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1. 发明申请

US20080069947A1 METHOD AND APPARATUS FOR FLUX COATING OF HEAT EXCHANGER TUBE 审中-公开
标题翻译：换热器管道焊接方法及装置
公开(公告)号：US20080069947A1
公开(公告)日：2008-03-20
申请号：US11857652
申请日：2007-09-19
申请人： Sang-Heon Lee , Jong-Seo Yoon , Youn-Hak Shin , Byoung-Kwang Lee
发明人： Sang-Heon Lee , Jong-Seo Yoon , Youn-Hak Shin , Byoung-Kwang Lee
IPC分类号： B05D1/36 , B05C19/04 , B05C3/02
CPC分类号： B05D1/18 , B05D1/12 , B05D3/0254 , B05D7/14 , B05D7/54 , B05D2202/25 , B05D2254/00 , F28F1/022 , F28F21/084 , F28F21/089
摘要： For flux coating of a heat exchanger tube made of aluminum, firstly, the heat exchanger tube is dipped in a storage tank containing a mixture of binder and solvent to coat the mixture on a surface of the heat exchanger tube, thereby forming a first coating layer on the surface of the heat exchanger tube. Then, flux powder is sprayed to the surface of the heat exchanger tube on which the first coating layer is formed, thereby forming a second coating layer. After that, a thickness of the heat exchanger tube on which the second coating layer is formed is controlled. Then, the thickness-controlled heat exchanger tube is heated to 150° C. or below so as to remove the solvent from the second coating layer.
摘要翻译：对于由铝制成的热交换器管的焊剂涂布，首先，将热交换器管浸入含有粘合剂和溶剂的混合物的储罐中，以在热交换器管的表面上涂布混合物，从而形成第一涂层在热交换器管的表面上。然后，将助熔剂粉末喷射到其上形成有第一涂层的热交换器管的表面，从而形成第二涂层。之后，控制形成有第二被覆层的热交换管的厚度。然后，将厚度控制的热交换器管加热至150℃以下，以从第二被覆层除去溶剂。

2. 发明申请

US20120040241A1 COPPER FOIL FOR CURRENT COLLECTOR OF LITHIUM SECONDARY BATTERY 审中-公开
标题翻译：锂二次电池电流收集器铜箔
公开(公告)号：US20120040241A1
公开(公告)日：2012-02-16
申请号：US12962180
申请日：2010-12-07
申请人： Dae-Young Kim , Byoung-Kwang Lee , Seung-Jun Choi
发明人： Dae-Young Kim , Byoung-Kwang Lee , Seung-Jun Choi
IPC分类号： H01M4/66
CPC分类号： H01M4/661 , C23F15/00 , C25D1/04 , C25D3/38 , H01M4/75 , H01M10/0525
摘要： A copper foil for a current collector of a lithium secondary battery is configured such that a nodule cluster having an inter-nodule aspect ratio of 0.001 to 2 is provided at a matte side formed on one surface of the copper foil, in aspect of a crystal structure, a ratio of a texture coefficient of a (200) surface to a sum of texture coefficients of a (111) surface and the (200) surface is 30 to 80%, the copper foil has a water contact angle of 90° or below, and impurity spots existing at the surface of the copper foil have a maximum diameter of 100 μm or less, and a minimal spacing distance between the impurity spots is 1 cm or more.
摘要翻译：另外，作为锂二次电池用集电体的铜箔，在铜箔的一面形成的无光泽面上设置结晶长宽比为0.001〜2的结核团，（200）表面的织构系数与（111）面和（200）表面的织构系数之和的比例为30〜80％，铜箔的接触角为90°，并且存在于铜箔表面的杂质点的最大直径为100μm以下，杂质点之间的最小间隔距离为1cm以上。

3. 发明授权

US08349518B2 Copper foil for current collector of lithium secondary battery with improved wrinkle characteristics 有权
标题翻译：锂二次电池集电器用铜箔，具有改善皱纹特性
公开(公告)号：US08349518B2
公开(公告)日：2013-01-08
申请号：US13029656
申请日：2011-02-17
申请人： Dae-Young Kim , Byoung-Kwang Lee , Seung-Jun Choi
发明人： Dae-Young Kim , Byoung-Kwang Lee , Seung-Jun Choi
IPC分类号： H01M4/64
CPC分类号： H01M4/661 , B32B15/01 , B32B2307/538 , B32B2307/54 , B32B2457/10 , C22C9/00 , C25D3/38 , C25D7/0614 , H01M4/667 , H01M10/052 , H01M10/0525 , Y10T428/12229 , Y10T428/12431 , Y10T428/12472 , Y10T428/12993
摘要： A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 μm or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 μm.
摘要翻译：用于锂二次电池的集电体的铜箔具有晶体结构，其中（111）表面和（200）表面的织构系数之和与（111）的织构系数的总和的比率（111），（200）和（220）的织构系数的总和的比例为（18），（200）和（220）（200）表面的织构系数的比例为28〜62％，（220）表面的织构系数的比例为15〜40％。铜箔的表面粗糙度（Rz-JIS）为2μm以下，重量偏差为3％以下，拉伸强度为30〜40kgf / mm 2，伸长率为3〜20％，厚度为1〜35μm。

