会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • A SILICON MICROPHONE WITHOUT DEDICATED BACKPLATE
    • 没有专用背板的硅胶麦克风
    • WO2009105035A1
    • 2009-08-27
    • PCT/SG2009/000049
    • 2009-02-16
    • SILICON MATRIX PTE. LTD.WANG, Zhe
    • WANG, Zhe
    • H04R11/04H04R17/02H04R25/00
    • H04R19/005H01L2224/48091H04R7/04H04R7/20H04R19/04H04R31/00H04R2307/201H04R2307/207H01L2924/00014
    • Various embodiments of a silicon microphone (10) sensing element without dedicated backplate are disclosed. The microphone sensing element has a circular or polygonal diaphragm (13a) with a plurality of perforated springs (13b) suspended above the front side of a conductive substrate (11 ). The diaphragm (13a) is aligned above one or more back holes in the substrate having a front opening smaller than the diaphragm. In one embodiment, a continuous perforated spring surrounds the diaphragm and has a shape that conforms to the diaphragm. A plurality of perforated beams connects the spring to rigid pads that anchor the movable diaphragm and spring. In another embodiment, there is a plurality of perforated springs having double or triple folding configurations and a plurality of perforated beams connecting the diaphragm to rigid pads. Also disclosed is a scheme to integrate the silicon microphone sensing element with CMOS devices on a single chip.
    • 公开了没有专用背板的硅麦克风(10)感测元件的各种实施例。 麦克风感测元件具有圆形或多边形的隔膜(13a),其中多个穿孔弹簧(13b)悬挂在导电基底(11)的正面之上。 隔膜(13a)在基板中的一个或多个后孔上对准,前孔开口小于隔膜。 在一个实施例中,连续的穿孔弹簧围绕隔膜并且具有与隔膜相符的形状。 多个穿孔梁将弹簧连接到固定可移动隔膜和弹簧的刚性垫。 在另一个实施例中,存在多个具有双重或三重折叠构造的穿孔弹簧以及将隔膜连接到刚性垫的多个穿孔梁。 还公开了将硅麦克风感测元件与CMOS器件集成在单个芯片上的方案。
    • 3. 发明申请
    • SILICON MICROPHONE WITH ENHANCED IMPACT PROOF STRUCTURE USING BONDING WIRES
    • 硅胶麦克风使用连接线增强防撞结构
    • WO2009045170A1
    • 2009-04-09
    • PCT/SG2008/000369
    • 2008-09-29
    • SILICON MATRIX PTE. LTD.WANG, ZheCHONG, Ser, Choong
    • WANG, ZheCHONG, Ser, Choong
    • H04R17/02H04R19/00
    • H04R19/04
    • A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm (11) is surrounded by a circular spring (12) having a plurality of slots and perforations to facilitate air damping reduction, release of in- plane stress, and improve out-plane flexibility. Anchored at a substrate (8), the circular spring (12) holds the silicon microphone suspended over a backside hole in the substrate (8) but allows the diaphragm (11 ) to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of "n" bonding pads (16a, 16b) near the outer edge of the circular spring (12) are connected by "n/2" bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact.
    • 公开了一种无刷硅传声器和用于提高耐冲击性的线保护方法。 圆形隔膜(11)由具有多个槽和穿孔的圆形弹簧(12)围绕,以便于减少空气阻尼,释放面内应力,并提高平面外的柔性。 固定在基板(8)上的圆形弹簧(12)将硅麦克风保持在基板(8)的背面孔上,但允许隔膜(11)垂直于基板振动。 在多孔弹簧和基板之间形成麦克风可变电容器。 槽口尺寸被最小化以防止颗粒进入下面的气隙。 在圆形弹簧(12)的外边缘附近的多个“n”个接合焊盘(16a,16b)通过用作限制器的“n / 2”接合线连接,以限制隔膜的向上运动。 接合线可以彼此交叉以实现较低的回路高度,以更有效地抵抗冲击。
    • 4. 发明申请
    • A BACKPLATELESS SILICON MICROPHONE
    • 无背硅胶麦克风
    • WO2006046927A2
    • 2006-05-04
    • PCT/SG2004/000385
    • 2004-11-29
    • ALTUS TECHNOLOGIES PTE. LTD.WANG, ZheMIAO, Yubo
    • WANG, ZheMIAO, Yubo
    • H04R19/04
    • H04R31/003H04R19/005H04R19/04H04R25/00
    • A silicon based microphone sensing element and a method for making the same are disclosed. The microphone sensing element has a diaphragm with a perforated plate adjoining each side or corner. The diaphragm is aligned above one or more back holes created in a conductive substrate wherein the back hole has a width less than that of the diaphragm. Perforated plates are suspended above an air gap that overlies the substrate. The diaphragm is supported by mechanical springs with two ends that are attached to the diaphragm at a corner, side, or center and terminate in a rigid pad anchored on a dielectric spacer layer. A first electrode is formed on one or more rigid pads and a second electrode is formed at one or more locations on the substrate to establish a variable capacitor circuit. The microphone sensing element can be embodied in different approaches to reduce parasitic capacitance.
