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1. 发明申请

WO2007083237A8 INTEGRATION OF SELF-ALIGNED TRENCHES IN-BETWEEN METAL LINES 审中-公开
标题翻译：在金属线之间的自对准铁素体的整合
公开(公告)号：WO2007083237A8
公开(公告)日：2007-12-27
申请号：PCT/IB2007000162
申请日：2007-01-11
申请人： ST MICROELECTRONICS CROLLES 2 , KONINKL PHILIPS ELECTRONICS NV , TORRES JOAQUIN , GOSSET LAURENT-GEORGES
发明人： TORRES JOAQUIN , GOSSET LAURENT-GEORGES
IPC分类号： H01L21/768
CPC分类号： H01L21/7682 , H01L21/76885 , H01L23/5222 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides an improved method of forming air cavities to overcome IC via-misalignment issues. The method of forming air cavity trenches in-between metal lines of an integrated circuit includes the steps of partially removing (42) an intertrack dielectric deposited on an interconnect structure surface to control the height between the top surface of a metal line of the interconnect surface and the surface of the intertrack dielectric; depositing (44) a dielectric liner on the interconnect surface; removing (46) at least part of the dielectric liner on the interconnect surface; successively repeating (48) the deposition of the dielectric liner and the removal of the dielectric liner on the interconnect surface in so far as the interconnect surface is sufficiently protected by a remaining dielectric liner for forming of the plurality of air cavity trenches; and forming (50) at least one air cavity trench in-between the metal lines by etching the intertrack dielectric material.
摘要翻译：本发明提供了一种形成空气腔以改善IC通过失准问题的改进方法。在集成电路的金属线之间形成空气腔沟槽的方法包括以下步骤：部分去除（42）沉积在互连结构表面上的介质电介质，以控制互连表面的金属线的顶表面之间的高度和交织电介质的表面; 在所述互连表面上沉积（44）电介质衬垫; 在所述互连表面上移除（46）所述电介质衬垫的至少一部分; 在互连表面被用于形成多个空气腔沟槽的剩余电介质衬垫充分保护的范围内连续地重复（48）电介质衬垫的沉积和电介质衬垫在互连表面上的移除; 以及通过蚀刻所述轨道间介电材料，在所述金属线之间形成（50）至少一个气腔沟槽。

2. 发明专利

JP2007027734A Integration control of interconnection air cavity and reliability improvement 审中-公开
标题翻译：互连空气质量整体控制与可靠性改进
公开(公告)号：JP2007027734A
公开(公告)日：2007-02-01
申请号：JP2006191476
申请日：2006-07-12
申请人： Koninkl Philips Electronics Nv , Stmicroelectronics (Crolles 2) Sas , エステーミクロエレクトロニクス (クロール 2) ソシエテパールアクシオンサンプリフィエSTMicroelectronics (Crolles 2) SAS , コニンクリユケフィリプスエレクトロニクスナムローゼフェンノートシャップKoninklijke Philips Electronics N.V.
发明人： TORRES JOAQUIN , GOSSET LAURENT-GEORGES
IPC分类号： H01L21/768 , H01L23/522
CPC分类号： H01L21/76831 , H01L21/7682 , H01L21/76849
摘要： PROBLEM TO BE SOLVED: To provide an integrated circuit, and an integrated circuit manufacturing method, wherein integration of interconnection air cavity is controlled for improved reliability.
SOLUTION: The invention relates to an improved integrated circuit and an integrated circuit manufacturing method, in which an air cavity, being highly controlled, is introduced in high speed copper interconnection, based on the introduction of polymer material to the side wall of a via and an interconnection line in an interconnection stack. The method includes controlled formation of air cavity, resulting in improved signal propagation performance at a semiconductor interconnection.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供集成电路和集成电路制造方法，其中控制互连空气腔的集成以提高可靠性。解决方案：本发明涉及一种改进的集成电路和集成电路制造方法，其中在高速铜互连中引入高度可控的空气腔，基于将聚合物材料引入到侧壁的侧壁互连叠层中的通孔和互连线。该方法包括控制形成空气腔，从而在半导体互连处提高了信号传播性能。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007019508A Control of lateral direction distribution of a plurality of air gaps in interconnection wiring 审中-公开
标题翻译：控制互连线路中多空气流的方向分配
公开(公告)号：JP2007019508A
公开(公告)日：2007-01-25
申请号：JP2006184901
申请日：2006-07-04
申请人： Koninkl Philips Electronics Nv , Stmicroelectronics (Crolles 2) Sas , エステミクロエレクトロニクス(クロレ・2)・エスアーエス , コニンクレイケフィリップスエレクトロニクスナームロゼフェンノートシャップ
发明人： TORRES JOAQUIN , GOSSET LAURENT-GEORGES
IPC分类号： H01L21/768 , H01L23/522
CPC分类号： H01L21/7682
摘要： PROBLEM TO BE SOLVED: To improve lateral controllability when forming an air gap in an interconnection structure.
SOLUTION: There is provided a method of manufacturing an integrated circuit. At least, one air cavity (32) is formed on the lower portion of the regulation of the surface of a substrate by forming an interconnection structure laminated body (10) working as an integrated circuit, regulating a regulation (14) aiming at the formation of the air cavity on the surface (15) of the interconnection structure laminated body, regulating at least one trench region surrounding the regulation of the surface of a substrate and forming at least one trench in the interconnection structure laminated body in the trench region, coating the trench and forming a hard mask layer (26), and removing a sacrifice material percolating a percolation material using remover (24).
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提高在互连结构中形成气隙时的横向可控性。提供了一种制造集成电路的方法。至少通过形成作为集成电路工作的互连结构层叠体（10），在基板的表面的调节的下部形成一个空气腔（32），调节针对形成的调节（14）在所述互连结构层叠体的表面（15）上形成空气腔，调节围绕衬底表面的调节的至少一个沟槽区域，并且在沟槽区域中形成互连结构层叠体中的至少一个沟槽，涂层并且形成硬掩模层（26），并且使用去除剂（24）去除用渗透材料渗滤的牺牲物质。版权所有（C）2007，JPO＆INPIT

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