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1. 发明授权

US06483040B2 Package and method of manufacturing the same 失效
标题翻译：包装和制造方法相同
公开(公告)号：US06483040B2
公开(公告)日：2002-11-19
申请号：US09789581
申请日：2001-02-22
申请人： Satoshi Ooe , Yoshiyuki Yamamoto
发明人： Satoshi Ooe , Yoshiyuki Yamamoto
IPC分类号： H05K103
CPC分类号： H01L23/36 , H01L23/3732 , H01L23/49861 , H01L2924/0002 , Y10T428/24917 , Y10T428/30 , H01L2924/00
摘要： The present invention provides a package whose heat dissipation performance by a semiconductor device has been improved, which synchronizes with the rapid development of high transmission density in multiplex communications. In place of the conventional package substrate, a substrate formed by a combination of two or more kinds of materials is used, whereby the temperature of a portion at which the temperature tends to rise to become extremely high within the package is selectively dissipated, whereby the heat dissipation performance of the package is efficiently improved. A diamond coated substrate or diamond substrate is used at a portion with an extremely high temperature for dissipating the heat.
摘要翻译：本发明提供了一种通过半导体器件的散热性能得到改善的封装，与多路通信中的高传输密度的快速发展同步。代替常规的封装基板，使用通过两种或更多种材料的组合形成的基板，由此在封装件内温度趋于上升至非常高的部分的温度被选择性地消散，由此，有效地提高了包装的散热性能。在极高温度的部分使用金刚石涂覆的基底或金刚石基底来散热。

2. 发明授权

US06464409B1 Package for optical communications modules 失效
标题翻译：光通信模块封装
公开(公告)号：US06464409B1
公开(公告)日：2002-10-15
申请号：US09678809
申请日：2000-10-04
申请人： Satoshi Ooe
发明人： Satoshi Ooe
IPC分类号： G02B642
CPC分类号： G02B6/4201
摘要： Packages are required to have high heat-dissipating quality. To fulfill this requirement, a highly heat-conductive material has been used for a package's bottom plate. This results in the use of a material that has a considerable difference in the coefficient of linear expansion between the side plate and bottom plate. Notwithstanding the use of this type of material, the package must be free from reduction in airtightness and degradation in optical coupling. The package of the present invention comprises side plate 1 and bottom plate 2 each having tenons 3. The tenon portions are combined and bonded. It is desirable that tenons 3 have a width not less than 1 mm and not more than 5 mm.
摘要翻译：包装需要具有很高的散热质量。为了满足这一要求，高导热性材料已被用于封装的底板。这导致使用在侧板和底板之间的线性膨胀系数具有显着差异的材料。尽管使用了这种类型的材料，但是该封装必须不会降低气密性和光耦合的退化。本发明的包装件包括侧板1和底板2，每个具有榫头3。将榫头部分组合并结合。榫头3的宽度优选为1mm以上5mm以下。

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