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    • 1. 发明申请
    • ELECTRONIC DEVICE INCLUDING CAPACITIVE STRUCTURE
    • WO2019240365A1
    • 2019-12-19
    • PCT/KR2019/004463
    • 2019-04-12
    • SAMSUNG ELECTRONICS CO., LTD.
    • KIM, MinsooJUNG, HyuntaeLEE, Jiwoo
    • H04M1/02H04B1/40H01Q1/24
    • According to an embodiment of the disclosure relate to an electronic device including a capacitive structure. The electronic device may include: a housing including a first plate, a second plate facing a direction opposite the first plate, and a side member comprising a side wall surrounding a space between the first plate and the second plate, the side member including a conductive portion; a conductive mid-plate disposed in the housing parallel to the second plate; a dielectric gap formed between the conductive portion and the conductive mid-plate; a printed circuit board (PCB) disposed inside the housing between the conductive mid-plate and the second plate, the PCB including a ground plane; and a capacitive structure comprising a conductive material disposed at a boundary portion of the dielectric gap and the conductive mid-plate between the conductive mid-plate and the PCB, the capacitive structure including a first conductive layer connected to the conductive mid-plate, a second conductive layer spaced apart from the first conductive layer and electrically connected to the ground plane, and a dielectric layer interposed between the first conductive layer and the second conductive layer.