专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20160318149A1 SUBSTRATE POLISHING APPARATUS 有权
标题翻译：基板抛光装置
公开(公告)号：US20160318149A1
公开(公告)日：2016-11-03
申请号：US15138630
申请日：2016-04-26
申请人： Samsung Display Co., Ltd.
发明人： Joowoan CHO , Hyunjin CHO , Byoungkwon CHOO , Oleg PRUDNIKOV , Jeongkyun NA , Sanghoon AHN , Seunghwan LEE , Byoungho CHEONG
IPC分类号： B24B37/20
CPC分类号： B24B37/20 , B24B27/0015 , B24B27/0076 , B24B37/10
摘要： A substrate polishing apparatus includes a support part on which at least one substrate is disposed, a plurality of first moving parts disposed at both opposite sides of the support part in a second direction crossing a first direction, and configured to upwardly extend and reciprocate in the first direction, a second moving part disposed between the plurality of first moving parts in the second direction and connected to an upper side of the first moving parts, a plurality of polishing units disposed at a lower portion of the second moving part and configured to contact an upper surface of the substrate, and a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate where the polishing units rotate and revolve along a predetermined trajectory.
摘要翻译：衬底抛光装置包括：至少一个衬底设置在该支撑部分上的多个第一移动部件，沿与第一方向交叉的第二方向设置在支撑部件的相对侧的多个第一移动部件，并且构造成向上延伸和往复运动第一方向，第二移动部分，设置在第二方向上的多个第一移动部分之间并连接到第一移动部分的上侧;多个抛光单元，设置在第二移动部分的下部并且被配置为接触基板的上表面和设置在第二移动部分的下部的多个喷嘴，并且被配置为将抛光单元沿预定轨迹旋转和旋转的浆料喷射到基板。

IPRDB

热门服务

关于我们

友情链接

联系方式