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1. 发明申请

US20180340699A1 AIR CONDITIONER INDOOR UNIT 审中-公开
公开(公告)号：US20180340699A1
公开(公告)日：2018-11-29
申请号：US15777734
申请日：2016-11-17
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Young-Jae KIM , Do Yeon KIM , Je Myung MOON , Hyeong Joon SEO , Bu Youn LEE
IPC分类号： F24F1/00 , F24F13/10 , F24F13/20
摘要： Disclosed is an air conditioner (AC) indoor unit including a housing installed on the ceiling and having an inlet and an outlet provided around the inlet and having a pair of straight sections facing each other and a pair of curved sections facing each other; a heat exchanger provided inside the housing and arranged in a main flow path between the inlet and the outlet; a blower fan configured to suck in air through the inlet, allow the air to exchange heat with the heat exchanger, and discharge the air through the outlet; and an auxiliary flow path guiding an auxiliary air current to change a direction of an air current discharged from the outlet. The direction of the discharged air current may be controlled by sucking in air around the outlet or blowing air to the periphery of the outlet through the auxiliary flow path without a blade.

2. 发明申请

US20170236751A1 METHODS OF FORMING WIRING STRUCTURES FOR SEMICONDUCTOR DEVICES 审中-公开
公开(公告)号：US20170236751A1
公开(公告)日：2017-08-17
申请号：US15296202
申请日：2016-10-18
申请人： Samsung Electronics Co., Ltd.
发明人： Yeong-Shin PARK , Young-Jae KIM
IPC分类号： H01L21/768 , H01L21/311 , H01L23/522
CPC分类号： H01L21/76877 , H01L21/31116 , H01L21/76804 , H01L21/76808 , H01L21/76816 , H01L21/76834 , H01L21/76873 , H01L23/5226
摘要： A method of fabricating a wiring structure for a semiconductor device may include forming a lower wiring in a lower insulating layer, forming an etch stop layer covering the lower insulating layer and the lower wiring, forming an interlayer insulating layer on the etch stop layer, forming a preliminary via-hole through the interlayer insulating layer, partially etching the interlayer insulating layer to form a trench partially merged with the preliminary via-hole and a via-hole defined by a remaining portion of the preliminary via-hole, removing the etch stop layer exposed by the via-hole to expose the lower wiring, partially etching a contact area at which the trench and the via-hole are in contact with each other and forming an upper wiring in the via-hole and the trench to be electrically connected to the lower wiring.

3. 发明申请

US20170069828A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20170069828A1
公开(公告)日：2017-03-09
申请号：US15227953
申请日：2016-08-03
申请人： Samsung Electronics Co., Ltd.
发明人： Baik-Woo LEE , Eun-Seok SONG , Young-Jae KIM , Jae-Gwon JANG
IPC分类号： H01L43/02 , H01L43/08
CPC分类号： H01L23/552 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/00014
摘要： In one embodiment, a semiconductor device comprising, a substrate comprising a wiring layer, a first conductive shielding layer disposed on the substrate and electrically isolated from the wiring layer, the first conductive shielding layer comprising a first bonding surface and a first end surface extending from the first bonding surface, a semiconductor chip disposed on the first conductive shielding layer, a molding member disposed over the first conductive shielding layer to cover the semiconductor chip, a second conductive shielding layer disposed over the first conductive shielding layer and the molding member, the second conductive shielding layer comprising a second bonding surface and a second end surface extending from the second bonding surface, and a bonding portion disposed between the first and second bonding surfaces, the bonding portion comprising a top surface and a bottom surface opposite to the top surface. The bottom surface of the bonding portion contacts the first bonding surface to form a first contact surface. The top surface of the bonding portion contacts the second bonding surface to form a second contact surface. An area of the second contact surface is larger than an area of the second end surface.
摘要翻译：在一个实施例中，一种半导体器件，包括：衬底，其包括布线层，设置在衬底上并与布线层电隔离的第一导电屏蔽层，第一导电屏蔽层包括第一接合表面和第一端面，所述第一接合表面，设置在所述第一导电屏蔽层上的半导体芯片，设置在所述第一导电屏蔽层上以覆盖所述半导体芯片的成型构件，设置在所述第一导电屏蔽层和所述模制构件上方的第二导电屏蔽层，第二导电屏蔽层，包括从第二接合表面延伸的第二接合表面和第二端表面，以及设置在第一和第二接合表面之间的接合部分，接合部分包括顶表面和与顶表面相对的底表面。接合部分的底表面接触第一接合表面以形成第一接触表面。接合部分的顶表面接触第二接合表面以形成第二接触表面。第二接触面的面积大于第二端面的面积。

