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1. 发明授权

US09181126B2 Glass fusion method 有权
标题翻译：玻璃融合法
公开(公告)号：US09181126B2
公开(公告)日：2015-11-10
申请号：US13345199
申请日：2012-01-06
申请人： Satoshi Matsumoto , Toshimitsu Wakuda
发明人： Satoshi Matsumoto , Toshimitsu Wakuda
IPC分类号： C03C27/04 , C03C27/06 , C03C8/24
CPC分类号： C03C27/06 , C03C8/24
摘要： A glass layer fixing method for manufacturing a glass layer fixing member by fixing a glass layer to a first glass member, includes the steps of disposing the glass layer on the first glass member along a region to be fused, the glass layer containing a glass powder and a laser-absorbing material and irradiating the region to be fused therealong with a first laser beam, so as to melt the glass layer, fix the glass layer to the first glass member, and increase a laser absorptance of the glass layer.
摘要翻译：通过将玻璃层固定在第一玻璃构件上来制造玻璃层固定构件的玻璃层固定方法包括以下步骤：沿着要熔融的区域将玻璃层设置在第一玻璃构件上，玻璃层含有玻璃粉末和激光吸收材料，并用第一激光束照射要熔融的区域，以熔化玻璃层，将玻璃层固定在第一玻璃构件上，并增加玻璃层的激光吸收率。

2. 发明申请

US20110067448A1 FUSION-BONDING PROCESS FOR GLASS 审中-公开
标题翻译：玻璃熔融粘合工艺
公开(公告)号：US20110067448A1
公开(公告)日：2011-03-24
申请号：US12994354
申请日：2009-06-03
申请人： Satoshi Matsumoto , Toshimitsu Wakuda
发明人： Satoshi Matsumoto , Toshimitsu Wakuda
IPC分类号： C03B23/20
CPC分类号： B23K26/324 , C03B23/245 , C03C27/06 , Y02P40/57
摘要： A part of a glass layer 103 disposed along a region to be fused R is irradiated with a laser beam L1, so as to form the glass layer 103 with a laser-absorbing part 108a having a high laser absorptance. Then, while using the laser-absorbing part 108a as an irradiation initiation position, the region to be fused R is irradiated therealong with a laser beam L2, so as to melt the glass layer 103 and fix the glass layer 103 onto a glass member 104. Since the irradiation initiation position for the laser beam L2 has already become the laser-absorbing part 108a, a stable region where the melting of the glass layer 103 is stable can be formed immediately from the start point for initiating the irradiation with the second laser beam or nearby. The glass member 104 is fused to a glass member 105 through the glass layer 103 having such a stable region formed throughout the region to be fused R, so as to yield a glass fusing structure 101.
摘要翻译：照射熔融R的区域的玻璃层103的一部分用激光束L1照射，以形成具有高激光吸收率的激光吸收部108a的玻璃层103。然后，在使用激光吸收部108a作为照射开始位置的同时，用激光束L2照射熔融区域R，使玻璃层103熔融并将玻璃层103固定在玻璃构件104上由于激光束L2的照射开始位置已经成为激光吸收部108a，所以可以从起始点立即形成玻璃层103的熔融稳定的区域，以开始第二激光的照射梁或附近。玻璃构件104通过具有形成在整个区域中的待稳定区域的玻璃层103熔合成玻璃构件105，以便产生玻璃熔融结构101。

