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1. 发明申请

WO2009014554A1 PRINTED CIRCUIT BOARDS WITH A MULTI-PLANE ANTENNA AND METHODS FOR CONFIGURING THE SAME 审中-公开
标题翻译：具有多平面天线的印刷电路板及其配置方法
公开(公告)号：WO2009014554A1
公开(公告)日：2009-01-29
申请号：PCT/US2008/001469
申请日：2008-02-04
申请人： SONY ERICSSON MOBILE COMMUNICATIONS AB , SOORA, Shruthi , OZKAR, Mete
发明人： SOORA, Shruthi , OZKAR, Mete
IPC分类号： H01Q1/24 , H01Q1/36 , H01Q1/38 , H01Q11/08
CPC分类号： H01Q1/243 , H01Q1/362 , H01Q1/38 , H01Q11/08
摘要： Multi-plane antennae on a substrate having a front face and a back face are provided. A plurality of through holes extend through the substrate between the front face and the back face of the substrate. A first antenna component is on the front face of the substrate and a second antenna component is on the back face of the substrate. A conductive via extends through a selected one of the through holes that electrically connects the first antenna component and the second antenna component to define the multi-plane antenna on the substrate. The substrate may be a printed circuit board (PCB). Mobile terminals including a multi-plane antenna and methods of configuring a multi-plane antenna are also provided.
摘要翻译：提供了具有正面和背面的基板上的多平面天线。多个通孔在基板的正面和背面之间延伸穿过基板。第一天线部件在基板的正面上，第二天线部件位于基板的背面。导电通孔延伸通过电连接第一天线部件和第二天线部件的选定的一个通孔，以在基板上限定多平面天线。基板可以是印刷电路板（PCB）。还提供了包括多平面天线的移动终端和配置多平面天线的方法。

2. 发明申请

WO2008089197A2 INTEGRATED BANDPASS/BANDSTOP COUPLED LINE FILTER 审中-公开
标题翻译：集成的通带/带式耦合线路滤波器
公开(公告)号：WO2008089197A2
公开(公告)日：2008-07-24
申请号：PCT/US2008/051090
申请日：2008-01-15
申请人： HARRIS STRATEX NETWORKS OPERATING CORPORATION , SOORA, Shruthi
发明人： SOORA, Shruthi
IPC分类号： H01P1/203
CPC分类号： H01P1/20363
摘要： An apparatus and method for attenuating selected frequency bands in a microstrip filter having a plurality of microstrip resonators. The filter comprises plural resonators, a first of the plural resonators is operatively connected to a first feed point and a second of the plural resonators is operatively connected to a second feed point. A third of the plural resonators is a half wavelength resonator and may be operatively connected to the first, second and/or other plural resonators. The third resonator may also comprise a plurality of resonators whereby the position and number of the third resonator is a function of a predetermined rejected frequency range.
摘要翻译：用于衰减具有多个微带谐振器的微带滤波器中的选定频带的装置和方法。滤波器包括多个谐振器，多个谐振器中的第一个谐振器可操作地连接到第一馈送点，并且多个谐振器中的第二个可操作地连接到第二馈送点。多个谐振器中的第三个是半波长谐振器，并且可以可操作地连接到第一，第二和/或其他多个谐振器。第三谐振器还可以包括多个谐振器，由此第三谐振器的位置和数量是预定的拒绝频率范围的函数。

3. 发明申请

WO2008064017A2 HAIRPIN MICROSTRIP BANDPASS FILTER 审中-公开
标题翻译：头发微波滤波器
公开(公告)号：WO2008064017A2
公开(公告)日：2008-05-29
申请号：PCT/US2007/084580
申请日：2007-11-13
申请人： HARRIS STRATEX NETWORKS OPERATING CORPORATION , SOORA, Shruthi
发明人： SOORA, Shruthi
IPC分类号： H01P1/203
CPC分类号： H01P1/203
摘要： A microstrip filter having a plurality of hairpin microstrip resonators each having two substantially rectangular legs connected at one end and generally configured in a "U" shape. The microstrip filter may comprise a first of the plural resonators operatively connected to a first feed point, a second of the plural resonators operatively connected to a second feed point, and a third of the plural resonators operatively connected between the first and second resonators where an end portion of one of the legs of one of the resonators is tapered so that a thickness of the one leg is greater at one end of the one leg than at another end of the one leg.
摘要翻译：一种具有多个发夹微带谐振器的微带滤波器，每个发夹微带谐振器具有在一端连接并且大致配置为“U”形状的两个基本上矩形的支脚。微带滤波器可以包括可操作地连接到第一馈电点的多个谐振器中的第一个，可操作地连接到第二馈电点的多个谐振器中的第二谐振器和可操作地连接在第一和第二谐振器之间的多个谐振器中的第三谐振器，其中一个谐振器的一个腿的端部部分是锥形的，使得一条腿的一端的厚度比一条腿的另一端更大。

4. 发明公开

EP2171795A1 PRINTED CIRCUIT BOARDS WITH A MULTI-PLANE ANTENNA AND METHODS FOR CONFIGURING THE SAME 审中-公开
标题翻译：基于多层天线和配置方法用于电路板
公开(公告)号：EP2171795A1
公开(公告)日：2010-04-07
申请号：EP08725144.3
申请日：2008-02-04
申请人： Sony Ericsson Mobile Communications AB
发明人： SOORA, Shruthi , OZKAR, Mete
IPC分类号： H01Q1/24 , H01Q1/36 , H01Q1/38 , H01Q11/08
CPC分类号： H01Q1/243 , H01Q1/362 , H01Q1/38 , H01Q11/08
摘要： Multi-plane antennae on a substrate having a front face and a back face are provided. A plurality of through holes extend through the substrate between the front face and the back face of the substrate. A first antenna component is on the front face of the substrate and a second antenna component is on the back face of the substrate. A conductive via extends through a selected one of the through holes that electrically connects the first antenna component and the second antenna component to define the multi-plane antenna on the substrate. The substrate may be a printed circuit board (PCB). Mobile terminals including a multi-plane antenna and methods of configuring a multi-plane antenna are also provided.

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