会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 10. 发明授权
    • Method and apparatus for detecting defects
    • 检测缺陷的方法和装置
    • US07528942B2
    • 2009-05-05
    • US11472426
    • 2006-06-22
    • Hiroyuki NakanoToshihiko NakataSachio UtoAkira HamamatsuShunji MaedaYuta Urano
    • Hiroyuki NakanoToshihiko NakataSachio UtoAkira HamamatsuShunji MaedaYuta Urano
    • G01N21/88
    • G01N21/956G01N21/47G01N21/94G01N21/9501G01N2021/8822
    • A method and apparatus for detecting defects are provided for detecting harmful defects or foreign matter with high sensitivity on an object to be inspected with a transparent film, such as an oxide film, by reducing noise due to a circuit pattern. The apparatus for detecting defects includes a stage part on which a substrate specimen is put and which is arbitrarily movable in each of the X-Y-Z-θ directions, an illumination system for irradiating the circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. Furthermore, a spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector from the specimen is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip. If these signals are not identical to each other, the foreign matter is determined to exist on the specimen in detection.
    • 提供一种用于检测缺陷的方法和装置,用于通过减少由于电路图案引起的噪声来检测对诸如氧化物膜的透明膜在内的待检查物体的高灵敏度的有害缺陷或异物。 用于检测缺陷的装置包括:载置基板试样的载台部分,其可以在XYZ-θ方向中任意移动;照射系统,用于利用来自倾斜方向的光照射电路图案;以及图像形成 光学系统,用于从上下方向在检测器上形成照射的检测区域的图像。 利用这种布置,收集通过照明系统的照明在电路图案上产生的衍射光和散射光。 此外,在傅立叶变换表面上提供空间滤波器,用于阻挡来自电路图形的线性部分的衍射光。 由检测器从样本接收的散射和反射光被转换成电信号。 将一个芯片的转换电信号与另一个芯片的转换电信号进行比较。 如果这些信号彼此不相同,则检测到异物被确定为存在于样品上。