3. 发明授权

US08516852B2 Glass fusion method 有权
标题翻译：玻璃融合法
公开(公告)号：US08516852B2
公开(公告)日：2013-08-27
申请号：US12994320
申请日：2009-05-11
申请人： Satoshi Matsumoto , Toshimitsu Wakuda
发明人： Satoshi Matsumoto , Toshimitsu Wakuda
IPC分类号： C03B23/203 , C03B27/02
CPC分类号： C03C27/06 , C03C8/24
摘要： After a glass layer 3 is disposed between a glass member 4 and a thermal conductor 7 along a region to be fused, a laser beam L1 is emitted while the thermal conductor 7 is used as a heat sink, so as to melt the glass layer 3, thereby burning and fixing the glass layer 3 onto the glass member 4. While the glass layer 3 drastically increases its laser absorptance at the time of burning, the thermal conductor 7 serves as the heatsink and draws heat from the glass layer 3, thereby inhibiting the glass layer 3 from falling into an excessive heat input state. Thereafter, another glass member is overlaid on the glass member 4 having the glass layer 3 burned thereonto, such that the glass layer 3 is interposed therebetween. Then, the region to be fused is irradiated therealong with a laser beam, so as to fuse the glass members together.
摘要翻译：在玻璃构件4和热导体7之间沿着熔融区域设置玻璃层3之后，在将热导体7用作散热器的同时发射激光束L1，从而熔化玻璃层3 ，从而将玻璃层3烧结并固定在玻璃部件4上。玻璃层3在燃烧时显着提高其激光吸收率，热导体7作为散热器，从玻璃层3吸引热量，从而抑制玻璃层3落入过热输入状态。此后，将另一个玻璃构件覆盖在玻璃层4上，玻璃层3被烧在其上，使得玻璃层3插入其间。然后，用激光束照射要熔化的区域，以将玻璃构件熔合在一起。

4. 发明授权

US10322469B2 Fusion bonding process for glass 有权
公开(公告)号：US10322469B2
公开(公告)日：2019-06-18
申请号：US12994354
申请日：2009-06-03
申请人： Satoshi Matsumoto , Toshimitsu Wakuda
发明人： Satoshi Matsumoto , Toshimitsu Wakuda
IPC分类号： C03B23/20 , B23K26/324 , C03B23/24 , C03C27/06
摘要： A part of a glass layer 103 disposed along a region to be fused R is irradiated with a laser beam L1, so as to form the glass layer 103 with a laser-absorbing part 108a having a high laser absorptance. Then, while using the laser-absorbing part 108a as an irradiation initiation position, the region to be fused R is irradiated therealong with a laser beam L2, so as to melt the glass layer 103 and fix the glass layer 103 onto a glass member 104. Since the irradiation initiation position for the laser beam L2 has already become the laser-absorbing part 108a, a stable region where the melting of the glass layer 103 is stable can be formed immediately from the start point for initiating the irradiation with the second laser beam or nearby. The glass member 104 is fused to a glass member 105 through the glass layer 103 having such a stable region formed throughout the region to be fused R, so as to yield a glass fusing structure 101.

5. 发明授权

US09150451B2 Glass fusion method 有权
公开(公告)号：US09150451B2
公开(公告)日：2015-10-06
申请号：US13345199
申请日：2012-01-06
申请人： Satoshi Matsumoto , Toshimitsu Wakuda
发明人： Satoshi Matsumoto , Toshimitsu Wakuda
IPC分类号： C03C27/04 , C03C27/06 , C03C8/24
摘要： A glass layer fixing method for manufacturing a glass layer fixing member by fixing a glass layer to a first glass member, includes the steps of disposing the glass layer on the first glass member along a region to be fused, the glass layer containing a glass powder and a laser-absorbing material and irradiating the region to be fused therealong with a first laser beam, so as to melt the glass layer, fix the glass layer to the first glass member, and increase a laser absorptance of the glass layer.

6. 发明申请

US20120151965A1 GLASS FUSION METHOD 审中-公开
标题翻译：玻璃熔融法
公开(公告)号：US20120151965A1
公开(公告)日：2012-06-21
申请号：US13345199
申请日：2012-01-06
申请人： Satoshi Matsumoto , Toshimitsu Wakuda
发明人： Satoshi Matsumoto , Toshimitsu Wakuda
IPC分类号： C03B23/20
CPC分类号： C03C27/06 , C03C8/24
摘要： A glass layer fixing method for manufacturing a glass layer fixing member by fixing a glass layer to a first glass member, includes the steps of disposing the glass layer on the first glass member along a region to be fused, the glass layer containing a glass powder and a laser-absorbing material and irradiating the region to be fused therealong with a first laser beam, so as to melt the glass layer, fix the glass layer to the first glass member, and increase a laser absorptance of the glass layer.
摘要翻译：通过将玻璃层固定在第一玻璃构件上来制造玻璃层固定构件的玻璃层固定方法包括以下步骤：沿着要熔融的区域将玻璃层设置在第一玻璃构件上，玻璃层含有玻璃粉末和激光吸收材料，并用第一激光束照射要熔融的区域，以熔化玻璃层，将玻璃层固定在第一玻璃构件上，并增加玻璃层的激光吸收率。

