专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007203733A Piezoelectric inkjet printing head 审中-公开
标题翻译：压电喷墨头
公开(公告)号：JP2007203733A
公开(公告)日：2007-08-16
申请号：JP2006347857
申请日：2006-12-25
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： LIM SEUNG-MO , LEE TAE KYOUNG , MOON CHANG-YOUL , TEI ZAIYU , LEE HWA SUN
IPC分类号： B41J2/055 , B41J2/045
CPC分类号： B41J2/14233 , B41J2/055
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric inkjet printing head.
SOLUTION: This piezoelectric inkjet printing head 300 comprises a manifold, a chamber array which has a plurality of chambers arranged on at least one side of the manifold so as to connect with the manifold, a diaphragm 320 covering the chambers, and a plurality of piezoelectric actuators 380 which are formed on the diaphragm 320 and change the pressure of each of the chambers by oscillating the diaphragm 320. The chambers are such as a plurality of pressure chambers 361 which are arranged in the intermediate region of the chamber array and have each an ink discharging nozzle 371 which discharges ink, and dummy chambers 362 which are arranged, at least each at an edge part on both sides of the chamber array and have each a dummy nozzle 372 not discharging the ink. In addition, the diaphragm 320 has a plurality of trenches 390 formed in the way that the trenches 390 are positioned between the piezoelectric actuators 380.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种压电喷墨打印头。解决方案：该压电喷墨打印头300包括歧管，腔室阵列，其具有布置在歧管的至少一侧上的多个腔室，以便与歧管连接，覆盖腔室的隔膜320和多个压电致动器380，其形成在隔膜320上并且通过振动隔膜320来改变每个室的压力。这些室是诸如多个压力室361，其布置在室阵列的中间区域中，每个具有排出墨的喷墨嘴371和至少分别设置在腔阵列两侧的边缘部分处的虚拟室362，并且具有不排出墨的虚拟喷嘴372。此外，隔膜320具有多个沟槽390，其形成为沟槽390位于压电致动器380之间的方式。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007049152A Led package and its manufacturing method 审中-公开
标题翻译： LED封装及其制造方法
公开(公告)号：JP2007049152A
公开(公告)日：2007-02-22
申请号：JP2006214874
申请日：2006-08-07
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： KWON KI-HWAN , SHIN KYU-HO , KEN JUNCHORU , MOON CHANG-YOUL , DARBINIAN ARTHUR , CHOI SEUNG-TAE , SHIN SU-HO
IPC分类号： H01L33/44 , H01L33/56 , H01L33/58 , H01L33/62 , H01L33/64
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an LED package that is suited for a high-power LED package with excellent heat radiating performance and an improved structure to have a simple constitution, and to provide its manufacturing method. SOLUTION: An LED package comprises an upper metal plate through which an LED accommodating hole accommodating an LED is formed, a lower metal plate that is connected with the lower part of the upper metal plate, an insulator insulating the part at which the upper and lower metal plates are joined with each other; an LED mounted on the lower metal plate exposed to the LED accommodating hole and electrically connected with the upper and lower metal plates, and a protection cover for surrounding a predetermined part exposed outside the upper and lower metal plates to protect them. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种适用于具有优异的散热性能和改进的结构的大功率LED封装的LED封装以具有简单的结构，并提供其制造方法。解决方案：LED封装包括上金属板，通过该上金属板形成容纳LED的LED容纳孔，与金属板的下部连接的下金属板，绝缘部分的绝缘体，上下金属板彼此接合; 安装在暴露于LED容纳孔并与上金属板和下金属板电连接的下金属板上的LED以及用于围绕露出在上金属板和下金属板外部的预定部分的保护盖以保护它们。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007038648A Image drum and its manufacturing method 审中-公开
标题翻译：图像鼓及其制造方法
公开(公告)号：JP2007038648A
公开(公告)日：2007-02-15
申请号：JP2006170900
申请日：2006-06-21
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： SHIN KYU-HO , CHOI WON-KYOUNG , KIM JONG-KWANG , BACK KAE-DONG , MOON CHANG-YOUL
IPC分类号： B41J2/395 , G03G15/05
CPC分类号： B41J2/395 , G03G15/348 , G03G2217/0075
摘要： PROBLEM TO BE SOLVED: To disclose an image drum and its manufacturing method which can reduce manufacturing cost by simplifying processes.
