专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2012002086A1 LASER APPARATUS 审中-公开
标题翻译：激光装置
公开(公告)号：WO2012002086A1
公开(公告)日：2012-01-05
申请号：PCT/JP2011/062312
申请日：2011-05-24
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , TAMAOKI, Shinobu
发明人： TAMAOKI, Shinobu
IPC分类号： H01S3/067 , H01S3/094 , H01S3/0941 , H01S3/10 , H01S3/11 , H01S3/23
CPC分类号： H01S3/06779 , H01S3/0085 , H01S3/094003 , H01S3/094011 , H01S3/094076 , H01S3/09415 , H01S3/10007 , H01S3/10046 , H01S3/1618 , H01S2301/02
摘要： The present invention relates to a laser apparatus with a structure for realizing a fast response in carrying out a start and an end of output of pulsed laser light while effectively suppressing damage to an optical amplifying medium. The laser apparatus is provided with a seed light source (10), an optical amplification section (20), a pulse modulator (40), a pump power controller (50), and a main controller (60). The pulse modulator receives an output start instruction and an output end instruction fed from the main controller and controls a start and an end of output of seed light from the seed light source. The pump power controller receives a pump trigger signal fed from the main controller and increases or decreases a power of pump light supplied to the amplification section. The main controller deceases the power of the pump light supplied to the amplification section, on the occasion of ending the output of the pulsed laser light, and thereafter makes the pulse modulator end the output of the seed light from the seed light source.
摘要翻译：本发明涉及具有用于在实现脉冲激光的输出的开始和结束时实现快速响应的结构的激光装置，同时有效地抑制对光放大介质的损害。激光装置设置有种子光源（10），光放大部（20），脉冲调制器（40），泵功率控制器（50）和主控制器（60）。脉冲调制器接收从主控制器馈送的输出开始指令和输出结束指令，控制来自种子光源的种子光的开始和结束。泵功率控制器接收从主控制器馈送的泵触发信号，并增加或减少供给到放大部分的泵浦光的功率。在结束脉冲激光的输出时，主控制器使提供给放大部分的泵浦光的功率下降，然后使得脉冲调制器从种子光源结束种子光的输出。

2. 发明公开

EP2674239A1 LASER PROCESSING METHOD 有权
标题翻译：激光加工方法
公开(公告)号：EP2674239A1
公开(公告)日：2013-12-18
申请号：EP12745040.1
申请日：2012-02-09
申请人： Sumitomo Electric Industries, Ltd. , National University Corporation Okayama University
发明人： KAKUI, Motoki , KOHDA, Hiroshi , KANEUCHI, Yasuomi , TAMAOKI, Shinobu , NAGANO, Shigehiro , UNO, Yoshiyuki , OKAMOTO, Yasuhiro , TAKAHASHI, Kenta
IPC分类号： B23K26/38 , B23K26/04 , B23K26/40 , C03B33/09 , H01L21/301
CPC分类号： B23K26/40 , B23K26/0006 , B23K26/0057 , B23K26/0063 , B23K26/0617 , B23K26/0869 , B23K26/10 , B23K26/36 , B23K26/361 , B23K26/364 , B23K26/38 , B23K26/53 , B23K2203/50 , B23K2203/56 , H01L21/302
摘要： There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method according to the present invention includes the steps of: preparing a material to be processed (S10); and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam (S20). In the aforementioned step (S20), pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.
摘要翻译：获得了一种激光加工方法，通过该方法可以实现切割表面的优良形状并且可以抑制成本的增加。根据本发明的激光加工方法包括以下步骤：准备待加工材料（S10）; 通过用激光束照射待处理材料（S20），在待处理材料中形成改变区域。在上述步骤（S20）中，利用透镜聚焦具有连续光谱的脉冲激光束，由此形成由多个焦点构成的聚焦线，该聚焦线由形成激光束的连续光谱的预定带获得，并且材料用激光束照射待处理材料，使得至少一部分聚焦线位于待处理材料的表面上，从而在聚焦线的轴线上形成改变区域。

