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1. 发明公开

EP2226155A2 Cylindrical grinder and cylindrical grinding method of ingot 有权
标题翻译： Zylinderschleifgerätund ZylinderschleifverfahrenfürBlöcke
公开(公告)号：EP2226155A2
公开(公告)日：2010-09-08
申请号：EP10154263.7
申请日：2010-02-22
申请人： SUMCO Corporation
发明人： Kaito, Ryoichi
IPC分类号： B24B5/04 , B24B41/04
CPC分类号： B24B5/047 , B24B5/045 , B24B5/50 , B24B41/061
摘要： A cylindrical grinder is disclosed that includes a support unit including an upper support device and a lower support device, in which an ingot of silicon single crystal is interposed in a direction of axis line between the upper support device and the lower support device and is clampingly held to be rotated around the axis line, and a grinding unit that relatively moves along the direction of axis line of the ingot to traverse grind an outer circumference of the ingot. The upper support device is placed at an upper position and the lower support device is placed at a lower position, so that the support unit clampingly holds the ingot in a state in which the direction of the axis line of the ingot is disposed along a vertical direction.
摘要翻译：公开了一种圆柱形研磨机，其包括支撑单元，该支撑单元包括上支撑装置和下支撑装置，其中单晶硅锭沿着上支撑装置和下支撑装置之间的轴线方向插入，并且夹紧被保持为围绕轴线旋转;以及研磨单元，其沿着所述锭的轴线方向相对移动以横过所述锭的外周。上支撑装置被放置在上部位置，下部支撑装置放置在下部位置，使得支撑单元夹紧地将锭保持在铸锭的轴线的方向沿着垂直方向设置的状态方向。

2. 发明授权

EP2226155B1 Cylindrical grinder and cylindrical grinding method of ingot 有权
公开(公告)号：EP2226155B1
公开(公告)日：2019-05-08
申请号：EP10154263.7
申请日：2010-02-22
申请人： SUMCO Corporation
发明人： Kaito, Ryoichi
IPC分类号： B24B5/04 , B24B5/50 , B24B41/06

3. 发明公开

EP2226155A3 Cylindrical grinder and cylindrical grinding method of ingot 有权
标题翻译：圆筒磨削装置和外圆磨削过程块
公开(公告)号：EP2226155A3
公开(公告)日：2014-08-20
申请号：EP10154263.7
申请日：2010-02-22
申请人： SUMCO Corporation
发明人： Kaito, Ryoichi
IPC分类号： B24B5/04 , B24B5/50 , B24B41/06
CPC分类号： B24B5/047 , B24B5/045 , B24B5/50 , B24B41/061
摘要： A cylindrical grinder is disclosed that includes a support unit including an upper support device and a lower support device, in which an ingot of silicon single crystal is interposed in a direction of axis line between the upper support device and the lower support device and is clampingly held to be rotated around the axis line, and a grinding unit that relatively moves along the direction of axis line of the ingot to traverse grind an outer circumference of the ingot. The upper support device is placed at an upper position and the lower support device is placed at a lower position, so that the support unit clampingly holds the ingot in a state in which the direction of the axis line of the ingot is disposed along a vertical direction.

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