SOLUTION: The image drum comprises a drum body composed of a pair of half cylindrical members coupled by facing each other and a control unit for line electrode control of the drum body. The outer peripheral surface of the drum body has a large number of line electrodes which are insulated from the drum body and also insulated from adjacent electrodes. Both side peripheral portions of the control unit are electrically connected to the line electrodes by soldering or the like as they remain sandwiched by the coupling surfaces of the half cylindrical members. The coupling surfaces of the half cylindrical members have a large number of electrodes. The control unit incorporates conductor portions corresponding to the electrodes and insulator portions positioned between the conductor portion. The conductor portions and the insulator portions are formed by partially oxidizing an aluminum substrate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：公开可以通过简化处理来降低制造成本的图像鼓及其制造方法。解决方案：图像鼓包括由主体相互耦合的一对半圆柱形构件和用于滚筒体的线电极控制的控制单元组成的鼓体。鼓体的外周面具有大量与鼓体绝缘的线电极，并且与相邻的电极绝缘。控制单元的两个侧边缘部分通过焊接等与线电极电连接，因为它们保持夹在半圆柱形构件的联接表面之间。半圆柱形构件的联接表面具有大量的电极。控制单元包括对应于电极的导体部分和位于导体部分之间的绝缘体部分。导体部分和绝缘体部分通过部分氧化铝基底而形成。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2009075129A Flexible pressure sensor and method for manufacturing the same 有权
标题翻译：柔性压力传感器及其制造方法
公开(公告)号：JP2009075129A
公开(公告)日：2009-04-09
申请号：JP2008323994
申请日：2008-12-19
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： SHIN KYU-HO , MOON CHANG-YOUL , KIN YOJUN
IPC分类号： G01L1/14
CPC分类号： H01L23/5389 , G01L19/146 , H01L23/5387 , H01L24/24 , H01L2224/24051 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H05K1/185 , H05K1/189 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a flexible pressure sensor and a method for manufacturing the same. SOLUTION: A flexible pressure sensor according to the present invention is made of flexible material, and as such, has flexibility. The flexible pressure sensor includes: a flexible substrate that forms a circular shape, when it is bent; a first electrode formed on one surface of the flexible substrate; a second electrode, formed on the one surface of the flexible substrate, which faces the first electrode when the flexible substrate that forms the circular shape and which thus forms a condenser, together with the first electrode; and a coil, formed on the other surface of the flexible substrate and electrically connected to the condenser to form a resonant circuit, which outputs a signal that is indicative of a resonant frequency of the resonance circuit that varies, in conjunction with the change in the interval between the first electrode and the second electrode. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性压力传感器及其制造方法。解决方案：根据本发明的柔性压力传感器由柔性材料制成，因此具有柔性。柔性压力传感器包括：弯曲时形成圆形的柔性基板; 形成在柔性基板的一个表面上的第一电极; 形成在所述柔性基板的一个表面上的第二电极，所述第二电极在与所述第一电极一起形成所述圆形形状并因此形成冷凝器的所述柔性基板时面向所述第一电极; 以及线圈，其形成在柔性基板的另一表面上并电连接到电容器以形成谐振电路，该谐振电路输出表示谐振电路的谐振频率变化的信号，该谐振电路的谐振频率随着第一电极和第二电极之间的间隔。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2008290454A Image forming element and manufacturing method of the same 有权
标题翻译：图像形成元件及其制造方法
公开(公告)号：JP2008290454A
公开(公告)日：2008-12-04
申请号：JP2008132249
申请日：2008-05-20
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： KIM WOON-BAE , KWON JONG-OH , CHOI SEUNG-TAE , MOON CHANG-YOUL , KWEON SOON CHEOL , KWON KI-HWAN
IPC分类号： B41J2/385 , G03G21/00
CPC分类号： G03G5/105 , G03G5/0205 , G03G15/05 , G03G15/348 , G03G2217/0075
摘要： PROBLEM TO BE SOLVED: To provide an image forming element which is highly precise and inexpensive and can be miniaturized in a simple structure. SOLUTION: The image forming element includes a drum body, a driving circuit located in the inner surface of the drum body, a support plate which has the driving circuit and is formed so as to penetrate through the inside of the drum body in the axial direction of the drum body, an insulating layer formed on a portion or the whole of the outer surface of the drum body, a conductive/insulative polymer layer formed on the insulating layer, the conductive polymer layer including one or more conductive areas and one or more insulating areas, which are aligned in an alternating pattern, and a protective layer formed on the conductive/insulative polymer layer, wherein the conductive areas on the conductive/insulative polymer layer are electrically connected to the driving circuit. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种高精度和廉价并且可以以简单的结构小型化的图像形成元件。解决方案：图像形成元件包括鼓体，位于鼓体内表面的驱动电路，具有驱动电路并形成为穿过鼓体内部的支撑板滚筒主体的轴向方向，形成在滚筒主体的外表面的一部分或整体上的绝缘层，形成在绝缘层上的导电/绝缘聚合物层，导电聚合物层包括一个或多个导电区域和以交替图案对准的一个或多个绝缘区域和形成在导电/绝缘聚合物层上的保护层，其中导电/绝缘聚合物层上的导电区域电连接到驱动电路。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2006128683A Manufacturing method for packaging substrate, and packaging method using the same 有权