4. 发明申请

US20160370301A1 PARTICLE SENSING DEVICE AND AIR CONDITIONER INCLUDING THE SAME 审中-公开
标题翻译：颗粒感测装置和包括其的空调器
公开(公告)号：US20160370301A1
公开(公告)日：2016-12-22
申请号：US15185512
申请日：2016-06-17
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Seung Won OH , Kwon Jin KIM , Jin-Gyun KIM , Hyeong Joon SEO , Sun-Hee SON , Woo Seog SONG , Kang Ho CHOI , Nak Hyun KIM , Young-Jae KIM , Ji Hong KIM , Hyun Ah KIM , Se Kwan JEONG
IPC分类号： G01N21/94
CPC分类号： G01N21/85 , G01N15/0205 , G01N2015/0046 , G01N2021/8557
摘要： A particle sensing device and an air conditioner including a sensor has a sensing path through which air passes, a flow path housing which accommodates the sensor and guides air, and a flow path switching device to all air suctioned from the outside is guided to the sensing path, or some of the air suctioned from the outside and moving flows back in an obliquely upward direction and flows into the sensing path.
摘要翻译：颗粒感测装置和包括传感器的空调器具有空气通过的感测路径，容纳传感器并引导空气的流路壳体，并且将从外部吸入的所有空气的流路切换装置引导到感测路径或一部分从外部吸入的空气并且运动在倾斜向上的方向上流回并流入感测路径。

5. 发明申请

US20170108229A1 AIR CONDITIONER AND METHOD FOR CONTROLLING THE SAME 审中-公开
公开(公告)号：US20170108229A1
公开(公告)日：2017-04-20
申请号：US15389663
申请日：2016-12-23
申请人： Samsung Electronics Co., Ltd.
发明人： Woo Seog SONG , Dong Yoon LEE , Bu Youn LEE , Dong Woon KANG , Do Yeon KIM , Do-Hoon KIM , Byung Ghun KIM , Young-Jae KIM , Jun Woo KIM , Hyun Ah KIM , Yong Ho SEO , Hyeong Joon SEO , Byung Yul So , Jae Hyoung SIM , Joon-Ho YOON , Jung Dae LEE , Chang Seon LEE , Chul Ju LEE , Seung Beom LIM , Keun Jeong JANG , Min Gu JEON , Min-Gi CHO , Sung-June CHO , Eun Sung JO , Hyeong Kyu CHO
IPC分类号： F24F1/00 , F24F13/22 , F24F13/08
CPC分类号： F24F1/0007 , F24F1/0011 , F24F1/0022 , F24F1/0033 , F24F11/30 , F24F11/77 , F24F11/79 , F24F11/84 , F24F11/85 , F24F11/89 , F24F13/08 , F24F13/20 , F24F13/22 , F24F13/222 , F24F13/24 , F24F2001/0037 , F24F2001/004 , F24F2001/0048 , F24F2110/10 , F24F2110/12 , F24F2140/20 , F24F2221/28
摘要： An air conditioner (AC) indoor unit includes a housing having an inlet and an outlet; a heat exchanger arranged inside the housing; a blower fan for sucking in air at the inlet to be subject to heat exchange with the heat exchanger, and discharging the heat-exchanged air out of the outlet; and an air flow control device for controlling an air flow discharged from the outlet by sucking in air around the outlet. The AC indoor unit may control the direction of a discharged air flow without a conventional blade structure, thereby increasing an amount of discharged air, reducing circulation noise, and enabling design differentiation.