3. 发明公开

EP2717095A1 LIGHT SOURCE DEVICE AND PROCESSING METHOD 审中-公开
标题翻译： LICHTQUELLENVORRICHTUNG UND VERARBEITUNGSVERFAHRENDAFÜR
公开(公告)号：EP2717095A1
公开(公告)日：2014-04-09
申请号：EP12794150.8
申请日：2012-05-31
申请人： Sumitomo Electric Industries, Ltd.
发明人： TAMAOKI, Shinobu , KAKUI, Motoki
IPC分类号： G02F1/35 , B23K26/073 , B23K26/08 , G02B6/00 , H01S3/10
CPC分类号： H01S3/06758 , G02B6/02323 , G02B6/02347 , H01S3/06741 , H01S3/1618 , H01S3/2308 , H01S3/302 , H01S2301/203
摘要： The present invention relates to a light source apparatus. The light source apparatus has an MOPA configuration and comprises a seed light source, a pulse generator, an intermediate optical amplifier, a final stage optical amplifier, a delivery optical fiber, and a light output terminal. The delivery optical fiber is a PBG fiber having a photonic bandgap (PBG) structure in a core-surrounding portion located around the core. Light with a wavelength in a high loss band of the PBG fiber is inputted into the PBG fiber.
摘要翻译：光源装置技术领域本发明涉及光源装置。光源装置具有MOPA配置，包括种子光源，脉冲发生器，中间光放大器，最后级光放大器，输送光纤和光输出端。输送光纤是在芯周围的芯环绕部分中具有光子带隙（PBG）结构的PBG纤维。将PBG光纤的高损耗频带的波长的光输入到PBG光纤。

4. 发明授权

EP2366487B1 LASER PROCESSING METHOD AND LASER PROCESSING DEVICE 有权
标题翻译：激光加工方法和激光加工装置
公开(公告)号：EP2366487B1
公开(公告)日：2015-05-20
申请号：EP09822081.7
申请日：2009-10-23
申请人： Sumitomo Electric Industries, Ltd.
发明人： KAKUI, Motoki , NAKAMAE, Kazuo , TAMAOKI, Shinobu
IPC分类号： B23K26/36 , B23K26/00 , H01S3/00 , H05K3/00 , B23K101/42
CPC分类号： H05K3/0035 , B23K26/0622 , B23K26/082 , B23K26/389 , B23K26/40 , B23K2203/172 , B23K2203/42 , B23K2203/50 , H01S3/067

5. 发明公开

EP2586108A1 LASER APPARATUS 有权
标题翻译：激光单元
公开(公告)号：EP2586108A1
公开(公告)日：2013-05-01
申请号：EP11728696.3
申请日：2011-05-24
申请人： Sumitomo Electric Industries, Ltd.
发明人： TAMAOKI, Shinobu
IPC分类号： H01S3/067 , H01S3/094 , H01S3/0941 , H01S3/10 , H01S3/11 , H01S3/23
CPC分类号： H01S3/06779 , H01S3/0085 , H01S3/094003 , H01S3/094011 , H01S3/094076 , H01S3/09415 , H01S3/10007 , H01S3/10046 , H01S3/1618 , H01S2301/02
摘要： The present invention relates to a laser apparatus with a structure for realizing a fast response in carrying out a start and an end of output of pulsed laser light while effectively suppressing damage to an optical amplifying medium. The laser apparatus is provided with a seed light source (10), an optical amplification section (20), a pulse modulator (40), a pump power controller (50), and a main controller (60). The pulse modulator receives an output start instruction and an output end instruction fed from the main controller and controls a start and an end of output of seed light from the seed light source. The pump power controller receives a pump trigger signal fed from the main controller and increases or decreases a power of pump light supplied to the amplification section. The main controller deceases the power of the pump light supplied to the amplification section, on the occasion of ending the output of the pulsed laser light, and thereafter makes the pulse modulator end the output of the seed light from the seed light source.

6. 发明公开

EP2366487A1 LASER PROCESSING METHOD AND LASER PROCESSING DEVICE 有权
标题翻译： LASER激光加工设备的进程
公开(公告)号：EP2366487A1
公开(公告)日：2011-09-21
申请号：EP09822081.7
申请日：2009-10-23
申请人： Sumitomo Electric Industries, Ltd.
发明人： KAKUI, Motoki , NAKAMAE, Kazuo , TAMAOKI, Shinobu
IPC分类号： B23K26/36 , B23K26/00 , H01S3/00 , H05K3/00 , B23K101/42
CPC分类号： H05K3/0035 , B23K26/0622 , B23K26/082 , B23K26/389 , B23K26/40 , B23K2203/172 , B23K2203/42 , B23K2203/50 , H01S3/067
摘要： The present invention relates to a laser processing method and the like which use no wavelength conversion technique by nonlinear optical crystals when selectively removing an insulating layer of a printed board, while employing only one wavelength throughout the entire removal processing. A laser processing apparatus (1), preferably used in the laser processing method, has a MOPA structure and comprises a seed light source (100), a YbDF (110), a bandpass filter (120), a YbDF (130), a bandpass filter (140), a YbDF (150), a YbDF (160), and so forth. The laser processing method according to the present invention is a laser processing method of removing an insulating layer comprised of a resin laminated on a conductor layer by irradiating it with pulsed laser light outputted from the laser processing apparatus (1) and uses laser light having a wavelength at which the light absorbed by the conductor layer is less than 10%, and sets the fluence per one pulse to a fracture damage threshold of the insulating layer or higher.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式