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1. 发明授权

US07414303B2 Lead on chip semiconductor package 失效
标题翻译：芯片半导体封装领先
公开(公告)号：US07414303B2
公开(公告)日：2008-08-19
申请号：US11078640
申请日：2005-03-11
申请人： Sang-Hyeop Lee , Se-Yong Oh , Jin-Ho Kim , Chan-Suk Lee , Min-Keun Kwak , Sung-Hwan Yoon , Tae-Duk Nam
发明人： Sang-Hyeop Lee , Se-Yong Oh , Jin-Ho Kim , Chan-Suk Lee , Min-Keun Kwak , Sung-Hwan Yoon , Tae-Duk Nam
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49513 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.
摘要翻译：本发明提供一种LOC封装，其中引线框架与半导体器件直接接触。包括开口的引线框架直接位于半导体器件上。在引线框架的开口中施加粘合材料。该粘合剂材料与引线框架和半导体器件接触。因此，引线框架牢固地保持在半导体器件上。然后可以将导线接合到半导体器件和引线框架上的接触焊盘。

2. 发明申请

US20050212099A1 Lead on chip semiconductor package 失效
标题翻译：芯片半导体封装领先
公开(公告)号：US20050212099A1
公开(公告)日：2005-09-29
申请号：US11078640
申请日：2005-03-11
申请人： Sang-Hyeop Lee , Se-Yong Oh , Jing-Ho Kim , Chan-Suk Lee , Min-Keun Kwak , Sung-Hwan Yoon , Tae-Duk Nam
发明人： Sang-Hyeop Lee , Se-Yong Oh , Jing-Ho Kim , Chan-Suk Lee , Min-Keun Kwak , Sung-Hwan Yoon , Tae-Duk Nam
IPC分类号： H01L23/495
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49513 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.
摘要翻译：本发明提供一种LOC封装，其中引线框架与半导体器件直接接触。包括开口的引线框架直接位于半导体器件上。在引线框架的开口中施加粘合材料。该粘合剂材料与引线框架和半导体器件接触。因此，引线框架牢固地保持在半导体器件上。然后可以将导线接合到半导体器件和引线框架上的接触焊盘。

3. 发明授权

US07364784B2 Thin semiconductor package having stackable lead frame and method of manufacturing the same 失效
公开(公告)号：US07364784B2
公开(公告)日：2008-04-29
申请号：US10834187
申请日：2004-04-29
申请人： Jin-Ho Kim , Sung-Hwan Yoon
发明人： Jin-Ho Kim , Sung-Hwan Yoon
IPC分类号： H01L23/495 , H01L21/784
CPC分类号： H01L23/4951 , H01L23/3107 , H01L23/49551 , H01L24/48 , H01L25/105 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01079 , H01L2924/07802 , Y10T428/24207 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that exposes bonding pads within an aperture formed in a center portion of the lead frame and a peripheral terminal pad portion for establishing external contacts. A plurality of bonding wires are used to establish electrical connection between a lower surface of the paddle part and corresponding bonding pads with intermediate leads providing connection to the terminal pad portions. The semiconductor chip, lead frame and bonding wires may then be encapsulated to form a thin semiconductor package having a thickness substantially equal to that of the terminal pad portions. The thin semiconductor packages may, in turn, be used to form multi-chip stack packages using known good semiconductor chips to form a high-density compound semiconductor packages.

4. 发明授权

US07615859B2 Thin semiconductor package having stackable lead frame and method of manufacturing the same 失效
标题翻译：具有可堆叠引线框的薄型半导体封装及其制造方法
公开(公告)号：US07615859B2
公开(公告)日：2009-11-10
申请号：US12076044
申请日：2008-03-13
申请人： Jin-Ho Kim , Sung-Hwan Yoon
发明人： Jin-Ho Kim , Sung-Hwan Yoon
IPC分类号： H01L23/495 , H01L21/784
CPC分类号： H01L23/4951 , H01L23/3107 , H01L23/49551 , H01L24/48 , H01L25/105 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01079 , H01L2924/07802 , Y10T428/24207 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that exposes bonding pads within an aperture formed in a center portion of the lead frame and a peripheral terminal pad portion for establishing external contacts. A plurality of bonding wires are used to establish electrical connection between a lower surface of the paddle part and corresponding bonding pads with intermediate leads providing connection to the terminal pad portions. The semiconductor chip, lead frame and bonding wires may then be encapsulated to form a thin semiconductor package having a thickness substantially equal to that of the terminal pad portions. The thin semiconductor packages may, in turn, be used to form multi-chip stack packages using known good semiconductor chips to form a high-density compound semiconductor packages.
摘要翻译：提供了一种薄半导体封装，其包括半导体芯片和引线框架，该引线框架包括：配置用于以形成在引线框的中心部分中的孔内露出焊盘的方式安装半导体芯片的桨形部分，端子焊盘部分，用于建立外部触点。多个接合线用于在桨形部分的下表面和相应的接合焊盘之间建立电连接，中间引线提供与端子焊盘部分的连接。然后可以将半导体芯片，引线框和接合线封装成具有基本上等于端子焊盘部分的厚度的薄的半导体封装。薄的半导体封装又可以用于使用已知的良好半导体芯片形成多芯片堆叠封装以形成高密度化合物半导体封装。