6. 发明申请

US20170102154A1 AIR CONDITIONER AND METHOD FOR CONTROLLING THE SAME 有权
公开(公告)号：US20170102154A1
公开(公告)日：2017-04-13
申请号：US15389685
申请日：2016-12-23
申请人： Samsung Electronics Co., Ltd.
发明人： Woo Seog SONG , Dong Yoon LEE , Bu Youn LEE , Dong Woon KANG , Do Yeon KIM , Do-Hoon KIM , Byung Ghun KIM , Young-Jae KIM , Jun Woo KIM , Hyun Ah KIM , Yong Ho SEO , Hyeong Joon SEO , Byung Yul SO , Jae Hyoung SIM , Joon-Ho YOON , Jung Dae LEE , Chang Seon LEE , Chul Ju LEE , Seung Beom LIM , Keun Jeong JANG , Min Gu JEON , Min-Gi CHO , Sung-June CHO , Eun Sung JO , Hyeong Kyu CHO
IPC分类号： F24F1/00 , F24F13/22 , F24F13/08 , F24F11/02
CPC分类号： F24F1/0007 , F24F1/0011 , F24F1/0022 , F24F1/0033 , F24F11/30 , F24F11/77 , F24F11/79 , F24F11/84 , F24F11/85 , F24F11/89 , F24F13/08 , F24F13/20 , F24F13/22 , F24F13/222 , F24F13/24 , F24F2001/0037 , F24F2001/004 , F24F2001/0048 , F24F2110/10 , F24F2110/12 , F24F2140/20 , F24F2221/28
摘要： An air conditioner (AC) indoor unit includes a housing having an inlet and an outlet; a heat exchanger arranged inside the housing; a blower fan for sucking in air at the inlet to be subject to heat exchange with the heat exchanger, and discharging the heat-exchanged air out of the outlet; and an air flow control device for controlling an air flow discharged from the outlet by sucking in air around the outlet. The AC indoor unit may control the direction of a discharged air flow without a conventional blade structure, thereby increasing an amount of discharged air, reducing circulation noise, and enabling design differentiation.

7. 发明申请

US20210254846A1 AIR CONDITIONER AND METHOD OF CONTROLLING THE SAME 有权
公开(公告)号：US20210254846A1
公开(公告)日：2021-08-19
申请号：US17307522
申请日：2021-05-04
申请人： Samsung Electronics Co., Ltd.
发明人： Young-Jin KIM , Ju-Hyun KANG , Young-Jae KIM , Byung Yul SO , Yong-Gak KIM , In-Jung BAEK , Na Yeong BYEON , Moo Gyo SEO , Hyeong Joon SEO , Seung Cheon YU , Sang Woo LEE , Hyo Kyu LEE , Jin Ho LIM , Min-Gi CHO , Hyeong Kyu CHO , Jun HWANG , Do Yeon KIM , Hyun Ah KIM , Yong Ho SEO , Woo Seog SONG , Hyun-Joo SONG , Young Sun SHIN , Joon-Ho YOON , Bu Youn LEE , Jung Dae LEE , Chang Seon LEE , Min Gu JEON , Hee Jae JEONG
IPC分类号： F24F11/30 , F24F1/0047 , F24F1/0057 , F24F11/79 , F24F11/77 , F24F1/0011 , F24F1/0022 , F24F1/0033 , F24F13/24 , F24F13/28
摘要： An air conditioner includes a housing having a suction port and a discharge port, a main fan configured to draw air into the housing through the suction port and discharge air from the housing through the discharge port, an auxiliary fan configured to draw, into the housing, air discharged by the main fan and a controller configured to control a rotational speed of the auxiliary fan to change a direction in which air is discharged from the housing.

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