4. 发明申请

US20080274896A1 Substrate for Superconducting Wire and Fabrication Method Thereof and Superconducting Wire 审中-公开
标题翻译：超导线基板及其制造方法及超导线
公开(公告)号：US20080274896A1
公开(公告)日：2008-11-06
申请号：US11913829
申请日：2005-09-05
申请人： Bong-Ki Ji , Byoung-Kwang Lee
发明人： Bong-Ki Ji , Byoung-Kwang Lee
IPC分类号： H01L39/00 , H01L39/24
CPC分类号： H01L39/2461 , H01L39/2454
摘要： A substrate for a superconducting wire is made of Ni or Ni alloy, with a ratio of cube texture of 95% or above constant in a width direction of a substrate body, a ratio of low-angle (15 or less) grain boundary of 99% or above regularly distributed in the width direction, a thickness of 40-150 μm, an average grain size of 100 μm or less, and a surface roughness of RMS 50 nm or less. A method for fabricating the substrate includes rolling a Ni or Ni-alloy rod with a rectangular section; and thermally treating the rolled rod, the rolling step having a reduction ratio of 5 to 15% at each rolling, the rod being moved between rollers for the rolling process at a linear velocity of 100 m/min or less, the thermally treating process being conducted by heating above a recrystallization temperature with flowing an inert gas including hydrogen gas.
摘要翻译：超导线基材由Ni或Ni合金制成，立方体结构在基体宽度方向上的比例为95％以上，低角度（15以下）的晶界比为99 在宽度方向上规则分布的％以上，厚度为40〜150μm，平均粒径为100μm以下，RMS为50nm以下的表面粗糙度。制造基板的方法包括：轧制具有矩形截面的Ni或Ni合金棒; 并且对轧制棒进行热处理，轧制步骤在每次轧制时具有5至15％的压下率，该棒在线速度为100m / min或更小的轧制过程中在辊之间移动，热处理工艺为通过使包含氢气的惰性气体流动，在再结晶温度以上进行加热。

5. 发明授权

US06541619B1 Fusion protein of hEGF and human angiogenin and process for preparing the same 失效
标题翻译： hEGF和人血管生成素的融合蛋白及其制备方法
公开(公告)号：US06541619B1
公开(公告)日：2003-04-01
申请号：US09530685
申请日：2000-07-13
申请人： Myung-Hwan Park , Seung-Kook Park , Jong-Myung Yoon , Seung-Hee Han , Byung-Kwon Oh , Seung-Ho Kim , Young-Man Kim , Tai-Young Koo , Byoung-Kwang Lee
发明人： Myung-Hwan Park , Seung-Kook Park , Jong-Myung Yoon , Seung-Hee Han , Byung-Kwon Oh , Seung-Ho Kim , Young-Man Kim , Tai-Young Koo , Byoung-Kwang Lee
IPC分类号： C12N1509
CPC分类号： C07K14/485 , A61K38/00 , C07K14/515 , C07K2319/00
摘要： The present invention provides a genetically engineered fusion protein consisting of hEGF that is internalized inside of the cells after tracing down the cancer cells expressing hEGF receptors and human angiogenin that is cytotoxic by degrading ribonucleotide upon internalization, a process for preparing a fusion protein in a large quantity by transforming E. coli with the expression vectors containing the gene encoding the fusion protein, and pharmaceutical application of the fusion protein as an anticancer agent. All components of the fusion protein form no antibodies and exhibit no immunotoxicity since they are derived from human. Each component alone is inactive to the cancer cells, however, once they are fused together, they kill the cancer cells selectively with a difference of 1000 fold in IC50 in spite of its low molecular weight. Therefore, the fusion protein of the present invention is capable of treating the cancer expressing hEGF receptors at high level without showing toxicity.
摘要翻译：本发明提供由hEGF构成的遗传工程改造的融合蛋白，其在追踪表达hEGF受体的癌细胞和通过内化后降解核糖核苷酸而细胞毒性的人血管生成素下追踪细胞内部化，在大量制备融合蛋白的方法通过用包含编码融合蛋白的基因的表达载体转化大肠杆菌的量和融合蛋白作为抗癌剂的药物应用。融合蛋白的所有组分不形成抗体并且不表现出免疫毒性，因为它们衍生自人。每个组分单独对癌细胞无活性，然而，一旦它们融合在一起，尽管其分子量低，它们以IC50的差异有选择地杀死癌细胞。因此，本发明的融合蛋白能够以高水平治疗表达hEGF的癌症受体，而不显示毒性。

