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    • 3. 发明申请
    • Ink-jet printhead package
    • 喷墨打印头包装
    • US20050012775A1
    • 2005-01-20
    • US10833039
    • 2004-04-28
    • Sang-chae KimJae-woo ChungSeung-mo Lim
    • Sang-chae KimJae-woo ChungSeung-mo Lim
    • B41J2/165B41J2/045B41J2/055B41J2/14B41J2/145B41J2/16B41J2/235B41J2/01
    • B41J2/145B41J2/14233B41J2002/14362B41J2002/14491
    • An ink-jet printhead package includes a frame having a first surface and a second surface with a hollow and an ink supply hole, the hollow and the ink supply hole extending through the frame, the ink supply hole providing flow communication between the first surface and the second surface, a groove formed on the second surface of the frame, the groove surrounding the hollow and the ink supply hole, an adhesive coating an interior of the groove, and a printhead chip having a first surface and a second surface, the first surface of the printhead chip having a plurality of nozzles formed thereon and the second surface of the printhead chip being adhered to the frame by the adhesive, the printhead chip being operable to eject ink supplied through the ink supply hole through the plurality of nozzles.
    • 喷墨打印头封装包括具有第一表面的框架和具有中空和供墨孔的第二表面,中空和供墨孔延伸穿过框架,供墨孔提供第一表面和第二表面之间的流动连通 第二表面,形成在框架的第二表面上的凹槽,围绕中空部分和供墨孔的凹槽,凹槽内部的粘合剂涂层以及具有第一表面和第二表面的打印头芯片, 打印头芯片的表面具有形成在其上的多个喷嘴,并且打印头芯片的第二表面通过粘合剂粘附到框架,打印头芯片可操作以通过多个喷嘴喷射通过供墨孔供应的油墨。
    • 4. 发明授权
    • Ink-jet printhead package
    • 喷墨打印头包装
    • US07185968B2
    • 2007-03-06
    • US10833039
    • 2004-04-28
    • Sang-chae KimJae-woo ChungSeung-mo Lim
    • Sang-chae KimJae-woo ChungSeung-mo Lim
    • B41J2/015
    • B41J2/145B41J2/14233B41J2002/14362B41J2002/14491
    • An ink-jet printhead package includes a frame having a first surface and a second surface with a hollow and an ink supply hole, the hollow and the ink supply hole extending through the frame, the ink supply hole providing flow communication between the first surface and the second surface, a groove formed on the second surface of the frame, the groove surrounding the hollow and the ink supply hole, an adhesive coating an interior of the groove, and a printhead chip having a first surface and a second surface, the first surface of the printhead chip having a plurality of nozzles formed thereon and the second surface of the printhead chip being adhered to the frame by the adhesive, the printhead chip being operable to eject ink supplied through the ink supply hole through the plurality of nozzles.
    • 喷墨打印头封装包括具有第一表面的框架和具有中空和供墨孔的第二表面,中空和供墨孔延伸穿过框架,供墨孔提供第一表面和第二表面之间的流动连通 第二表面,形成在框架的第二表面上的凹槽,围绕中空部分和供墨孔的凹槽,凹槽内部的粘合剂涂层以及具有第一表面和第二表面的打印头芯片, 打印头芯片的表面具有形成在其上的多个喷嘴,并且打印头芯片的第二表面通过粘合剂粘附到框架,打印头芯片可操作以通过多个喷嘴喷射通过供墨孔供应的油墨。
    • 6. 发明授权
    • Optical module and method for manufacturing the same
    • 光模块及其制造方法
    • US06986609B2
    • 2006-01-17
    • US10138719
    • 2002-05-06
    • Sang-chae KimHyung ChoiYong-sung Kim
    • Sang-chae KimHyung ChoiYong-sung Kim
    • G02B6/42B32B3/00C23F1/00
    • G02B6/3584G02B6/32G02B6/3512G02B6/3546G02B6/3652G02B6/3692G02B26/0816
    • An optical module, in which one or more grooves on which a plurality of optical fibers or optical parts are mounted, are formed to different depths and a stopper hole is manufactured so as to prevent a convex corner phenomenon so that an optical axis is precisely aligned, and a method of manufacturing the same are provided. The method of manufacturing an optical module includes the steps of first etching to form one or more grooves on a first surface of a wafer, and second etching to form one or more stopper holes so that a second surface of the wafer is etched to penetrate the wafer. The optical module having one or more grooves for mounting one or more optical parts on a substrate, includes stopper holes which are formed by penetrating the bottom surface of the substrate to center a region which corresponds to a predetermined region among the grooves.
    • 在其中安装有多个光纤或光学部件的一个或多个凹槽的光学模块形成为不同的深度,并且制造止动孔以防止凸角现象,使得光轴精确对准 ,及其制造方法。 制造光学模块的方法包括以下步骤:首先蚀刻以在晶片的第一表面上形成一个或多个凹槽,以及第二蚀刻以形成一个或多个止动孔,使得晶片的第二表面被蚀刻以穿透 晶圆。 具有用于将一个或多个光学部件安装在基板上的一个或多个凹槽的光学模块包括通过穿透基板的底表面而形成的止挡孔,以使与凹槽中的预定区域对应的区域居中。