7. 发明申请

US20110072855A1 GLASS FUSION METHOD 有权
标题翻译：玻璃熔融法
公开(公告)号：US20110072855A1
公开(公告)日：2011-03-31
申请号：US12994320
申请日：2009-05-11
申请人： Satoshi Matsumoto , Toshimitsu Wakuda
发明人： Satoshi Matsumoto , Toshimitsu Wakuda
IPC分类号： C03B23/20
CPC分类号： C03C27/06 , C03C8/24
摘要： After a glass layer 3 is disposed between a glass member 4 and a thermal conductor 7 along a region to be fused, a laser beam L1 is emitted while the thermal conductor 7 is used as a heat sink, so as to melt the glass layer 3, thereby burning and fixing the glass layer 3 onto the glass member 4. While the glass layer 3 drastically increases its laser absorptance at the time of burning, the thermal conductor 7 serves as the heatsink and draws heat from the glass layer 3, thereby inhibiting the glass layer 3 from falling into an excessive heat input state. Thereafter, another glass member is overlaid on the glass member 4 having the glass layer 3 burned thereonto, such that the glass layer 3 is interposed therebetween. Then, the region to be fused is irradiated therealong with a laser beam, so as to fuse the glass members together.
摘要翻译：在玻璃构件4和热导体7之间沿着熔融区域设置玻璃层3之后，在将热导体7用作散热器的同时发射激光束L1，从而熔化玻璃层3 ，从而将玻璃层3烧结并固定在玻璃部件4上。玻璃层3在燃烧时显着提高其激光吸收率，热导体7作为散热器，从玻璃层3吸引热量，从而抑制玻璃层3落入过热输入状态。此后，将另一个玻璃构件覆盖在玻璃层4上，玻璃层3被烧在其上，使得玻璃层3插入其间。然后，用激光束照射要熔化的区域，以将玻璃构件熔合在一起。

8. 发明授权

US08969761B2 Method of cutting a wafer-like object and semiconductor chip 有权
标题翻译：切割晶片状物体和半导体芯片的方法
公开(公告)号：US08969761B2
公开(公告)日：2015-03-03
申请号：US12912427
申请日：2010-10-26
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
IPC分类号： B23K26/00 , C03C23/00 , B23K26/03 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/08 , B23K26/36 , B23K26/40 , B28D5/00 , C03B33/023 , C03B33/08 , C03B33/10 , G02F1/1368
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
摘要翻译：一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合即使形成了修改区域。

9. 发明申请

US20130017670A1 LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US20130017670A1
公开(公告)日：2013-01-17
申请号：US13596781
申请日：2012-08-28
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
IPC分类号： B23K26/00 , B23K26/06 , H01L21/268 , B23K26/08
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser processing method comprising a step of irradiating an object to be processed with laser light elliptically polarized with an ellipticity of other than 1 such that a light-converging point of the laser light is located within the object along the major axis of an ellipse indicative of the elliptical polarization of laser light, along a line which the object is intended to be cut, to form a modified region caused by multiphoton absorption within the object, along the line which the object is intended to be cut.
摘要翻译：一种激光加工方法，其特征在于，包括如下步骤：用椭圆偏振以外的激光进行椭圆偏振以外的激光照射1以使激光的聚光点沿着椭圆的长轴位于物体内沿着物体意图被切割的线，激光的椭圆偏振，沿物体意图切割的线形成由物体内的多光子吸收引起的改质区域。

10. 发明申请

US20100055876A1 Laser processing method and laser processing apparatus 有权
公开(公告)号：US20100055876A1
公开(公告)日：2010-03-04
申请号：US12461969
申请日：2009-08-31
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： H01L21/268 , B23K26/00
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

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