5. 发明申请

US20050054141A1 Thin semiconductor package having stackable lead frame and method of manufacturing the same 失效
标题翻译：具有可堆叠引线框的薄型半导体封装及其制造方法
公开(公告)号：US20050054141A1
公开(公告)日：2005-03-10
申请号：US10834187
申请日：2004-04-29
申请人： Jin-Ho Kim , Sung-Hwan Yoon
发明人： Jin-Ho Kim , Sung-Hwan Yoon
IPC分类号： H01L23/12 , H01L21/44 , H01L23/31 , H01L23/495 , H01L25/10
CPC分类号： H01L23/4951 , H01L23/3107 , H01L23/49551 , H01L24/48 , H01L25/105 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01079 , H01L2924/07802 , Y10T428/24207 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that exposes bonding pads within an aperture formed in a center portion of the lead frame and a peripheral terminal pad portion for establishing external contacts. A plurality of bonding wires are used to establish electrical connection between a lower surface of the paddle part and corresponding bonding pads with intermediate leads providing connection to the terminal pad portions. The semiconductor chip, lead frame and bonding wires may then be encapsulated to form a thin semiconductor package having a thickness substantially equal to that of the terminal pad portions. The thin semiconductor packages may, in turn, be used to form multi-chip stack packages using known good semiconductor chips to form a high-density compound semiconductor packages.
摘要翻译：提供了一种薄半导体封装，其包括半导体芯片和引线框架，该引线框架包括：配置用于以形成在引线框的中心部分中的孔内露出焊盘的方式安装半导体芯片的桨形部分，端子焊盘部分，用于建立外部触点。多个接合线用于在桨形部分的下表面和相应的接合焊盘之间建立电连接，中间引线提供与端子焊盘部分的连接。然后可以将半导体芯片，引线框和接合线封装成具有基本上等于端子焊盘部分的厚度的薄的半导体封装。薄的半导体封装又可以用于使用已知的良好半导体芯片形成多芯片堆叠封装以形成高密度化合物半导体封装。

6. 发明申请

US20080164586A1 Thin semiconductor package having stackable lead frame and method of manufacturing the same 失效
标题翻译：具有可堆叠引线框的薄型半导体封装及其制造方法
公开(公告)号：US20080164586A1
公开(公告)日：2008-07-10
申请号：US12076044
申请日：2008-03-13
申请人： Jin-Ho Kim , Sung-Hwan Yoon
发明人： Jin-Ho Kim , Sung-Hwan Yoon
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L23/3107 , H01L23/49551 , H01L24/48 , H01L25/105 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01079 , H01L2924/07802 , Y10T428/24207 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that exposes bonding pads within an aperture formed in a center portion of the lead frame and a peripheral terminal pad portion for establishing external contacts. A plurality of bonding wires are used to establish electrical connection between a lower surface of the paddle part and corresponding bonding pads with intermediate leads providing connection to the terminal pad portions. The semiconductor chip, lead frame and bonding wires may then be encapsulated to form a thin semiconductor package having a thickness substantially equal to that of the terminal pad portions. The thin semiconductor packages may, in turn, be used to form multi-chip stack packages using known good semiconductor chips to form a high-density compound semiconductor packages.
摘要翻译：提供了一种薄半导体封装，其包括半导体芯片和引线框架，该引线框架包括：配置用于以形成在引线框的中心部分中的孔内露出焊盘的方式安装半导体芯片的桨形部分，端子焊盘部分，用于建立外部触点。多个接合线用于在桨形部分的下表面和相应的接合焊盘之间建立电连接，中间引线提供与端子焊盘部分的连接。然后可以将半导体芯片，引线框和接合线封装成具有基本上等于端子焊盘部分的厚度的薄的半导体封装。薄的半导体封装又可以用于使用已知的良好半导体芯片形成多芯片堆叠封装以形成高密度化合物半导体封装。

