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    • 1. 发明专利
    • OPTICAL CONNECTOR
    • JPH0486609A
    • 1992-03-19
    • JP19998590
    • 1990-07-27
    • SUMITOMO ELECTRIC INDUSTRIESNEC CORP
    • SAITO KAZUTOSAWANO ISATAKEKURISAKA MASARU
    • G02B6/40G02B6/38
    • PURPOSE:To facilitate simultaneous connection of multiple fibers at a low loss with good attaching and detaching workability by building in a pressure sleeve for intensifying the pressurizing force for elastically pressurizing guide pins toward the lower direction of the guide pin grooves of a groove base plate at the time of insertion of an optical connector ferrule. CONSTITUTION:An external clamping mechanism having the pressure sleeve 25 is provided in an optical connector adapter 20. The pressure sleeve 25 is adapted to elastically grip the optical connector ferrule 10 from above and below and to intensify the guide pin gripping force from the outside after the optical connector ferrule advances into the adapter 20 and the guide pins 3 are inserted into the inlets in the guide pin holes. The low-loss connection is enabled in this way and the need for handling the guide pins based on the push-pull functions is eliminated at all. The optical connector having the simple attaching and detaching workability is obtd.
    • 2. 发明专利
    • OPTICAL CONNECTOR
    • JPH0486608A
    • 1992-03-19
    • JP19998490
    • 1990-07-27
    • SUMITOMO ELECTRIC INDUSTRIESNEC CORP
    • SAITO KAZUTOKAKII TOSHIAKISUZUKI SHUZOSAWANO ISATAKEKURISAKA MASARU
    • G02B6/36
    • PURPOSE:To eliminate the need for handling small side pins and to facilitate attaching and detaching operability by fixing guide pins to guide pin holding plates and forming the guide pin holding plates in such a manner that these holding plates can be finely adjusted easily in the direction perpendicular to the axis of the guide pins. CONSTITUTION:The guide pins 3 positioned in an adapter are fixed to the guide pin holding plates 2 positioned in the direction perpendicular to the guide pin axis in the central part of the longitudinal direction thereof. The guide pin holding plates 2 are housed in the holding plate housing part 6 in the adapter easily finely adjustably in the direction perpendicular to the guide pin axis while the holding plates are held substantially immobile in the axial direction of the guide pins. The guide pin 3 sides are inserted into the guide pin holes of an optical connector plug while the positions thereof are changed in this case. The need for handling the fine and small guide pins is eliminated in this way and the attaching and detaching operability is facilitated.
    • 4. 发明专利
    • DE69116999D1
    • 1996-03-21
    • DE69116999
    • 1991-11-19
    • JAPAN AVIATION ELECTRONNEC CORP
    • SHIBUTANI MICHITOMOSAWANO TSUYOTAKESATO YOSHITAROKURISAKA MASARU
    • G02B6/38
    • An optical connector comprises an optical connection adapter and an optical plug. The optical connection adapter includes a sleeve to be attached to a first circuit board. The optical plug includes an optical contact to be inserted into and removed from the sleeve, and a contact holding member to be attached to a second circuit board. A variation of the optical connector comprises an optical connection adapter and an optical socket. The optical connection adapter comprises a pipe, an optical fiber arranged in the pipe, an optical connector connected to opposite ends of the optical fiber, and a contact holding member which is inserted into the pipe to be movable along the cylindrical axis and which is for holding the optical contact. The optical socket comprises a socket housing which has an insertion hole for removably receiving the optical contact and which is to be attached to the second circuit board, and a mating optical contact which is fixed to the socket housing and which is to be brought into contact with the optical contact through the insertion hole. In addition, an optical fiber unit which forms a part of the optical connection adapter comprises an optical fiber, an optical contact connected to opposite ends of the optical fiber, and a contact holding member for holding the optical contact to be movable along the optical axis. The optical fiber is slack when the contact holding member is located at a maximum distance from the corresponding contact holding member.
