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    • 2. 发明授权
    • Method of creating a template employing a lift-off process
    • 使用剥离过程创建模板的方法
    • US07906274B2
    • 2011-03-15
    • US11943907
    • 2007-11-21
    • Gerard M. SchmidDouglas J. ResnickMichael N. Miller
    • Gerard M. SchmidDouglas J. ResnickMichael N. Miller
    • G03F7/00G03F7/09G03F7/26G03F7/40
    • G03F7/0002B82Y10/00B82Y40/00
    • A method of forming a lithographic template, the method including, inter alia, creating a multi-layered structure, by forming, on a body, a conducting layer, and forming on the conducting layer, a patterned layer having protrusions and recessions, the recessions exposing portions of the conducting layer; depositing a hard mask material anisotropically on the multi-layered structure covering a top surface of the patterned layer and the portions of the conducting layer; removing the patterned layer by a lift-off process, with the hard mask material remaining on the portions of the conducting layer; positioning a resist pattern on the multi-layered structure to define a region of the multi-layered structure; and selectively removing portions of the multi-layered structure in superimposition with the region using the hard mask material as an etching mask.
    • 一种形成光刻模板的方法,所述方法尤其包括通过在主体上形成导电层并在导电层上形成具有突起和凹陷的图案层,形成多层结构,所述凹陷 暴露导电层的部分; 在覆盖图案化层的顶表面和导电层的部分的多层结构上各向异性地沉积硬掩模材料; 通过剥离过程去除图案层,硬掩模材料残留在导电层的部分上; 将抗蚀剂图案定位在所述多层结构上以限定所述多层结构的区域; 并且使用硬掩模材料作为蚀刻掩模选择性地去除与该区域重叠的多层结构的部分。
    • 6. 发明授权
    • Method for plating an x-ray mask
    • 电镀X射线掩模的方法
    • US5266183A
    • 1993-11-30
    • US881111
    • 1992-05-11
    • William J. DauksherDouglas J. Resnick
    • William J. DauksherDouglas J. Resnick
    • G03F1/16C25D3/48G21K3/00H01L21/027
    • C25D3/48
    • A method for making an x-ray mask having a low-stress absorber layer. A substrate is placed in an electroplating system and an electroplating solution is provided to the electroplating system. The electroplating solution has a gold sulfite based component and a thallium based component. The thallium based component is at a concentration of at least 20 milligrams per liter of electroplating solution. A gold containing absorber layer is electrodeposited onto the substrate. A high concentration of thallium produces an absorber layer insensitive to the brightener concentration in the electroplating solution and having a stress less than approximately 1.times.10.sup.8 dynes/cm.sup.2. In addition, the absorber has a small grain size, a low surface roughness, and a low defect density. Thus, the absorber layer is easier to inspect and, if required, to repair.
    • 一种制造具有低应力吸收层的X射线掩模的方法。 将基板放置在电镀系统中,并将电镀溶液提供给电镀系统。 电镀溶液具有亚硫酸金属组分和基于铊的组分。 基于铊的组分的浓度为每升电镀溶液至少20毫克。 将含金吸收层电沉积到基底上。 高浓度的铊产生对电镀溶液中的增白剂浓度不敏感并具有小于约1×10 8达因/ cm 2的应力的吸收层。 此外,吸收体具有小的晶粒尺寸,低表面粗糙度和低缺陷密度。 因此,吸收层更容易检查,如果需要,进行修理。