的基板型半导体器件的平坦度管理。

6. 发明授权

US08826650B2 Exhaust gas treatment method and device for internal combustion engine 有权
标题翻译：内燃机废气处理方法及装置
公开(公告)号：US08826650B2
公开(公告)日：2014-09-09
申请号：US13384843
申请日：2010-06-11
申请人： Satoshi Yamada , Hiroyuki Endo
发明人： Satoshi Yamada , Hiroyuki Endo
IPC分类号： F01N3/00 , F01N3/10 , F01N3/02 , F02D41/14 , F04B49/00 , F02D41/02 , B60W10/30 , F01N3/035 , F04B49/02 , F01N3/023 , F01M1/16 , F02D41/04 , F02D41/08 , F02M25/07 , F02D41/40
CPC分类号： F01N3/035 , B60W10/30 , F01M1/16 , F01N3/023 , F01N2510/065 , F02D41/0235 , F02D41/0245 , F02D41/025 , F02D41/029 , F02D41/047 , F02D41/08 , F02D41/1447 , F02D41/405 , F02D2041/026 , F02D2200/023 , F02D2200/024 , F02D2200/101 , F02D2200/703 , F02D2250/11 , F02M26/05 , F02M26/15 , F04B49/00 , F04B49/022 , Y02T10/26
摘要： An exhaust gas treatment device for preventing a large quantity of unburned HC components from being released to the outside until a diesel oxidation catalyst reaches an activation temperature after early post-injection. By reducing a throttle opening of a variable throttle mechanism (77) provided in an oil passage (72), or increasing a set value of an oil pressure level detected in an oil pressure sensor (78) provided on the downstream side of the variable throttle mechanism, power of an oil circulation pump (74) is increased before a start point t1 of the early post-injection. With this arrangement, by increasing a load of a diesel engine to increase a temperature rise gradient of exhaust gas at the stage of increasing the temperature of the diesel oxidation catalyst, the unburned HC component released until the diesel oxidation catalyst reaches the activation temperature is reduced.
摘要翻译：一种废气处理装置，用于防止大量未燃烧的HC组分释放到外部，直到柴油机氧化催化剂在早期后喷射之后达到活化温度。通过减小设置在油路（72）中的可变节流机构（77）的节气门开度，或者增加在设置在可变节流阀的下游侧的油压传感器（78）中检测到的油压水平的设定值在早期后喷射的起点t1之前，油循环泵（74）的功率增加。通过这种布置，通过增加柴油发动机的负荷以在提高柴油机氧化催化剂的温度的阶段增加废气的升温梯度，直到柴油机氧化催化剂达到活化温度释放的未燃HC组分减少。

7. 发明授权

US08761461B2 Image processing apparatus and control method therefor, as well as storage medium 有权
标题翻译：图像处理装置及其控制方法以及存储介质
公开(公告)号：US08761461B2
公开(公告)日：2014-06-24
申请号：US13531004
申请日：2012-06-22
申请人： Satoshi Yamada
发明人： Satoshi Yamada
IPC分类号： G06K9/00
CPC分类号： H04N5/23219 , H04N5/23293
摘要： An image processing apparatus capable of improving the usability in search by, for a person presumed to be difficult to be misidentified, improving the frequency of identifying the person. When calculated degree of similarity is equal to or greater than a threshold, it is identified that a face of the person corresponds to a face of any one of registered persons. The threshold is set to a second value greater than a first value, for the face of one of the registered persons who has not been identified when starting recording of the image, and the threshold is set to a third value between the first value and the second value, for the face of one of the registered persons who is already identified when starting the recording of the image, after the recording of the shot image to the nonvolatile recording medium is started.
摘要翻译：一种图像处理装置，其能够提高对被认为难以被识别的人的搜索的可用性，从而提高识别人的频率。当计算出的相似度等于或大于阈值时，识别出该人的面部对应于任何一个登记人员的面部。对于在开始记录图像时尚未识别的一个注册人员的面部，阈值被设置为大于第一值的第二值，并且阈值被设置为第一值和第二值之间的第三值在开始拍摄图像到非易失性记录介质之后开始记录图像时已经识别的一个注册人员的面部的第二值。

