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    • 4. 发明申请
    • MULTILAYER PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
    • WO2018110897A3
    • 2018-06-21
    • PCT/KR2017/014289
    • 2017-12-07
    • SAMSUNG ELECTRONICS CO., LTD.
    • HEO, JinsuKO, SeungtaeLIM, Sangho
    • H05K1/11H05K1/02H01Q1/38
    • The present disclosure relates to a communication method and system for converging a 5 th -Generation (5G) communication system for supporting higher data rates beyond a 4 th -Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A multilayer printed circuit board (PCB) including a plurality of substrate layers formed in stack is provided. The multilayer printed circuit board includes a first substrate layer located on an outer side of the plurality of substrate layers, and a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer. The multilayer printed circuit board further includes a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.
    • 5. 发明申请
    • MULTILAYER PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
    • WO2018110897A2
    • 2018-06-21
    • PCT/KR2017/014289
    • 2017-12-07
    • SAMSUNG ELECTRONICS CO., LTD.
    • HEO, JinsuKO, SeungtaeLIM, Sangho
    • The present disclosure relates to a communication method and system for converging a 5 th -Generation (5G) communication system for supporting higher data rates beyond a 4 th -Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A multilayer printed circuit board (PCB) including a plurality of substrate layers formed in stack is provided. The multilayer printed circuit board includes a first substrate layer located on an outer side of the plurality of substrate layers, and a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer. The multilayer printed circuit board further includes a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.