7. 发明授权

US08022517B2 Semiconductor chip package 失效
标题翻译：半导体芯片封装
公开(公告)号：US08022517B2
公开(公告)日：2011-09-20
申请号：US12266765
申请日：2008-11-07
申请人： Sung-Hwan Yoon , Sang-Wook Park , Min-Young Son
发明人： Sung-Hwan Yoon , Sang-Wook Park , Min-Young Son
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/293 , H01L23/3107 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2225/06562 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring.
摘要翻译：半导体芯片封装包括引线框架，绝缘构件，芯片，接合线和密封构件。引线框架包括多个第一引线和多个第二引线。第二引线具有芯片粘附区域。绝缘构件填充芯片粘合区域中的第二引线之间的空间。芯片设置在绝缘构件的至少一个表面上。该芯片具有单面接合焊盘。接合线将引线和接合焊盘电连接。密封构件覆盖引线框架，绝缘构件，芯片和接合线。由于第二引线之间的空间填充有绝缘构件，因此可以防止发生空隙。

8. 发明授权

US07847396B2 Semiconductor chip stack-type package and method of fabricating the same 有权
标题翻译：半导体芯片堆叠型封装及其制造方法
公开(公告)号：US07847396B2
公开(公告)日：2010-12-07
申请号：US12196088
申请日：2008-08-21
申请人： Sung-Hwan Yoon
发明人： Sung-Hwan Yoon
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/49531 , H01L24/48 , H01L2224/32145 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/07802 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the inventive concept provide a semiconductor chip stack-type package. The package comprises a lead frame including a die paddle part and a lead part, a first semiconductor chip group and a second semiconductor chip group stacked sequentially and mounted on one surface of the die paddle part, a first wiring board between the first semiconductor chip group and the second semiconductor chip group, and second semiconductor chip group bonding wires for electrically connecting the second semiconductor chip group to the first wiring board. End portions of the first wiring board are electrically connected to inner leads of the lead part, which is adjacent to the die paddle part.
摘要翻译：本发明构思的实施例提供半导体芯片堆叠型封装。该封装包括一个引线框架，该引线框架包括一片模片部分和一引线部分，一第一半导体芯片组和一第二半导体芯片组依次堆叠并安装在该芯片桨片的一个表面上;第一布线板，位于该第一半导体芯片组和第二半导体芯片组，以及用于将第二半导体芯片组电连接到第一布线板的第二半导体芯片组接合线。第一布线板的端部电连接到与芯片部分相邻的引线部分的内引线。

9. 发明申请

US20070154293A1 Apparatus for loading substrate of liquid crystal display 有权
标题翻译：用于装载液晶显示器的基板的装置
公开(公告)号：US20070154293A1
公开(公告)日：2007-07-05
申请号：US11477630
申请日：2006-06-30
申请人： Sung-Hwan Yoon
发明人： Sung-Hwan Yoon
IPC分类号： B65B69/00
CPC分类号： H01L21/67763
摘要： An apparatus for transferring a plurality of substrates in manufacturing a liquid crystal display, includes a storage unit to store the plurality of substrates, an unloading member disposed in the storage unit to unload the substrates from the storage unit, a cassette disposed in the storage unit to lift and lower the plurality of substrates between respective storage substrate positions and the unloading member, a processing equipment to receive the substrates unloaded from the cassette, and a substrate feeder to receive the substrates from the storage unit unloaded by the unloading member and to load the substrates into the processing equipment.
摘要翻译：一种用于在制造液晶显示器中传送多个基板的装置，包括：存储单元，用于存储多个基板;卸载部件，设置在存储单元中，以从存储单元卸载基板;盒，设置在存储单元中在各个存储基板位置和卸载部件之间提升和降低多个基板，接收从盒卸载的基板的处理设备和用于从卸载部件卸载的存储单元接收基板的基板进给器，将基材加入加工设备。

10. 发明授权

US07132463B2 Biodegradable composition having improved water resistance and process for producing same 有权
标题翻译：具有改善的耐水性的生物可降解组合物及其生产方法
公开(公告)号：US07132463B2
公开(公告)日：2006-11-07
申请号：US10490671
申请日：2003-06-09
申请人： Soon-Geun Hwang , Heon-Moo Kim , Sung-Arn Lee , Joo-Yup Eom , Kang-Soo Kim , Sung-Hwan Yoon
发明人： Soon-Geun Hwang , Heon-Moo Kim , Sung-Arn Lee , Joo-Yup Eom , Kang-Soo Kim , Sung-Hwan Yoon
IPC分类号： C08K11/00
CPC分类号： C08L33/08 , C08L1/00 , C08L3/04 , C08L33/14 , C08L97/02 , C08L2205/16 , C08L2666/02 , C08L2666/04 , C08L2666/26
摘要： The biodegradable composition of the present invention comprising a matrix of a fibrous powder coated with an acrylate copolymer and a natural polymer dispersed in the matrix, can be advantageously used in manufacturing disposable containers for fast food, e.g., cup noodles.
摘要翻译：包含涂覆有丙烯酸酯共聚物的纤维粉末基质和分散在基体中的天然聚合物的本发明的可生物降解的组合物可有利地用于制造用于快餐的一次性容器，例如杯形面条。

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