标题翻译：用于包装基板的制造方法和使用该基板的包装方法
公开(公告)号：JP2006128683A
公开(公告)日：2006-05-18
申请号：JP2005310885
申请日：2005-10-26
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： LEE MOON-CHUL , KIM WOON-BAE , HWANG JUN-SIK , MOON CHANG-YOUL
IPC分类号： H01L23/04
CPC分类号： B81C1/00301 , Y10T29/49117
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a packaging substrate in simplified processes, and to provide a packaging method that uses the same. SOLUTION: The manufacturing method for a packaging substrate includes the processes of etching a specified region on the bottom surface of a substrate 110 to make a depressed part 140, laminating a seed layer on the top surface of the substrate 110, etching the specified region of the bottom surface of the substrate 110s within the depressed part 140 to make at least one via-hole joined to the seed layer, and plating the inside of the via hole by using the seed layer to make an electrode 180 for connecting the top and bottom part of the substrate. Preferably, it can further include a step of manufacturing first and second pads 135 and 190, that are connected to the electrode 180 on the top and bottom surface of the substrate. This will enable the second pad to be used as a bonding substance for packaging. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种简化方法制造包装衬底的方法，并提供使用该方法的包装方法。解决方案：包装衬底的制造方法包括蚀刻衬底110的底表面上的特定区域以制备凹陷部140，在衬底110的顶表面上层压晶种层的工艺，蚀刻在凹部140内的基板110s的下表面的指定区域，形成与种子层接合的至少一个通路孔，并且通过使用晶种层对通孔内部进行电镀，以形成电极180，衬底的顶部和底部。优选地，其还可以包括制造第一和第二焊盘135和190的步骤，其连接到衬底的顶表面和底表面上的电极180。这将使得第二垫可用作包装的粘结物质。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005345473A Gyro-sensor comprising a plurality of component units and fabricating method thereof 审中-公开
标题翻译：包含多个组件单元的GYRO传感器及其制造方法
公开(公告)号：JP2005345473A
公开(公告)日：2005-12-15
申请号：JP2005161353
申请日：2005-06-01
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： PARK TAE-SIK , LEE MOON-CHUL , MOON CHANG-YOUL
IPC分类号： G01C19/56 , B81B3/00 , B81B7/00 , B81C3/00 , G01C19/00 , G01C19/5769 , G01P9/04
CPC分类号： B81C1/0023 , B81B2207/07 , G01C19/56 , H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a small gyro-sensor comprising at least one circuit unit with a whole size reduced to about the size of the circuit unit. SOLUTION: The gyro-sensor comprising a plurality of component units is disclosed. The gyro-sensor includes a substrate; a MEMS (micro electro mechanical system) structure including a surface including a predetermined area in which a cavity is formed and connected to an upper surface of the substrate to output a vibration signal proportional to an external rotation force; and a circuit unit positioned in the cavity, converting the vibration signal into a predetermined electric signal proportional to a circular angular velocity, and outputting the predetermined electric signal. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种小型陀螺仪传感器，其包括至少一个整体尺寸减小到大约电路单元尺寸的电路单元。解决方案：公开了包括多个部件单元的陀螺仪传感器。陀螺传感器包括基板; MEMS（微电子机械系统）结构，其包括包括形成空腔的预定区域的表面并连接到所述基板的上表面以输出与外部旋转力成比例的振动信号; 以及位于所述空腔中的电路单元，将所述振动信号转换为与圆形角速度成比例的预定电信号，并输出所述预定电信号。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2013098556A Electrode structure, gallium nitride-based semiconductor element provided with the same, and method for manufacturing them 审中-公开
标题翻译：电极结构，基于氮化镓的半导体元件及其制造方法
公开(公告)号：JP2013098556A
公开(公告)日：2013-05-20
申请号：JP2012235473
申请日：2012-10-25
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： LEE JEONG-YUB , XIANYU WENXU , MOON CHANG-YOUL , PARK YONG YONG , YANG WU-YEONG , WHANG IN-JUN
IPC分类号： H01L21/338 , H01L21/28 , H01L21/336 , H01L29/417 , H01L29/778 , H01L29/78 , H01L29/812
CPC分类号： H01L21/28264 , H01L29/0843 , H01L29/2003 , H01L29/42364 , H01L29/49 , H01L29/66462 , H01L29/7787
摘要： PROBLEM TO BE SOLVED: To provide an electrode structure, a gallium nitride-based semiconductor element provided with the same, and a method for manufacturing them.SOLUTION: The gallium nitride-based semiconductor element includes a GaN-based semiconductor layer GL10, and electrode structures 500A and 500B provided on the GaN-based semiconductor layer. The electrode structures 500A and 500B include electrode elements 50A and 50B containing conductive substances, and diffusion layers 5A and 5B provided between the electrode elements 50A and 50B and a GaN-based semiconductor layer 200. The diffusion layers 5A and 5B contain an n-type dopant, the n-type dopant contains a group-IV element, and a region of the GaN-based semiconductor layer 200 in contact with the diffusion layers is doped with the n-type dopant (for instance, group-IV element).