6. 发明申请

US20120015206A1 COPPER FOIL FOR CURRENT COLLECTOR OF LITHIUM SECONDARY BATTERY WITH IMPROVED WRINKLE CHARACTERISTICS 有权
标题翻译：具有改进的特征的锂二次电池的电流收集器的铜箔
公开(公告)号：US20120015206A1
公开(公告)日：2012-01-19
申请号：US13029656
申请日：2011-02-17
申请人： Dae-Young KIM , Byoung-Kwang Lee , Seung-Jun Choi
发明人： Dae-Young KIM , Byoung-Kwang Lee , Seung-Jun Choi
IPC分类号： B32B15/01
CPC分类号： H01M4/661 , B32B15/01 , B32B2307/538 , B32B2307/54 , B32B2457/10 , C22C9/00 , C25D3/38 , C25D7/0614 , H01M4/667 , H01M10/052 , H01M10/0525 , Y10T428/12229 , Y10T428/12431 , Y10T428/12472 , Y10T428/12993
摘要： A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 μm or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 μm.
摘要翻译：用于锂二次电池的集电体的铜箔具有晶体结构，其中（111）表面和（200）表面的织构系数之和与（111）的织构系数的总和的比率（111），（200）和（220）的织构系数的总和的比例为（18），（200）和（220）（200）表面的织构系数的比例为28〜62％，（220）表面的织构系数的比例为15〜40％。铜箔的表面粗糙度（Rz-JIS）为2μm以下，重量偏差为3％以下，拉伸强度为30〜40kgf / mm 2，伸长率为3〜20％，厚度为1〜35μm。

7. 发明授权

US07768141B2 Dicing die attachment film and method for packaging semiconductor using same 有权
标题翻译：切割模附着膜及使用其的半导体封装方法
公开(公告)号：US07768141B2
公开(公告)日：2010-08-03
申请号：US12279519
申请日：2007-02-14
申请人： Joon-Mo Seo , Byoung-Un Kang , Kyung-Tae Wi , Jae-Hoon Kim , Tae-Hyun Sung , Soon-Young Hyun , Byoung-Kwang Lee , Chan-Young Choi
发明人： Joon-Mo Seo , Byoung-Un Kang , Kyung-Tae Wi , Jae-Hoon Kim , Tae-Hyun Sung , Soon-Young Hyun , Byoung-Kwang Lee , Chan-Young Choi
IPC分类号： H01L23/29
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83097 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01084 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00
摘要： A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.
摘要翻译：切割模附着膜包括附着在半导体晶片的一个表面上的管芯附着层; 连接到切割模具的切割膜层，用于将半导体晶片切割成模具单元; 以及层叠在芯片安装层和切割膜层之间的中间层。中间层的模量为100〜3000MPa，大于模具安装层和切割膜层的模量。

8. 发明申请

US20090091044A1 DICING DIE ATTACHMENT FILM AND METHOD FOR PACKAGING SEMICONDUCTOR USING SAME 有权
标题翻译：定影膜附着膜和使用其包装半导体的方法
公开(公告)号：US20090091044A1
公开(公告)日：2009-04-09
申请号：US12279519
申请日：2007-02-14
申请人： Joon-Mo Seo , Byoung-Un Kang , Kyung-Tae Wi , Jae-Hoon Kim , Tae-Hyun Sung , Soon-Young Hyun , Byoung-Kwang Lee , Chan-Young Choi
发明人： Joon-Mo Seo , Byoung-Un Kang , Kyung-Tae Wi , Jae-Hoon Kim , Tae-Hyun Sung , Soon-Young Hyun , Byoung-Kwang Lee , Chan-Young Choi
IPC分类号： H01L23/29 , H01L21/02
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83097 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01084 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00
摘要： A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.
摘要翻译：切割模附着膜包括附着在半导体晶片的一个表面上的管芯附着层; 连接到切割模具的切割膜层，用于将半导体晶片切割成模具单元; 以及层叠在芯片安装层和切割膜层之间的中间层。中间层的模量为100〜3000MPa，大于模具安装层和切割膜层的模量。

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