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1. 发明公开

US20240315009A1 SEMICONDUCTOR MEMORY DEVICE 审中-公开
公开(公告)号：US20240315009A1
公开(公告)日：2024-09-19
申请号：US18386916
申请日：2023-11-03
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jihoon KIM , Dohyung KIM , Youngjun KIM , Taekjung KIM , Yeonju OH , Jaejin LEE , Dongju CHANG , Seohyeong JANG
IPC分类号： H10B12/00
CPC分类号： H10B12/34 , H10B12/053 , H10B12/315
摘要： A semiconductor memory device is provided. The semiconductor memory device includes: an active pattern provided on a substrate and enclosed by a device isolation pattern; and a word line crossing the active pattern and the device isolation pattern in a first direction parallel to a bottom surface of the substrate, and including a first gate electrode and a second gate electrode, which are adjacent to each other in the first direction. A second work function of the second gate electrode is greater than a first work function of the first gate electrode.

2. 发明申请

US20220159827A1 MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME 有权
公开(公告)号：US20220159827A1
公开(公告)日：2022-05-19
申请号：US17337850
申请日：2021-06-03
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Wonseop LEE , Hwanwook PARK , Jeonghoon BAEK , Dohyung KIM , Seunghee MUN , Dongyoon SEO , Jinoh AHN
IPC分类号： H05K1/02 , H01L25/11 , H01L25/065 , G11C5/04 , G11C5/06 , G11C8/18 , G06F13/40
摘要： A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.

3. 发明申请

US20150208447A1 COMPOSITE ARS SERVICE PROVIDING METHOD AND APPARATUS 有权
标题翻译：复合材料服务提供方法和装置
公开(公告)号：US20150208447A1
公开(公告)日：2015-07-23
申请号：US14601923
申请日：2015-01-21
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Dohyung KIM , Young-Ky KIM , Jae-Duck LEE , Ki-Ho CHO
IPC分类号： H04W76/02
CPC分类号： H04L65/1016 , H04L65/104 , H04W76/12
摘要： Methods and apparatuses are provided for operating a server apparatus for providing a composite Automatic Response System (ARS) service through a mobile communication network. An ARS scenario and composite ARS related information are received from a first terminal. The composite ARS related information includes video ARS related information and voice ARS related information based on the ARS scenario. The ARS scenario and the composite ARS related information are stored. A call establishment request message directed to the first terminal, is received from the second terminal. The composite ARS related information is provided to the second terminal in response to the received call establishment request message. A call is established between the first terminal and the second terminal in response to an input for a call connection request, directed to the first terminal, received while the composite ARS related information is provided to the second terminal.
摘要翻译：提供了用于操作服务器装置的方法和装置，用于通过移动通信网络提供复合自动响应系统（ARS）服务。从第一终端接收ARS场景和复合ARS相关信息。复合ARS相关信息包括基于ARS场景的视频ARS相关信息和语音ARS相关信息。存储ARS场景和复合ARS相关信息。从第二终端接收到指向第一终端的呼叫建立请求消息。响应于所接收的呼叫建立请求消息，将复合ARS相关信息提供给第二终端。响应于在将复合ARS相关信息提供给第二终端时接收到的针对第一终端的呼叫连接请求的输入，在第一终端和第二终端之间建立呼叫。

4. 发明申请

US20150078055A1 MEMORY MODULE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：存储器模块及其制造方法
公开(公告)号：US20150078055A1
公开(公告)日：2015-03-19
申请号：US14325867
申请日：2014-07-08
申请人： Samsung Electronics Co., Ltd.
发明人： Jong-Hyun SEOK , Dohyung KIM , Kwangseop KIM , Young-Ho LEE
IPC分类号： G11C11/401
CPC分类号： G11C11/401 , G11C5/025 , G11C5/04
摘要： A memory module includes a printed circuit board; first memory chips disposed in parallel with a long axis of the printed circuit board along a first column; second memory chips disposed in parallel with the long axis of the printed circuit board along a second column; and passive elements disposed between the first memory chips and the second memory chips, wherein the passive elements are connected between input/output pins of each of the first and second memory chips and tap pins.
摘要翻译：存储模块包括印刷电路板; 第一存储器芯片，沿着第一列与印刷电路板的长轴平行设置; 第二存储器芯片沿着第二列与印刷电路板的长轴平行布置; 以及设置在所述第一存储器芯片和所述第二存储器芯片之间的无源元件，其中所述无源元件连接在所述第一存储器芯片和所述第二存储器芯片中的每一个的输入/输出引脚之间。

