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1. 发明申请

WO2011035188A2 PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS 审中-公开
标题翻译：光敏成像装置和相关方法
公开(公告)号：WO2011035188A2
公开(公告)日：2011-03-24
申请号：PCT/US2010/049375
申请日：2010-09-17
申请人： SIONYX, INC. , HADDAD, Homayoon , JIANG, Jutao , MCKEE, Jeffrey , MILLER, Drake , FORBES, Leonard , PALSULE, Chintamani
发明人： HADDAD, Homayoon , JIANG, Jutao , MCKEE, Jeffrey , MILLER, Drake , FORBES, Leonard , PALSULE, Chintamani
IPC分类号： H01L27/146 , H01L27/148
CPC分类号： H01L27/14609 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/1464
摘要： Photosensitive devices and associated methods are provided. In one aspect, for example, a photosensitive imager device can include a semiconductor substrate having multiple doped regions forming at least one junction, a textured region coupled to the semiconductor substrate and positioned to interact with electromagnetic radiation, and an electrical transfer element coupled to the semiconductor substrate and operable to transfer an electrical signal from the at least one junction. In one aspect, the textured region is operable to facilitate generation of an electrical signal from the detection of infrared electromagnetic radiation. In another aspect, interacting with electromagnetic radiation further includes increasing the semiconductor substrate's effective absorption wavelength as compared to a semiconductor substrate lacking a textured region.
摘要翻译：提供了光敏装置和相关方法。在一个方面，例如，光敏成像器装置可以包括具有形成至少一个结的多个掺杂区的半导体衬底，耦合到半导体衬底并定位成与电磁辐射相互作用的纹理化区域，以及耦合到半导体衬底并且可操作以传输来自所述至少一个结的电信号。在一个方面，纹理化区域可操作以促进从红外电磁辐射的检测产生电信号。在另一方面，与电磁辐射相互作用进一步包括与缺乏纹理化区域的半导体衬底相比增加半导体衬底的有效吸收波长。

2. 发明申请

WO2014151093A1 THREE DIMENSIONAL IMAGING UTILIZING STACKED IMAGER DEVICES AND ASSOCIATED METHODS 审中-公开
标题翻译：使用堆叠成像设备和相关方法的三维成像
公开(公告)号：WO2014151093A1
公开(公告)日：2014-09-25
申请号：PCT/US2014/024964
申请日：2014-03-12
申请人： SIONYX, INC. , HADDAD, Homayoon , FENG, Chen , FORBES, Leonard
发明人： HADDAD, Homayoon , FENG, Chen , FORBES, Leonard
IPC分类号： H04N13/02 , H04N13/00
CPC分类号： G01B11/026 , G06T7/557 , G06T7/571 , G06T2207/10148 , H04N13/236 , H04N13/271
摘要： Stacked imager devices that can determine distance and generate three dimensional representations of a subject and associated methods are provided. In one aspect, an imaging system can include a first imager array having a first light incident surface and a second imager array having a second light incident surface. The second imager array can be coupled to the first imager array at a surface that is opposite the first light incident surface, with the second light incident surface being oriented toward the first imager array and at least substantially uniformly spaced.
摘要翻译：提供了可以确定距离并生成主体的三维表示和相关方法的堆叠成像器设备。一方面，成像系统可以包括具有第一光入射表面的第一成像器阵列和具有第二光入射表面的第二成像器阵列。第二成像器阵列可以在与第一光入射表面相对的表面处耦合到第一成像器阵列，其中第二光入射表面朝向第一成像器阵列并且至少基本均匀地间隔开。