    • 公开了一种基于硅的麦克风传感元件及其制造方法。 麦克风感测元件具有隔膜,其上具有邻接每个侧面或拐角的多孔板。 隔膜在导电基板中形成的一个或多个后孔上方对准,其中后孔的宽度小于隔膜的宽度。 穿孔板悬挂在衬底上方的气隙上方。 隔膜由机械弹簧支撑,其两端在角部,侧面或中心附接到隔膜,并终止于固定在介电隔离层上的刚性垫中。 第一电极形成在一个或多个刚性焊盘上,并且第二电极形成在衬底上的一个或多个位置处以建立可变电容器电路。 麦克风感测元件可以以不同的方式实现以减少寄生电容。
    • 7. 发明申请
    • CMOS COMPATIBLE SILICON DIFFERENTIAL CONDENSER MICROPHONE AND METHOD FOR MANUFACTURING THE SAME
    • CMOS兼容硅差分冷凝器麦克风及其制造方法
    • WO2012122696A1
    • 2012-09-20
    • PCT/CN2011/071741
    • 2011-03-11
    • GOERTEK INC.WANG, Zhe
    • WANG, Zhe
    • H04R19/04H04R19/00
    • B81B3/0078B81B2207/015B81C1/00246H04R19/005H04R19/04
    • A CMOS compatible silicon differential condenser microphone and a method for manufacturing the same are provided. The microphone(1000) comprises a silicon substrate(100), wherein a CMOS circuitry is accommodated thereon; a first rigid conductive perforated backplate(200) supported on the silicon substrate with an insulating layer(120) inserted therebetween; a second rigid perforated backplate(400) formed above the first backplate, including CMOS passivation layers(400a, 400c) and a metal layer(400b) sandwiched between the CMOS passivation layers as an electrode plate of the second plate, wherein an air gap, with a spacer forming its boundary, is provided between the opposite perforated areas of the first backplate and the second backplate; a compliant diaphragm(300) provided between the first backplate and the second backplate, wherein a back hole(150) is formed to be open in the silicon substrate underneath the first backplate so as to allow sound pass through, and the diaphragm and the first backplate form a first variable condenser, the diaphragm and the second backplate form a second variable condenser, and the first variable condenser and the second variable condenser form differential condensers.
    • 提供CMOS兼容的硅差分电容话筒及其制造方法。 麦克风(1000)包括硅衬底(100),其中容纳CMOS电路; 支撑在硅衬底上的绝缘层(120)插入其间的第一刚性导电多孔背板(200); 形成在第一背板上方的第二刚性多孔背板(400),包括CMOS钝化层(400a,400c)和夹在作为第二板的电极板的CMOS钝化层之间的金属层(400b),其中气隙, 具有形成其边界的间隔件设置在第一背板和第二背板的相对的穿孔区域之间; 设置在所述第一背板和所述第二背板之间的柔性隔膜(300),其中形成在所述第一背板下方的所述硅基板中开口的后孔(150),以允许声音通过,并且所述隔膜和所述第一 背板形成第一可变冷凝器,隔膜和第二背板形成第二可变冷凝器,第一可变冷凝器和第二可变冷凝器形成差动冷凝器。
    • 8. 发明申请
    • METHOD AND APPARATUS FOR VOICE ACTIVITY DETECTION
    • 用于语音活动检测的方法和装置
    • WO2012083552A1
    • 2012-06-28
    • PCT/CN2010/080217
    • 2010-12-24
    • HUAWEI TECHNOLOGIES CO., LTD.TALEB, AnisseWANG, ZheMIAO, LeiXU, Jianfeng
    • TALEB, AnisseWANG, ZheMIAO, LeiXU, Jianfeng
    • G10L11/02G10L21/02G10L19/00
    • G10L25/78G10L2025/786
    • A method and apparatus for voice activity detection are provided. The apparatus for voice activity detection (1) comprises: a signal condition analyzing unit (3) which analyses at least one signal parameter of an input signal (2) to detect a signal condition (SC) of the input signal; at least two voice activity detection units (4-i) comprising different voice detection characteristics, wherein each voice activity detection unit (4-i) performs separately the voice activity detection of the input signal to provide a voice activity detection decision (VADD); and a decision combination unit (5) which combines the voice activity detection decisions (VADDs) provided by the voice activity detection units (4-i) depending on the detected signal condition (SC) to provide a combined voice activity detection decision (cVADD).
    • 提供了用于语音活动检测的方法和装置。 用于语音活动检测的装置(1)包括:信号条件分析单元(3),其分析输入信号(2)的至少一个信号参数以检测输入信号的信号条件(SC); 至少两个语音活动检测单元(4-i),其包括不同的语音检测特性,其中每个语音活动检测单元(4-i)分别执行输入信号的语音活动检测以提供语音活动检测决定(VADD); 以及判定组合单元(5),其根据检测到的信号条件(SC)组合由语音活动检测单元(4-i)提供的语音活动检测决策(VADD),以提供组合语音活动检测决策(cVADD) 。