    • 5. 发明专利
    • DE69131026T2
    • 1999-08-12
    • DE69131026
    • 1991-11-19
    • JAPAN AVIATION ELECTRONNEC CORP
    • SHIBUTANI MICHITOMOSAWANO TSUYOTAKESATO YOSHITARAKURISAKA MASARU
    • G02B6/38G02B6/42
    • An optical connector comprises an optical connection adapter and an optical plug. The optical connection adapter includes a sleeve to be attached to a first circuit board. The optical plug includes an optical contact to be inserted into and removed from the sleeve, and a contact holding member to be attached to a second circuit board. A variation of the optical connector comprises an optical connection adapter and an optical socket. The optical connection adapter comprises a pipe, an optical fiber arranged in the pipe, an optical connector connected to opposite ends of the optical fiber, and a contact holding member which is inserted into the pipe to be movable along the cylindrical axis and which is for holding the optical contact. The optical socket comprises a socket housing which has an insertion hole for removably receiving the optical contact and which is to be attached to the second circuit board, and a mating optical contact which is fixed to the socket housing and which is to be brought into contact with the optical contact through the insertion hole. In addition, an optical fiber unit which forms a part of the optical connection adapter comprises an optical fiber, an optical contact connected to opposite ends of the optical fiber, and a contact holding member for holding the optical contact to be movable along the optical axis. The optical fiber is slack when the contact holding member is located at a maximum distance from the corresponding contact holding member.
    • 6. 发明专利
    • DE69131026D1
    • 1999-04-22
    • DE69131026
    • 1991-11-19
    • JAPAN AVIATION ELECTRONNEC CORP
    • SHIBUTANI MICHITOMOSAWANO TSUYOTAKESATO YOSHITARAKURISAKA MASARU
    • G02B6/38G02B6/42
    • An optical connector comprises an optical connection adapter and an optical plug. The optical connection adapter includes a sleeve to be attached to a first circuit board. The optical plug includes an optical contact to be inserted into and removed from the sleeve, and a contact holding member to be attached to a second circuit board. A variation of the optical connector comprises an optical connection adapter and an optical socket. The optical connection adapter comprises a pipe, an optical fiber arranged in the pipe, an optical connector connected to opposite ends of the optical fiber, and a contact holding member which is inserted into the pipe to be movable along the cylindrical axis and which is for holding the optical contact. The optical socket comprises a socket housing which has an insertion hole for removably receiving the optical contact and which is to be attached to the second circuit board, and a mating optical contact which is fixed to the socket housing and which is to be brought into contact with the optical contact through the insertion hole. In addition, an optical fiber unit which forms a part of the optical connection adapter comprises an optical fiber, an optical contact connected to opposite ends of the optical fiber, and a contact holding member for holding the optical contact to be movable along the optical axis. The optical fiber is slack when the contact holding member is located at a maximum distance from the corresponding contact holding member.
    • 7. 发明专利
    • DE69116999T2
    • 1996-08-08
    • DE69116999
    • 1991-11-19
    • JAPAN AVIATION ELECTRONNEC CORP
    • SHIBUTANI MICHITOMOSAWANO TSUYOTAKESATO YOSHITAROKURISAKA MASARU
    • G02B6/38
    • An optical connector comprises an optical connection adapter and an optical plug. The optical connection adapter includes a sleeve to be attached to a first circuit board. The optical plug includes an optical contact to be inserted into and removed from the sleeve, and a contact holding member to be attached to a second circuit board. A variation of the optical connector comprises an optical connection adapter and an optical socket. The optical connection adapter comprises a pipe, an optical fiber arranged in the pipe, an optical connector connected to opposite ends of the optical fiber, and a contact holding member which is inserted into the pipe to be movable along the cylindrical axis and which is for holding the optical contact. The optical socket comprises a socket housing which has an insertion hole for removably receiving the optical contact and which is to be attached to the second circuit board, and a mating optical contact which is fixed to the socket housing and which is to be brought into contact with the optical contact through the insertion hole. In addition, an optical fiber unit which forms a part of the optical connection adapter comprises an optical fiber, an optical contact connected to opposite ends of the optical fiber, and a contact holding member for holding the optical contact to be movable along the optical axis. The optical fiber is slack when the contact holding member is located at a maximum distance from the corresponding contact holding member.
