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    • 4. 发明申请
    • Dynamic impedance compensation circuit and method
    • 动态阻抗补偿电路及方法
    • US20060097749A1
    • 2006-05-11
    • US10982485
    • 2004-11-05
    • Sagheer AhmadLin ChenSam HuynhShu-Shia ChowJoe Macri
    • Sagheer AhmadLin ChenSam HuynhShu-Shia ChowJoe Macri
    • H03K17/16
    • H03K19/0005
    • An impedance compensation circuit generates per-group pull-up impedance information and per-group pull-down impedance information to calibrate a plurality of input/output pads and dynamically updates impedance information on a per channel basis. A group refers to a group of I/O pads having similar output drive strengths in a channel. A channel refers to all I/O pads, which collectively provide a bus interface to an external device. For example, all the I/O pads interfacing with a memory module may be grouped into a channel, and address I/O pads in a channel may be arranged into a “group.” Memory I/O pads may be grouped together into a channel since memory interface pads have input/output characteristics that may be different from those of other types of I/O pads in the chip. According to one embodiment, per-group programmable offset information provides calibration information that may be different for each group in each channel.
    • 阻抗补偿电路产生每组上拉阻抗信息和每组下拉阻抗信息以校准多个输入/输出焊盘,并基于每个通道动态地更新阻抗信息。 组是指在通道中具有相似输出驱动强度的一组I / O焊盘。 一个通道是指所有的I / O焊盘,它们共同地为外部设备提供总线接口。 例如,与存储器模块接口的所有I / O焊盘可以分组成通道,并且通道中的地址I / O焊盘可以被布置成“组”。 存储器I / O焊盘可以被组合在一起成为通道,因为存储器接口焊盘具有与芯片中的其它类型的I / O焊盘的输入/输出特性不同的输入/输出特性。 根据一个实施例,每组可编程偏移信息提供对于每个通道中的每个组可以不同的校准信息。
    • 5. 发明授权
    • Dynamic impedance compensation circuit and method
    • 动态阻抗补偿电路及方法
    • US07227376B2
    • 2007-06-05
    • US10982485
    • 2004-11-05
    • Sagheer AhmadLin ChenSam HuynhShu-Shia ChowJoe Macri
    • Sagheer AhmadLin ChenSam HuynhShu-Shia ChowJoe Macri
    • H03K17/16H03K19/003
    • H03K19/0005
    • An impedance compensation circuit generates per-group pull-up impedance information and per-group pull-down impedance information to calibrate a plurality of input/output pads and dynamically updates impedance information on a per channel basis. A group refers to a group of I/O pads having similar output drive strengths in a channel. A channel refers to all I/O pads, which collectively provide a bus interface to an external device. For example, all the I/O pads interfacing with a memory module may be grouped into a channel, and address I/O pads in a channel may be arranged into a “group.” Memory I/O pads may be grouped together into a channel since memory interface pads have input/output characteristics that may be different from those of other types of I/O pads in the chip. According to one embodiment, per-group programmable offset information provides calibration information that may be different for each group in each channel.
    • 阻抗补偿电路产生每组上拉阻抗信息和每组下拉阻抗信息以校准多个输入/输出焊盘,并基于每个通道动态地更新阻抗信息。 组是指在通道中具有相似输出驱动强度的一组I / O焊盘。 一个通道是指所有的I / O焊盘,它们共同地为外部设备提供总线接口。 例如,与存储器模块接口的所有I / O焊盘可以分组成通道,并且通道中的地址I / O焊盘可以被布置成“组”。 存储器I / O焊盘可以被组合在一起成为通道,因为存储器接口焊盘具有与芯片中的其它类型的I / O焊盘的输入/输出特性不同的输入/输出特性。 根据一个实施例,每组可编程偏移信息提供对于每个通道中的每个组可以不同的校准信息。