3. 发明申请

WO2013056249A1 THREE DIMENSIONAL ARCHITECTURE SEMICONDUCTOR DEVICES AND ASSOCIATED METHODS 审中-公开
标题翻译：三维建筑半导体器件及相关方法
公开(公告)号：WO2013056249A1
公开(公告)日：2013-04-18
申请号：PCT/US2012/060291
申请日：2012-10-15
申请人： SIONYX, INC. , HADDAD, Homayoon , FORBES, Leonard
发明人： HADDAD, Homayoon , FORBES, Leonard
IPC分类号： H01L27/146 , H01L27/14
CPC分类号： G01J5/10 , G01J5/20 , H01L27/14649 , H01L27/1469
摘要： Semiconductor devices having three dimensional (3D) architectures and methods form making such devices are provided. In one aspect, for example, a method for making a semiconductor device can include forming a device layer on a front side of a semiconductor layer that is substantially defect free, bonding a carrier substrate to the device layer, processing the semiconductor layer on a back side opposite the device layer to form a processed surface, and bonding a smart substrate to the processed surface. In some aspects, the method can also include removing the carrier substrate from the semiconductor layer to expose the device layer.
摘要翻译：提供具有三维（3D）架构和形成这种装置的方法的半导体器件。一方面，例如，制造半导体器件的方法可以包括在基本上无缺陷的半导体层的正面上形成器件层，将载体衬底接合到器件层，在后面处理半导体层一侧与器件层相对以形成加工表面，并将智能衬底接合到经处理的表面。在一些方面，该方法还可以包括从半导体层去除载体衬底以暴露器件层。

4. 发明授权

EP2974302B1 THREE DIMENSIONAL IMAGING UTILIZING STACKED IMAGER DEVICES AND ASSOCIATED METHODS 有权
公开(公告)号：EP2974302B1
公开(公告)日：2019-05-01
申请号：EP14768046.6
申请日：2014-03-12
申请人： SiOnyx, LLC , Haddad, Homayoon , Feng, Chen , Forbes, Leonard
发明人： HADDAD, Homayoon , FENG, Chen , FORBES, Leonard
IPC分类号： H04N13/20

5. 发明公开

EP2974302A1 THREE DIMENSIONAL IMAGING UTILIZING STACKED IMAGER DEVICES AND ASSOCIATED METHODS 有权
标题翻译： DREIDIMENSIONALE BILDGEBUNG MIT GESTAPELTEN BILDGEBEREENMENTEN UND ASSOZIIERTE VERFAHREN
公开(公告)号：EP2974302A1
公开(公告)日：2016-01-20
申请号：EP14768046.6
申请日：2014-03-12
申请人： SiOnyx, LLC , Haddad, Homayoon , Feng, Chen , Forbes, Leonard
发明人： HADDAD, Homayoon , FENG, Chen , FORBES, Leonard
IPC分类号： H04N13/02 , H04N13/00
CPC分类号： G01B11/026 , G06T7/571 , G06T2207/10148 , H01L27/1464 , H04N13/236 , H04N13/271
摘要： Stacked imager devices that can determine distance and generate three dimensional representations of a subject and associated methods are provided. In one aspect, an imaging system can include a first imager array having a first light incident surface and a second imager array having a second light incident surface. The second imager array can be coupled to the first imager array at a surface that is opposite the first light incident surface, with the second light incident surface being oriented toward the first imager array and at least substantially uniformly spaced. The system can also include a system lens positioned to direct incident light along an optical pathway onto the first light incident surface. The first imager array is operable to detect a first portion of the light passing along the optical pathway and to pass through a second portion of the light, where the second imager array is operable to detect at least a part of the second portion of light.
摘要翻译：提供了可以确定距离并产生主体的三维表示和相关联的方法的堆叠成像器设备。在一个方面，成像系统可以包括具有第一光入射表面的第一成像器阵列和具有第二光入射表面的第二成像器阵列。第二成像器阵列可以在与第一光入射表面相对的表面处耦合到第一成像器阵列，其中第二光入射表面朝向第一成像器阵列定向并且至少基本均匀地间隔开。该系统还可以包括系统透镜，其定位成将沿着光学路径的入射光引导到第一光入射表面上。第一成像器阵列可操作以检测沿着光学路径通过的光的第一部分并且穿过光的第二部分，其中第二成像器阵列可操作以检测第二部分光的至少一部分。

