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1. 发明授权

US07556626B2 Medical instrument holding apparatus 有权
标题翻译：医用仪器夹具
公开(公告)号：US07556626B2
公开(公告)日：2009-07-07
申请号：US10751565
申请日：2004-01-05
申请人： Masaaki Ueda , Satoshi Otsuka , Tomoaki Yamashita , Hisao Isobe , Kenji Hirose , Toru Shinmura
发明人： Masaaki Ueda , Satoshi Otsuka , Tomoaki Yamashita , Hisao Isobe , Kenji Hirose , Toru Shinmura
IPC分类号： A61B17/00
CPC分类号： A61B90/50 , A61B2090/504
摘要： A medical instrument holding apparatus includes a supporting mechanism, a moving mechanism, a basal portion and a counterweight. The supporting mechanism supports a medical instrument. The moving mechanism which has first and second sides, and a shaft portion located between the first and second sides. The moving mechanism supports the supporting mechanism, allowing the medical instrument and the supporting mechanism to be moved around the shaft portion. The basal portion is coupled to the shaft portion. The basal portion supports the moving mechanism, allowing the moving mechanism to rotate around the shaft portion. The counterweight is located on the second side of the moving mechanism. The counterweight generates a first rotation moment being smaller than a second rotation moment generated from the weights of the medical instrument and the supporting mechanism and acting around the shaft portion in the opposite direction to the second rotation moment.
摘要翻译：医疗器具保持装置包括支撑机构，移动机构，基部和配重。支持机构支持医疗器械。具有第一和第二侧面的移动机构和位于第一和第二侧之间的轴部分。移动机构支撑支撑机构，允许医疗器械和支撑机构绕轴部移动。基部与轴部联接。基部支撑移动机构，允许移动机构围绕轴部旋转。配重位于移动机构的第二侧。配重产生的第一旋转力矩小于由医疗器具和支撑机构的重量产生的第二旋转力矩，并且在与第二旋转力矩相反的方向上围绕轴部作用。

2. 发明授权

US07309311B2 Endoscopic observation apparatus and medical device holder 有权
标题翻译：内窥镜观察装置和医疗器械支架
公开(公告)号：US07309311B2
公开(公告)日：2007-12-18
申请号：US10850660
申请日：2004-05-21
申请人： Satoshi Otsuka , Toru Shinmura , Tomoaki Yamashita , Kenji Hirose , Hisao Isobe , Masaaki Ueda
发明人： Satoshi Otsuka , Toru Shinmura , Tomoaki Yamashita , Kenji Hirose , Hisao Isobe , Masaaki Ueda
IPC分类号： A61B1/04
CPC分类号： A61B1/00188 , A61B1/00149 , A61B1/042
摘要： An endoscope is connected optically removably to a TV camera through an adapter. A plurality of fixing pins is arranged on both sides of an insertion axis of an insertion part of the endoscope. A fixing unit to fix the endoscope removably is provided at the front end of an arm unit of an endoscope holder which supports the endoscope movably. The fixing unit has a claw and a movable claw, and grips the fixing pins of the endoscope releasably between the claw and the movable claw.
摘要翻译：内窥镜通过适配器可旋转地连接到电视摄像机。在内窥镜的插入部的插入轴的两侧配置有多个固定销。可拆卸地固定内窥镜的固定单元设置在可移动地支撑内窥镜的内窥镜支架的臂单元的前端。固定单元具有爪和可动爪，并将内窥镜的固定销可释放地夹在爪和可动爪之间。

3. 发明申请

US20050075536A1 Medical device supporting apparatus 审中-公开
标题翻译：医疗器械配套设备
公开(公告)号：US20050075536A1
公开(公告)日：2005-04-07
申请号：US10958138
申请日：2004-10-04
申请人： Satoshi Otsuka , Toru Shinmura , Tomoaki Yamashita
发明人： Satoshi Otsuka , Toru Shinmura , Tomoaki Yamashita
IPC分类号： A61B1/00 , A61B17/00 , A61B19/00
CPC分类号： A61B90/50 , A61B1/00149 , A61B2017/00539 , A61B2017/00544 , A61B2090/508
摘要： A medical device supporting apparatus for supporting a medical device in a three-dimensional space, in which a holding device for holding the medical device is supported by a supporting mechanism three-dimensionally, and the state of the supporting unit is switched between the movable state and the locked state by operating a plurality of final control elements. Operation is stabilized by differentiating the amount of operating force of the plurality of final control elements.
摘要翻译：一种医疗装置支撑装置，其用于在三维空间中支撑医疗装置，其中用于保持医疗装置的保持装置由支撑机构三维地支撑，并且支撑单元的状态在可动状态以及通过操作多个最终控制元件的锁定状态。通过区分多个最终控制元件的操作力的量来稳定操作。

