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    • 2. 发明授权
    • Head lamp for vehicle
    • 汽车头灯
    • US08596842B2
    • 2013-12-03
    • US13172650
    • 2011-06-29
    • Jae Hun Lee
    • Jae Hun Lee
    • F21V7/09F21V7/00
    • F21S41/338
    • A head lamp apparatus for a vehicle may include a reflector provided with a light source that emits light to reflect the light emitted from the light source in a forward direction, the reflector having an upper end at which a first auxiliary reflective surface may be formed, and a lower end at which a second auxiliary reflective surface may be formed, and a bezel mounted in front of the reflector and having an upper part on which a first reflective hole that corresponds to the first auxiliary reflective surface may be formed, and a lower part on which a second reflective hole that corresponds to the second auxiliary reflective surface may be formed.
    • 一种用于车辆的前照灯装置可以包括:反射器,其设置有发射光的光源,以向前方向反射从光源发射的光,反射器具有可以形成第一辅助反射表面的上端; 以及可以形成第二辅助反射表面的下端,以及安装在反射器前面的边框,并且具有可以形成与第一辅助反射表面相对应的第一反射孔的上部,下部 可以形成对应于第二辅助反射表面的第二反射孔的部分。
    • 4. 发明申请
    • Packing Paper Box
    • 包装纸箱
    • US20080149694A1
    • 2008-06-26
    • US11963020
    • 2007-12-21
    • Jae Hun LeeJong Guen LeeZee Heon Kim
    • Jae Hun LeeJong Guen LeeZee Heon Kim
    • B65D5/00B65D5/46
    • B65D5/247B65D5/4608B65D5/6667
    • The present invention relates to a packing paper box, in which a piece of packing paper is folded, first and second connecting sections are combined, and third and fourth connecting sections are combined, whereby a user can easily make without cutting packing paper. To this end, a packing paper box comprises a body portion having an accommodation space defined therein and including first and second connecting sections; a cover portion, the body portion being covered with the cover portion; and a connection portion including third and fourth connecting sections formed to each other between the body portion and the cover portion, wherein the first and second connecting sections are combined with each other, and the third and fourth connecting sections are combined with each other.
    • 包装纸盒本发明涉及一种包装纸被折叠的包装纸箱,第一和第二连接部分组合,并且第三和第四连接部分组合在一起,由此用户可以容易地制作而不需要切割包装纸。 为此,包装纸盒包括主体部分,其具有限定在其中的容纳空间,并且包括第一和第二连接部分; 盖部分,主体部分被盖部分覆盖; 以及连接部分,包括在主体部分和盖部分之间彼此形成的第三和第四连接部分,其中第一和第二连接部分彼此组合,并且第三和第四连接部分彼此组合。
    • 6. 发明授权
    • Method of measuring thickness of thin film using microwave
    • 使用微波测量薄膜厚度的方法
    • US07535236B2
    • 2009-05-19
    • US11994247
    • 2006-09-28
    • Sang Young LeeJae Hun LeeHyun Kyung HanSang Geun LeeByung Woo Park
    • Sang Young LeeJae Hun LeeHyun Kyung HanSang Geun LeeByung Woo Park
    • G01R27/04G01R27/32
    • G01B15/025
    • The present invention relates to a thickness measurement method for thin films using microwaves. In the method, the Q-factors of a dielectric resonator are measured. The effective surface resistance (RSeff) of a superconductor or a conductor film and the loss tangent of a dielectric are determined using the Q-factor. The penetration depth λ for the superconductor film is measured using a dielectric resonator with a small gap between the superconductor film at the top of the resonator and the rest. The intrinsic surface resistance of superconductor films for calibration is determined using the measured RSeff and λ while the intrinsic surface resistance of a conductor film for calibration is determined using the measured RSeff and the nature of the intrinsic surface resistance being equal to the intrinsic surface reactance. The thickness of a superconductor or a conductor film is measured using a relation between the RSeff and the calibrated intrinsic surface resistance for superconductor films or conductor films.
    • 本发明涉及使用微波的薄膜的厚度测量方法。 在该方法中,测量介质谐振器的Q因子。 使用Q因子确定超导体或导体膜的有效表面电阻(RSeff)和电介质的损耗角正切。 超导薄膜的穿透深度λ是使用在谐振器顶部的超导薄膜与其余部分之间具有小间隙的介质谐振器来测量的。 使用测量的RSeff和λ测定用于校准的超导体膜的固有表面电阻,而使用所测量的RSeff和本征表面电阻的性质等于固有表面电抗确定用于校准的导体膜的固有表面电阻。 使用超导体膜或导体膜的RSeff与校正的固有表面电阻之间的关系来测量超导体或导体膜的厚度。
    • 10. 发明申请
    • Method of Measuring Thickness of Thin Film Using Microwave
    • 使用微波测量薄膜厚度的方法
    • US20080205595A1
    • 2008-08-28
    • US11994247
    • 2006-09-28
    • Sang Young LeeJae Hun LeeHyun Kyung HanSang Geun LeeByung Woo Park
    • Sang Young LeeJae Hun LeeHyun Kyung HanSang Geun LeeByung Woo Park
    • G01B15/02
    • G01B15/025
    • The present invention relates to a thickness measurement method for thin films using microwaves. In the method, the Q-factors of a dielectric resonator are measured. The effective surface resistance (RSeff) of a superconductor or a conductor film and the loss tangent of a dielectric are determined using the Q-factor. The penetration depth λ for the superconductor film is measured using a dielectric resonator with a small gap between the superconductor film at the top of the resonator and the rest. The intrinsic surface resistance of superconductor films for calibration is determined using the measured RSeff and λ while the intrinsic surface resistance of a conductor film for calibration is determined using the measured RSeff and the nature of the intrinsic surface resistance being equal to the intrinsic surface reactance. The thickness of a superconductor or a conductor film is measured using a relation between the RSeff and the calibrated intrinsic surface resistance for superconductor films or conductor films.
    • 本发明涉及使用微波的薄膜的厚度测量方法。 在该方法中,测量介质谐振器的Q因子。 使用Q因子确定超导体或导体膜的有效表面电阻(R sub S eff)和电介质的损耗角正切。 超导薄膜的穿透深度λ是使用在谐振器顶部的超导薄膜与其余部分之间具有小间隙的介质谐振器来测量的。 用于校准的超导体膜的固有表面电阻是使用测量的R S S O SUP和λ确定的,而用于校准的导体膜的固有表面电阻是使用测量的R 本征表面电阻的性质等于固有表面电抗。 使用超导体膜或导体膜的校准固有表面电阻之间的关系来测量超导体或导体膜的厚度。