6. 发明申请

WO2010048291A1 BACKSIDE ILLUMINATED IMAGE SENSOR 审中-公开
标题翻译：背面照明图像传感器
公开(公告)号：WO2010048291A1
公开(公告)日：2010-04-29
申请号：PCT/US2009/061488
申请日：2009-10-21
申请人： CROSSTEK CAPITAL, LLC , HYNECEK, Jaroslav , FORBES, Leonard , HADDAD, Homayoon , JOY, Thomas
发明人： HYNECEK, Jaroslav , FORBES, Leonard , HADDAD, Homayoon , JOY, Thomas
IPC分类号： H01L27/146
CPC分类号： H01L27/1464 , H01L21/76898 , H01L23/481 , H01L27/14621 , H01L27/14627 , H01L27/14632 , H01L27/14636 , H01L27/14643 , H01L27/14685 , H01L27/14687 , H01L27/14698 , H01L2924/0002 , H01L2924/00
摘要： A backside illuminated image sensor includes a substrate, a backside passivation layer disposed on backside of the substrate, and a transparent conductive layer disposed on the backside passivation layer.
摘要翻译：背面照明图像传感器包括衬底，设置在衬底背面的背面钝化层和设置在背面钝化层上的透明导电层。

7. 发明申请

WO2012122572A2 THREE DIMENSIONAL SENSORS, SYSTEMS, AND ASSOCIATED METHODS 审中-公开
标题翻译：三维传感器，系统和相关方法
公开(公告)号：WO2012122572A2
公开(公告)日：2012-09-13
申请号：PCT/US2012/028822
申请日：2012-03-12
申请人： SIONYX, INC. , JIANG, Jutao , MCKEE, Jeffrey , HADDAD, Homayoon , HONG, Chris Sungkwon
发明人： JIANG, Jutao , MCKEE, Jeffrey , HADDAD, Homayoon , HONG, Chris Sungkwon
CPC分类号： H01L27/14647 , H01L27/14609 , H01L27/14621 , H01L27/14627 , H01L27/1464
摘要： 3D sensors, systems, and associated methods are provided. In one aspect, for example, a monolithic 3D sensor for detecting infrared and visible light can include a semiconductor substrate having a device surface, at least one visible light photodiode formed at the device surface and at least one 3D photodiode formed at the device surface in proximity to the at least one visible light photodiode. The device can further include a quantum efficiency enhanced infrared light region functionally coupled to the at least one 3D photodiode and positioned to interact with electromagnetic radiation. In one aspect, the quantum efficiency enhanced infrared light region is a textured region located at the device surface.
摘要翻译：提供3D传感器，系统和相关方法。在一个方面，例如，用于检测红外和可见光的单片3D传感器可以包括具有器件表面的半导体衬底，在器件表面处形成的至少一个可见光光电二极管和在器件表面处形成的至少一个3D光电二极管靠近所述至少一个可见光光电二极管。该装置还可以包括功能上耦合到至少一个3D光电二极管并定位成与电磁辐射相互作用的量子效率增强的红外光区域。在一个方面，量子效率增强红外光区域是位于器件表面处的纹理区域。

