会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 10. 发明授权
    • LCD bonding machine and method for fabricating LCD by using the same
    • LCD结合机及其制作方法
    • US07426951B2
    • 2008-09-23
    • US11004076
    • 2004-12-06
    • Sang Seok LeeSang Ho Park
    • Sang Seok LeeSang Ho Park
    • B32B37/00
    • H01J9/261G02F1/1333G02F2001/133354
    • A bonding machine for fabrication of a large size LCD having an upper stage and a lower stage provided in a bonding chamber to face each other, for adsorbing the first and second substrates carried in the bonding chamber, and bonding the substrates together. The bonding machine having supporting means in the bonding chamber, lifting means, and process supplementing means fitted in the bonding chamber so as to be rotatable and movable up/down. The method including loading the first and second substrates on respective stages, driving the supporting means to support the second substrate loaded on the upper stage, and evacuating the bonding chamber, the upper stage adsorbing the second substrate and bonding the first and second substrates together, and lifting the bonded first and second substrates from the lower stage by using the lifting means, and unloading the first and second substrates.
    • 一种用于制造具有在接合室中彼此面对的上层和下层的大尺寸LCD的接合机,用于吸附承载在接合室中的第一和第二基板,并将基板接合在一起。 粘合机在粘合室中具有支撑装置,提升装置和装配在粘结室中以便可上下移动和移动的加工装置。 所述方法包括将第一和第二基板装载在各个台上,驱动支撑装置以支撑装载在上层的第二基板,以及抽空接合室,上段吸附第二基板并将第一和第二基板接合在一起, 以及通过使用提升装置从下层提升结合的第一和第二基板,以及卸载第一和第二基板。