8. 发明申请

US20120180456A1 EXHAUST GAS TREATMENT METHOD AND DEVICE FOR INTERNAL COMBUSTION ENGINE 有权
标题翻译：用于内燃机的排气处理方法和装置
公开(公告)号：US20120180456A1
公开(公告)日：2012-07-19
申请号：US13384843
申请日：2010-06-11
申请人： Satoshi Yamada , Hiroyuki Endo
发明人： Satoshi Yamada , Hiroyuki Endo
IPC分类号： F01N3/20
CPC分类号： F01N3/035 , B60W10/30 , F01M1/16 , F01N3/023 , F01N2510/065 , F02D41/0235 , F02D41/0245 , F02D41/025 , F02D41/029 , F02D41/047 , F02D41/08 , F02D41/1447 , F02D41/405 , F02D2041/026 , F02D2200/023 , F02D2200/024 , F02D2200/101 , F02D2200/703 , F02D2250/11 , F02M26/05 , F02M26/15 , F04B49/00 , F04B49/022 , Y02T10/26
摘要： An object is to prevent a large quantity of unburned HC components from being released to the outside until a diesel oxidation catalyst reaches an activation temperature after early post-injection. In the present invention, by reducing a throttle opening of a variable throttle mechanism 77 provided in an oil passage 72, or increasing a set value of an oil pressure level detected in an oil pressure sensor 78 provided on the downstream side of the variable throttle mechanism 77, power of an oil circulation pump 74 is increased before a start point t1 of the early post-injection. With this arrangement, by increasing a load of a diesel engine 10 to increase a temperature rise gradient of exhaust gas at the stage of increasing the temperature of the diesel oxidation catalyst, the unburned HC component released until the diesel oxidation catalyst 50 reaches the activation temperature is reduced.
摘要翻译：目的是为了防止大量未燃烧的HC组分被释放到外部，直到柴油机氧化催化剂在注射后早期达到活化温度。在本发明中，通过减少设置在油路72中的可变节流机构77的节气门开度，或者增加在设置在可变节流机构的下游侧的油压传感器78中检测到的油压水平的设定值如图77所示，油循环泵74的动力在早期后喷射的起点t1之前增加。通过这种布置，通过增加柴油发动机10的负荷以在提高柴油机氧化催化剂的温度的阶段增加废气的温度升高梯度，释放出未燃HC组分直到柴油机氧化催化剂50达到活化温度降低了。

9. 发明申请

US20110287177A1 VACUUM PROCESSING APPARATUS, SUBSTRATE ROTATION APPARATUS, AND DEPOSITION METHOD 审中-公开
标题翻译：真空加工装置，底板旋转装置和沉积方法
公开(公告)号：US20110287177A1
公开(公告)日：2011-11-24
申请号：US13099535
申请日：2011-05-03
申请人： Satoshi Yamada , Masaaki Ishida
发明人： Satoshi Yamada , Masaaki Ishida
IPC分类号： C23C14/50 , B05D5/12
CPC分类号： C23C14/505 , C23C14/568
摘要： An apparatus for rotating a substrate having a center hole, comprises a pickup member configured to hold the substrate by holding an edge of the center hole, and a driving unit configured to drive the pickup member, wherein the driving unit is configured to insert the pickup member into the center hole so as not to bring the pickup member into contact with the substrate, to drive the pickup member upward so that the pickup member holds the edge of the center hole from below, and thereupon to rotate the pickup member so as to rotate the substrate, and in rotating the substrate, the driving unit rotates the pickup member about a rotation axis which is perpendicular to a principal surface of the substrate and passes through the center of the substrate.
摘要翻译：一种用于旋转具有中心孔的基板的装置，包括：拾取构件，其构造成通过保持所述中心孔的边缘来保持所述基板;以及驱动单元，其构造成驱动所述拾取构件，其中所述驱动单元被配置为将所述拾取器构件进入中心孔，以便不使拾取构件与衬底接触，以将拾取构件向上驱动，使得拾取构件从下方保持中心孔的边缘，并随后使拾取构件旋转，以便旋转衬底，并且在旋转衬底时，驱动单元围绕垂直于衬底的主表面并穿过衬底的中心的旋转轴旋转拾取构件。

10. 发明授权

US07782349B2 Thermal printer and method of controlling the same 有权
标题翻译：热敏打印机及其控制方法
公开(公告)号：US07782349B2
公开(公告)日：2010-08-24
申请号：US11681922
申请日：2007-03-05
申请人： Sumio Baba , Satoshi Yamada , Hiroyuki Taguchi
发明人： Sumio Baba , Satoshi Yamada , Hiroyuki Taguchi
IPC分类号： B41J2/32
CPC分类号： B41J2/355 , B41J3/54 , B41J3/60
摘要： A thermal paper sheet having heat-sensitive layers on a first surface and a second surface having a front-and-rear relationship is prepared. A first thermal head which comes into contact with a front surface of this thermal paper sheet and a second thermal head which comes into contact with a rear surface 1b of the same are provided. Further, printing data input from the outside is divided into first printing data and second printing data. The thermal heads are driven in accordance with the printing data.
摘要翻译：制备在第一表面上具有热敏层的热敏纸片和具有前后关系的第二表面。提供了与该热敏纸张的前表面接触的第一热敏头和与其相反的后表面1b接触的第二热敏头。此外，从外部输入的打印数据被划分为第一打印数据和第二打印数据。热敏头根据打印数据进行驱动。

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