8. 发明公开

EP2946339A1 BIOMETRIC IMAGING DEVICES AND ASSOCIATED METHODS 审中-公开
标题翻译：生物识别BILDGEBUNGSVORRICHTUNGEN UND ENTSPRECHENDE VERFAHREN
公开(公告)号：EP2946339A1
公开(公告)日：2015-11-25
申请号：EP14740538.5
申请日：2014-01-17
申请人： Sionyx, Inc.
发明人： SAYLOR, Stephen D. , PRALLE, Martin U. , CAREY, James E. , HADDAD, Homayoon
IPC分类号： G06K9/46
CPC分类号： G06K9/00604 , G01S7/4816 , G01S17/89 , G06K9/00255 , G06K9/2036 , G06K9/209 , H01L27/14643 , H01L27/14649 , H04N5/33 , H04N9/045
摘要： Systems, devices, and methods for authenticating an individual or user using biometric features is provided. In one aspect, for example, a system for authenticating a user through identification of at least one biometric feature can include an active light source capable of emitting electromagnetic radiation having a peak emission wavelength at from about 700 nm to about 1200 nm, where the active light source is positioned to emit the electromagnetic radiation to impinge on at least one biometric feature of the user, and an image sensor having infrared light-trapping pixels positioned relative to the active light source to receive and detect the electromagnetic radiation upon reflection from the at least one biometric feature of the user. The system can further include a processing module functionally coupled to the image sensor and operable to generate an electronic representation of the at least one biometric feature of the user from detected electromagnetic radiation, and an authentication module functionally coupled to the processing module that is operable to receive and compare the electronic representation to an authenticated standard of the at least one biometric feature of the user to provide authentication of the user.
摘要翻译：提供了使用生物特征来验证个人或用户的系统，设备和方法。在一个方面，例如，用于通过识别至少一个生物测定特征来认证用户的系统可以包括能够发射具有约700nm至约1200nm的峰值发射波长的电磁辐射的有源光源，其中活性光源被定位成发射电磁辐射以照射到用户的至少一个生物特征，以及具有相对于主动光源定位的红外光俘获像素的图像传感器，用于当从该光源反射时接收和检测电磁辐射用户的至少一个生物特征。该系统还可以包括功能上耦合到图像传感器的处理模块，可操作以从检测到的电磁辐射生成用户的至少一个生物测定特征的电子表示;以及功能上耦合到处理模块的认证模块，接收并比较电子表示与用户的至少一个生物特征的认证标准以提供用户的认证。

9. 发明公开

EP2478560A2 PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS 审中-公开
标题翻译：感光成像器件及相关方法
公开(公告)号：EP2478560A2
公开(公告)日：2012-07-25
申请号：EP10817938.3
申请日：2010-09-17
申请人： Sionyx, Inc.
发明人： HADDAD, Homayoon , JIANG, Jutao , MCKEE, Jeffrey , MILLER, Drake , FORBES, Leonard , PALSULE, Chintamani
IPC分类号： H01L27/146 , H01L27/148
CPC分类号： H01L27/14609 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/1464
摘要： Photosensitive devices and associated methods are provided. In one aspect, for example, a photosensitive imager device can include a semiconductor substrate having multiple doped regions forming at least one junction, a textured region coupled to the semiconductor substrate and positioned to interact with electromagnetic radiation, and an electrical transfer element coupled to the semiconductor substrate and operable to transfer an electrical signal from the at least one junction. In one aspect, the textured region is operable to facilitate generation of an electrical signal from the detection of infrared electromagnetic radiation. In another aspect, interacting with electromagnetic radiation further includes increasing the semiconductor substrate's effective absorption wavelength as compared to a semiconductor substrate lacking a textured region.

10. 发明公开

EP2684221A2 THREE DIMENSIONAL SENSORS, SYSTEMS, AND ASSOCIATED METHODS 审中-公开
标题翻译：三个传感器，系统和相关程序
公开(公告)号：EP2684221A2
公开(公告)日：2014-01-15
申请号：EP12754520.0
申请日：2012-03-12
申请人： Sionyx, Inc.
发明人： JIANG, Jutao , MCKEE, Jeffrey , HADDAD, Homayoon , HONG, Chris Sungkwon
IPC分类号： H01L31/101
CPC分类号： H01L27/14647 , H01L27/14609 , H01L27/14621 , H01L27/14627 , H01L27/1464
摘要： 3D sensors, systems, and associated methods are provided. In one aspect, for example, a monolithic 3D sensor for detecting infrared and visible light can include a semiconductor substrate having a device surface, at least one visible light photodiode formed at the device surface and at least one 3D photodiode formed at the device surface in proximity to the at least one visible light photodiode. The device can further include a quantum efficiency enhanced infrared light region functionally coupled to the at least one 3D photodiode and positioned to interact with electromagnetic radiation. In one aspect, the quantum efficiency enhanced infrared light region is a textured region located at the device surface.

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