5. 发明公开

US20230349611A1 REFRIGERATOR AND CONTROLLING METHOD THEREOF 审中-公开
公开(公告)号：US20230349611A1
公开(公告)日：2023-11-02
申请号：US18220579
申请日：2023-07-11
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Dohyung KIM , Yanggyu KIM , Kookjeong SEO , Jaeho SONG , Sangbeom AHN , Kuneui HONG
IPC分类号： F25B49/02 , F25B41/20
CPC分类号： F25B49/022 , F25B41/20 , F25B2600/2511 , F25B2700/21
摘要： A refrigerator includes: a storage chamber configured to be maintained at a temperature above zero degrees Celsius; an evaporator disposed in a duct that is fluidly connected to the storage chamber; a compressor; a valve disposed in a flow path which connects the compressor to the evaporator; a first fan configured to drive air that is cooled by the evaporator to the storage chamber; and a controller. The controller is configured to: control at least one of the compressor or the valve to supply a refrigerant to the evaporator based on the temperature of the storage chamber, and delay operation of the first fan for a preset first reference period of time after the at least one of the compressor or the valve began supplying the refrigerant to the evaporator.

6. 发明申请

US20230013064A1 MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME 有权
公开(公告)号：US20230013064A1
公开(公告)日：2023-01-19
申请号：US17947397
申请日：2022-09-19
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Wonseop LEE , Hwanwook PARK , Jeonghoon BAEK , Dohyung KIM , Seunghee MUN , Dongyoon SEO , Jinoh AHN
IPC分类号： H05K1/02 , H01L25/11 , H01L25/065 , G11C5/06 , G11C8/18 , G06F13/40 , G11C5/04
摘要： A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.

7. 发明申请

US20220159832A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME 有权
公开(公告)号：US20220159832A1
公开(公告)日：2022-05-19
申请号：US17360417
申请日：2021-06-28
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Dongyoon SEO , Geunje PARK , Dohyung KIM , Hwanwook PARK , Dongmin JANG , Jaeseok JANG
IPC分类号： H05K1/11 , H05K1/18
摘要： A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.

8. 发明申请

US20210247112A1 REFRIGERATOR 有权
公开(公告)号：US20210247112A1
公开(公告)日：2021-08-12
申请号：US17172399
申请日：2021-02-10
申请人： Samsung Electronics Co., Ltd.
发明人： Jeongmin JEON , Dohyung KIM , Kookjeong SEO , Kyunghoon CHOI , Heeyuel ROH , Insub LEE
IPC分类号： F25B39/02 , F25D17/06 , F28F3/02
摘要： Disclosed herein is a refrigerator. The refrigerator includes a cabinet, a first storage compartment formed in the cabinet, a second storage compartment formed in the cabinet to be separated from the first storage compartment, a cooling chamber including an evaporator configured to generate cold air, the cooling chamber connected to the first storage compartment to allow the cold air to be supplied to the first storage compartment, a cold air duct connected to the evaporator to receive the cold air, and a cooling plate configured to exchange heat with cold air in the cold air duct and provided to form one surface of the second storage compartment.

9. 发明申请

US20210219408A1 LASER BEAM DELIVERY APPARATUS FOR EXTREME ULTRA VIOLET LIGHT SOURCE 有权
公开(公告)号：US20210219408A1
公开(公告)日：2021-07-15
申请号：US16927050
申请日：2020-07-13
申请人： Samsung Electronics Co., Ltd.
发明人： Dohyung KIM , Seongchul HONG , Kyungsik KANG , Insung KIM , Motoshi SAKAI , Seulgi LEE , Jungchul LEE
IPC分类号： H05G2/00 , H01S3/23 , G02B19/00 , H01S3/00 , G02B26/08
摘要： A laser beam delivery apparatus of an extreme ultra violet light source may include a high power seed module configured to generate a laser beam, a power amplifier configured to amplify the laser beam generated by the high power seed module, a beam transfer module configured to collect and move the laser beam amplified by the power amplifier, a final focusing assembly optical platform configured to adjust focus of the laser beam collected and moved by the beam transfer module, and a focusing unit configured to focus the laser beam with the focus adjusted by the final focusing assembly optical platform to a target droplet. The power amplifier may include a position adjuster configured to adjust a position of the laser beam. The position adjuster may include a refraction plate having a flat surface. The power amplifier may include a pointing adjuster, which may include a mirror.

10. 发明申请

US20150041747A1 PHASE CHANGE MATERIAL LAYERS 有权
标题翻译：相变材料层
公开(公告)号：US20150041747A1
公开(公告)日：2015-02-12
申请号：US14259594
申请日：2014-04-23
申请人： Samsung Electronics Co., Ltd.
发明人： Dohyung KIM
IPC分类号： H01L45/00
CPC分类号： H01L45/144 , H01L27/2409 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/124 , H01L45/1246 , H01L45/126 , H01L45/1616 , H01L45/1683
摘要： A phase change material layer includes germanium (Ge), antimony (Sb), tellurium (Te) and at least one impurity elements. An atomic concentration of impurity elements ranges from about 0
摘要翻译：相变材料层包括锗（Ge），锑（Sb），碲（Te）和至少一种杂质元素。杂质元素的原子浓度范围为约0

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