4. 发明授权

US07122032B2 Operation system and mounting device for external device for use in the operation system 有权
公开(公告)号：US07122032B2
公开(公告)日：2006-10-17
申请号：US10437600
申请日：2003-05-14
申请人： Toru Shinmura , Gakuji Higuchi , Tomoaki Yamashita , Kenji Omachi
发明人： Toru Shinmura , Gakuji Higuchi , Tomoaki Yamashita , Kenji Omachi
IPC分类号： A61B18/00 , H01R13/73
CPC分类号： A61B90/36 , A61B90/20 , A61B90/25 , A61B2017/00477 , A61B2090/0813
摘要： An operation system and a connecting adapter are provided. The operation system includes an operation microscope, an external device connectable to the operation microscope, and a connecting adapter for electrically connecting the operation microscope and the external device without bringing the operation microscope and the external device into contact with each other, which maintains a state of sterilization of the external device.

5. 发明授权

US08427533B2 Image pickup apparatus, electronic endoscope, and lens unit 有权
标题翻译：图像拾取装置，电子内窥镜和透镜单元
公开(公告)号：US08427533B2
公开(公告)日：2013-04-23
申请号：US12333679
申请日：2008-12-12
申请人： Seiji Sakai , Tomoaki Yamashita , Masahiro Kawauchi , Takahiko Mitani , Yuuya Ishida , Seiji Iwasaki
发明人： Seiji Sakai , Tomoaki Yamashita , Masahiro Kawauchi , Takahiko Mitani , Yuuya Ishida , Seiji Iwasaki
IPC分类号： H04N7/18
CPC分类号： G02B23/2438 , A61B1/00096 , A61B1/00188 , A61B1/05 , F03G7/065
摘要： An image pickup apparatus of the present invention varies optical properties by moving a part of lenses of an objective lens, and includes a solid-state image pickup device unit that is disposed at a rear-end section and that subjects a subject image to photoelectric conversion, a fixed lens frame that retains the objective lens that is disposed in front of the solid-state image pickup device unit, a movable lens frame that retains the part of lenses that moves along a photographing optical axis O inside the lens frame, and an actuator having one end connected to the movable lens frame and that moves the movable lens frame forward and backward. The actuator includes a rigid member provided so as to extend to the vicinity of the rear end at which the solid-state image pickup device unit is disposed and a shape memory alloy that is coupled to the rigid member.
摘要翻译：本发明的图像拾取装置通过移动物镜的一部分透镜来改变光学特性，并且包括设置在后端部分并使被摄体图像进行光电转换的固态图像拾取装置单元，固定透镜框架，其保持设置在固态摄像装置单元前面的物镜;可移动透镜框，其保持沿着拍摄光轴O在透镜框内移动的透镜部分;以及致动器，其一端连接到可移动透镜框架并且使可移动透镜框架向前和向后移动。致动器包括设置成延伸到固态图像拾取装置单元的后端附近的刚性构件和耦合到刚性构件的形状记忆合金。

6. 发明授权

US08425405B2 Electronic endoscope apparatus 有权
标题翻译：电子内窥镜装置
公开(公告)号：US08425405B2
公开(公告)日：2013-04-23
申请号：US12432053
申请日：2009-04-29
申请人： Takahiko Mitani , Akira Muramatsu , Seiji Sakai , Tomoaki Yamashita , Masahiro Kawauchi , Yuichi Wataya
发明人： Takahiko Mitani , Akira Muramatsu , Seiji Sakai , Tomoaki Yamashita , Masahiro Kawauchi , Yuichi Wataya
IPC分类号： A61B1/04 , A61B1/00
CPC分类号： A61B1/05 , A61B1/00114 , A61B1/018 , A61B1/042
摘要： An electronic endoscope apparatus includes: an image pickup apparatus mounted at a distal end portion of an insertion portion; an operation portion provided consecutively at the insertion portion, with a frame member incorporated therein; and an electrical cable extended from the operation portion for connection with an external device. In the electronic endoscope apparatus, the frame member has a circuit board portion which establishes electrical connection between shields of the insertion portion and the electrical cable, and on which various electronic parts for exchanging signals with the image pickup apparatus are mounted. In spite of the arrangement of the image pickup apparatus that can acquire high-quality images at a distal end portion of the insertion portion, a size of the apparatus, in particular, a diameter of the insertion portion, can be prevented from being increased.
摘要翻译：电子内窥镜装置包括：安装在插入部的前端部的摄像装置; 连接在插入部分的操作部分，其中结合有框架构件; 以及从操作部分延伸的用于与外部设备连接的电缆。在电子内窥镜装置中，框架构件具有在插入部的屏蔽和电缆之间建立电连接的电路基板部，并且安装有用于与图像拾取装置交换信号的各种电子部件。尽管可以在插入部分的远端部分获得高质量图像的图像拾取装置的布置，但是可以防止装置的尺寸，特别是插入部分的直径增加。

