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    • 7. 发明申请
    • HIGH DENSITY BUTTED JUNCTION CMOS INVERTER, AND MAKING AND LAYOUT OF SAME
    • 高密度指针式CMOS反相器,以及其制造和布局
    • US20110291193A1
    • 2011-12-01
    • US12788362
    • 2010-05-27
    • Andres BryantJosephine B. ChangJeffrey W. Sleight
    • Andres BryantJosephine B. ChangJeffrey W. Sleight
    • H01L27/12H01L21/86
    • H01L27/1203H01L21/26586H01L21/823807H01L21/823878H01L21/84
    • A high density, asymmetric, butted junction CMOS inverter, formed on an SOI substrate, may include: an asymmetric p-FET that includes a halo implant on only a source side of the p-FET; an asymmetric n-FET that includes a halo implant on only a source side of the n-FET; and a butted junction comprising an area of said SOI substrate where a drain region of the asymmetric n-FET and a drain region of the asymmetric p-FET are in direct physical contact. Asymmetric halo implants may be formed by a sequential process of covering a first FET of the CMOS inverter with an ion-absorbing structure and applying angled ion radiation to only the source side of the second FET, removing the ion-absorbing structure, covering the first FET with a second ion-absorbing structure, and applying angled ion radiation to only the source side of the second FET. A layout display of CMOS integrated circuit may require one ground rule for the high density, asymmetric butted junction CMOS inverter and another ground rule for other CMOS circuits.
    • 形成在SOI衬底上的高密度,不对称对接结CMOS反相器可以包括:非对称p-FET,其仅在p-FET的源极侧包括卤素注入; 一个不对称的n-FET,其仅在n-FET的源极侧包括一个卤素注入; 以及包括所述SOI衬底的区域的对接结,其中所述非对称n-FET的漏极区域和所述非对称p-FET的漏极区域直接物理接触。 可以通过以离子吸收结构覆盖CMOS反相器的第一FET的顺序过程形成非对称晕环植入物,并且仅向第二FET的源极侧施加成角度的离子辐射,去除离子吸收结构,覆盖第一 FET,具有第二离子吸收结构,并且仅向第二FET的源极侧施加成角度的离子辐射。 CMOS集成电路的布局显示可能需要高密度,不对称对接结CMOS反相器和其他CMOS电路的另一个接地规则的一个接地规则。