摘要翻译：要解决的问题：为了提供电极结构，设置有电极结构的氮化镓基半导体元件及其制造方法。解决方案：氮化镓基半导体元件包括GaN基半导体层GL10和设置在GaN基半导体层上的电极结构500A和500B。电极结构500A和500B包括含有导电物质的电极元件50A和50B以及设置在电极元件50A和50B与GaN基半导体层200之间的扩散层5A和5B。扩散层5A和5B包含n型 n型掺杂剂包含IV族元素，并且与扩散层接触的GaN基半导体层200的区域掺杂有n型掺杂剂（例如IV族元素）。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2011054978A SOLDERED STRUCTURE USING Zn AND METHOD THEREOF 审中-公开
标题翻译：使用Zn的焊接结构及其方法
公开(公告)号：JP2011054978A
公开(公告)日：2011-03-17
申请号：JP2010228990
申请日：2010-10-08
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： CHOI WON-KYOUNG , MOON CHANG-YOUL , SON YOON-CHUL , KIM YOUNG-HO , ROH HEE-RA , OH CHANG-YUL
IPC分类号： H05K3/24 , B23K1/20 , B23K101/42 , H05K1/09 , H05K3/34
CPC分类号： B23K1/0016 , B23K35/262 , B23K35/282 , B23K2201/42 , H01L24/11 , H01L2224/05001 , H01L2224/0501 , H01L2224/05011 , H01L2224/05023 , H01L2224/05111 , H01L2224/05118 , H01L2224/05139 , H01L2224/05147 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/05611 , H01L2224/05639 , H01L2224/05647 , H01L2224/1134 , H05K3/244 , H05K3/3463 , Y10T428/12493 , H01L2924/00014 , H01L2924/0103 , H01L2924/01029 , H01L2924/01028 , H01L2924/01047
摘要： PROBLEM TO BE SOLVED: To provide a soldered structure in which structure characteristics are improved by intervening in interfacial reaction in the case of soldering high reactive Zn.
SOLUTION: The soldered structure includes a coupling layer containing Zn and Pb-free solder that coupling-reacts with the coupling layer. Then, the coupling layer has a multiple layer structure in which at least one material layer formed by a predetermined material and a Zn layer are sequentially laminated; and the Zn layer is located at the uppermost position on the Pb-free solder side of the multiple layer.
COPYRIGHT: (C)2011,JPO&INPIT

10. 发明专利

JP2008260265A Image forming object, manufacturing method of the same, and image forming device 审中-公开
标题翻译：图像形成对象，其制造方法和图像形成装置
公开(公告)号：JP2008260265A
公开(公告)日：2008-10-30
申请号：JP2007326268
申请日：2007-12-18
申请人： Samsung Electro Mech Co Ltd , Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd. , 三星電機株式会社
发明人： SHIN SU-HO , MOON CHANG-YOUL , KWON KI-HWAN , KIM YU-MAN , JUNG KYU-DONG
IPC分类号： B41J2/415 , G03G15/05
CPC分类号： G03G15/348 , G03G2217/0075
摘要： PROBLEM TO BE SOLVED: To reduce manufacturing cost by simplifying the structure and the manufacturing steps of an image forming object. SOLUTION: The image forming object includes a drum body 100 formed by alternately laminating a large number of conductive layers 110 and insulating layers 120 and in which one parts of the conductive layer 110 are extended to a cavity 101 arranged inside to form a large number of electrodes and a control unit 200 arranged in the cavity 101 and having a large number of electrode pads electrically connected corresponding to the electrodes. COPYRIGHT: (C)2009,JPO&INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式