7. 发明申请

US20080096046A1 Method Of Treating The Surface Of Copper And Copper 有权
标题翻译：铜和铜表面处理方法
公开(公告)号：US20080096046A1
公开(公告)日：2008-04-24
申请号：US11908329
申请日：2006-03-10
申请人： Tomoaki Yamashita , Yasuo Inoue , Masaharu Matsuura , Toyoki Ito , Akira Shimizu , Fumio Inoue , Akishi Nakaso
发明人： Tomoaki Yamashita , Yasuo Inoue , Masaharu Matsuura , Toyoki Ito , Akira Shimizu , Fumio Inoue , Akishi Nakaso
IPC分类号： C23F1/00 , B32B15/20
CPC分类号： H05K3/385 , C23C8/02 , C23C8/40 , C23C22/63 , C23C28/00 , C23C28/321 , C23C28/322 , C23C28/345 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H05K3/384 , H05K3/389 , H05K3/4644 , H05K2201/0347 , H05K2201/0373 , H05K2203/0315 , H05K2203/1157 , Y10T428/12438 , Y10T428/12771 , Y10T428/12875 , Y10T428/12903 , Y10T428/12993 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 μm on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.
摘要翻译：提供一种处理铜表面的方法，以确保铜表面和绝缘层之间的粘合强度，而不会在铜表面上形成超过1um的凹凸，并提高布线之间的绝缘可靠性。还提供了通过上述表面处理方法处理其表面的铜。处理铜的表面的方法包括铜的表面，包括以下步骤：在铜的表面上离散地形成比铜更贵的金属; 然后通过使用含有氧化剂的碱性溶液氧化铜的表面。

8. 发明申请

US20110147072A1 METHOD FOR SURFACE TREATMENT OF COPPER AND COPPER 有权
标题翻译：铜和铜的表面处理方法
公开(公告)号：US20110147072A1
公开(公告)日：2011-06-23
申请号：US13060095
申请日：2009-06-17
申请人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
发明人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
IPC分类号： H05K1/03 , C23C22/68 , C22C9/00 , B32B15/04
CPC分类号： C23F1/18 , C23F1/02 , H01L2224/16225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/181 , H05K3/384 , H05K3/385 , H05K2203/0315 , H05K2203/1157 , Y10T29/49982 , Y10T428/12438 , Y10T428/12771 , Y10T428/24917 , H01L2924/00012 , H01L2924/00014
摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.
摘要翻译：本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸铜表面和用该方法处理的铜。表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。

9. 发明授权

US07588835B2 Method of treating the surface of copper and copper 有权
标题翻译：处理铜和铜表面的方法
公开(公告)号：US07588835B2
公开(公告)日：2009-09-15
申请号：US11908329
申请日：2006-03-10
申请人： Tomoaki Yamashita , Yasuo Inoue , Masaharu Matsuura , Toyoki Ito , Akira Shimizu , Fumio Inoue , Akishi Nakaso
发明人： Tomoaki Yamashita , Yasuo Inoue , Masaharu Matsuura , Toyoki Ito , Akira Shimizu , Fumio Inoue , Akishi Nakaso
IPC分类号： B32B15/20 , C23C22/78 , C23C22/63 , C23C22/83
CPC分类号： H05K3/385 , C23C8/02 , C23C8/40 , C23C22/63 , C23C28/00 , C23C28/321 , C23C28/322 , C23C28/345 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H05K3/384 , H05K3/389 , H05K3/4644 , H05K2201/0347 , H05K2201/0373 , H05K2203/0315 , H05K2203/1157 , Y10T428/12438 , Y10T428/12771 , Y10T428/12875 , Y10T428/12903 , Y10T428/12993 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 μm on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.
摘要翻译：提供一种处理铜表面的方法，以确保铜表面和绝缘层之间的粘合强度，而不会在铜表面上形成超过1um的凹凸，并提高布线之间的绝缘可靠性。还提供了通过上述表面处理方法处理其表面的铜。处理铜的表面的方法包括铜的表面，包括以下步骤：在铜的表面上离散地形成比铜更贵的金属; 然后通过使用含有氧化剂的碱性溶液氧化铜的表面。

10. 发明授权

US08809696B2 Method for surface treatment of copper and copper 有权
标题翻译：铜和铜的表面处理方法
公开(公告)号：US08809696B2
公开(公告)日：2014-08-19
申请号：US13060095
申请日：2009-06-17
申请人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
发明人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
IPC分类号： H05K1/00
CPC分类号： C23F1/18 , C23F1/02 , H01L2224/16225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/181 , H05K3/384 , H05K3/385 , H05K2203/0315 , H05K2203/1157 , Y10T29/49982 , Y10T428/12438 , Y10T428/12771 , Y10T428/24917 , H01L2924/00012 , H01L2924/00014
摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.
摘要翻译：本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸铜表面和用该方法处理的铜。表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。

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