    • 8. 发明专利
    • LINBO3 OPTICAL SWITCH
    • JPH0383025A
    • 1991-04-09
    • JP22205089
    • 1989-08-28
    • NEC CORP
    • KURISAKA MASARU
    • G02B6/12G02F1/035G02F1/313
    • PURPOSE:To prevent the electrification in a high-temp. state by forming a metallic film which discharges the charge electrified on an LiNbO3 substrate to the ground on the surface of the LiNbO3 substrate, on which surface waveguides are not disposed. CONSTITUTION:The LiNbO3 optical switch 10 is basically constituted of plural Ti waveguides 2 and electrodes 3 for switching on one surface of the LiNbO3 substrate 1 and is further constituted by having the metallic film 4 consisting of Cr-Au, Ti-Au, etc., on rear surface side in order to prevent electrification of the LiNbO3 substrate 1. The LiNbO3 is intrinsically the dielectric and is electrified simply by resting the same in the high-temp. state, for example, in about 50 deg.C environment. The state in which a voltage is impressed to the electrodes 3 is equivalently attained if the discharge to this electrification is insufficient. Namely, the switching characteristics vary with the electrification, but the electrification is obviated in spite of rising of the use environment temp. to about 50 to 60 deg.C and the good switching characteristics are obtd. by forming the metallic film 4 consisting of Cr-Au, Ti-Au, etc., on the rear surface and shorting the metallic film 4 to the ground. The LiNbO3 optical switch having the high quality is obtd. in this way.
    • 9. 发明专利
    • LEADLESS CHIP CARRIER
    • JPS62154637A
    • 1987-07-09
    • JP29716885
    • 1985-12-26
    • NEC CORP
    • KURISAKA MASARU
    • H01L23/12H01L21/60
    • PURPOSE:To compose a high density 3-dimensional memory unit by providing a plurality of side electrodes passing a front surface and a back surface, and a plurality of side electrodes disposed from either one of front and back surfaces to a predetermined position on the way to the side. CONSTITUTION:Side electrodes 2 are assigned intrinsically for a chip select signal semiconductor memory, and side electrodes 3 are assigned commonly for an address signal, a data signal, a power source and a ground. The wirings for the memory unit have a feature that wirings for connecting all memories in parallel like address wirings, data wirings are increased. Leadless chip carriers 1a-1n contain the semiconductor memory and are then sealed by a sealing cap 7, the side electrodes 2a-2n, 3.1a-3.1n, 3.2a-3.2n are stacked to correspond to signals, and the side electrodes 2a-2n, 3.1a-3.1n, 3.2a-3.2n are filled with solder to construct a 3-dimensional memory unit.
    • 10. 发明专利
    • Chip carrier
    • 芯片载体
    • JPS61120434A
    • 1986-06-07
    • JP24211184
    • 1984-11-16
    • Nec Corp
    • KURISAKA MASARU
    • H01L21/60
    • H01L23/13H01L25/0657H01L2224/48H01L2224/48091H01L2224/48227H01L2225/0651H01L2225/06582H01L2924/16195H01L2924/1627H01L2924/00014H01L2924/00
    • PURPOSE:To enable chip carriers to be packaged in a high density, by providing two or more wire bonding layers and arranging sealing layers stepwise in upper and lower stages so as to decrease the carrying area of the carrier. CONSTITUTION:A chip carrier 10 is provided with a die pad 11, with two wire bonding layers 12 and 13 and with sealing layers 14 and 15 which are arranged stepwise in the upper and lower stages. The bonding layers 12 and 13 are provided with a plurality of wire bonding pads 16 and 17, respectively, while the sealing layers 14 and 15 are provided with sealing pads 18 and 19, respectively. IC's 21 and 31 are received in the carrier 20 thus constructed and the carrier is sealed with a cap 35 while a sealing cap 26 is used as a die pad for the IC 31. In this manner, a plurality of IC's can be packaged three-dimentionally without increasing the carrying area of the carrier. Accordingly, such chip carriers can be packaged on a printed-circuit board in a high density.
    • 目的:通过提供两个或更多个引线接合层,并在上下阶段逐步设置密封层,以便降低载体的承载面积,使芯片载体能够以高密度封装。 构成:芯片载体10设置有管芯焊盘11,其具有两个引线接合层12和13以及在上部和下部阶段性地布置的密封层14和15。 接合层12和13分别设置有多个引线接合焊盘16和17,而密封层14和15分别设置有密封垫18和19。 集成电路21和31被接收在如此构造的载体20中,并且载体用盖35密封,而密封盖26用作IC 31的管芯焊盘。以这种方式,可以将多个IC封装成三层, 在不增加载体的承载面积的情况下。 因此,这样的芯片载体可以以高密度封装在印刷电路板上。