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1. 发明申请

WO1997012341A1 CHIP MODULE 审中-公开
标题翻译：芯片模块
公开(公告)号：WO1997012341A1
公开(公告)日：1997-04-03
申请号：PCT/DE1996001725
申请日：1996-09-12
申请人： SIEMENS AKTIENGESELLSCHAFT , HOUDEAU, Detlef , KIRSCHBAUER, Josef , MENSCH, Hans-Georg , STAMPKA, Peter , STECKHAN, Hans-Hinnerk
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： G06K19/077
CPC分类号： G06K19/07728 , G06K19/07743 , G06K19/07745 , H01L23/24 , H01L23/49855 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2924/3512
摘要： The object of the invention is to prevent delamination between the covering compound and the chip in the hot-melt assembly process. According to the invention, this object is achieved in that the heat flow introduced from the exterior into the chip module is controlled in a deliberate manner, either by a heat-insulating layer (9) interposed between the flexible carrier strip (2) of the chip module and the chip (3) bonded thereon, or by recesses (11) in the surface or layer of the metal contacts (10) such that heat is prevented from flowing from a hollow stamp (1) placed in the outer region of the metal contacts (10) in the direction of the centrally-mounted chip (3).
摘要翻译：为了防止覆盖化合物和热熔安装方法的芯片之间的分层被提出了控制注入到从目标外部热流芯片模块。这是根据或者通过热绝缘层（9）介于所述柔性载体带之间的本发明（2）实现的芯片模块和的粘附在其上的芯片（3）被插入，或通过金属触点的区域或层（10）内的凹部（11），使得从热流中的金属触点的外侧区域中的一个接合（10）中空柱塞防止了在居中地安装芯片（3）的方向（1）。

2. 发明申请

WO1996034409A1 CHIP COVER 审中-公开
公开(公告)号：WO1996034409A1
公开(公告)日：1996-10-31
申请号：PCT/DE1996000616
申请日：1996-04-09
申请人： SIEMENS AKTIENGESELLSCHAFT , HOUDEAU, Detlef , KIRSCHBAUER, Josef , NIEDERLE, Christl , STAMPKA, Peter , STECKHAN, Hans-Hinnerk
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： H01L23/28
CPC分类号： H01L23/573 , G06K19/073 , G06K19/07372 , G06K19/07745 , H01L24/48 , H01L25/18 , H01L27/02 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/00014 , H01L2924/01068 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The description relates to a chip cover (5, 6, 11) to cover electrical, electronic, opto-electronic and/or electromechanical components of a chip (1, 8) completely or partly. In the chip cover (5, 6, 11), there is an activator (12) which, when activated, is capable of completely or partly destroying the electrical, electronic, opto-electronic and/or electromechanical components of the chip (1, 8) and can be activated by an attempt to remove the cover (5, 6, 11) from the chip (1, 8). It is thus possible reliably to prevent the unauthorised analysis and/or manipulation of the chip (1, 8).
摘要翻译：它是用于电气，电子，光电和/或机电部件的芯片的的完全或部分覆盖所述的芯片盖（5，6，11）（1,8）。该芯片盖（5，6，11），其特征在于活化剂（12）被提供，这是在激活状态中的位置，即芯片（1的电，电子，光电和/或机电部件，摧毁8）全部或部分，并除去由实验中，芯片盖（5，6，11）（从芯片1，8）可被激活。通过这种方式，可以防止外来的分析和/或芯片（1.8）可靠的操作。

3. 发明申请

WO1998032098A1 CHIP CARD MODULE 审中-公开
标题翻译：智能卡模块
公开(公告)号：WO1998032098A1
公开(公告)日：1998-07-23
申请号：PCT/DE1997002701
申请日：1997-11-18
申请人： SIEMENS AKTIENGESELLSCHAFT , HOUDEAU, Detlef , EMMERT, Stefan , MENSCH, Hans-Georg
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： G06K19/077
CPC分类号： G06K19/07747 , G06K19/072 , G06K19/07745 , H01L23/5388 , H01L25/0657 , H01L2224/16145 , H01L2225/06513 , H01L2225/06517 , H01L2225/06575 , H01L2225/06582 , H01L2924/01004 , H01L2924/01068
摘要： Disclosed is a chip card module comprising, apart from the printed conductors (4) and a card frame (2), one or more semi-conductor chips (3, 3') and possibly a rigidizing frame (5). The semi-conductor chip(s) and/or the rigidizing frame are fixed using a glue (6) to which particles of a set diameter are added to be used as a spacer. The glue (6) is preferably elastic and, in the preferred embodiment, the particle material is deformable. The advantage of the present invention is that the chip(s) and/or the rigidizing frame are glued with a given regular spacing in relation to the base. The elastic glue and the deformable particles adapt the deformations of the chip card module, thereby preventing the surfaces glued together from being damaged.
摘要翻译：本发明涉及一种智能卡模块，其中除了导体轨道（4）和一个芯片载体（2）包括一个或多个半导体芯片（3,3“）和任选的加强框架（5）。半导体芯片（一个或多个）和/或加强框架通过粘合剂（6）固定，所述颗粒（7）中加入规定尺寸间隔物。粘合剂（6）是vorgzugsweise弹性粘结剂，（7）优选地由可变形材料制成的颗粒。本发明使半导体芯片（一个或多个）和/或在从所述表面限定的和均匀的距离附着加强框架。弹性粘合剂和可变形颗粒适应智能卡模块的变形，因此防止对被粘物表面的损坏。

4. 发明申请

WO1998028709A1 NON-CONDUCTIVE SUBSTRATE FORMING A BAND OR PANEL, ON WHICH ARE FORMED A PLURALITY OF SUPPORT ELEMENTS 审中-公开
标题翻译：不导通，带或使用衬底上形成，对支撑元件中的各种经过培训
公开(公告)号：WO1998028709A1
公开(公告)日：1998-07-02
申请号：PCT/DE1997002964
申请日：1997-12-18
申请人： SIEMENS AKTIENGESELLSCHAFT , STAMPKA, Peter , HUBER, Michael , SCHRAUD, Gerhard , STRIEGEL, Peter , MENSCH, Hans-Georg
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： G06K19/077
CPC分类号： G06K19/07747 , G06K19/07743 , G06K19/07749 , G06K19/07769 , H05K1/0266 , H05K1/11 , H05K3/0097
摘要： The invention relates to a non-conductive substrate (2) forming a band or panel on which are embodied a plurality of support elements, notably for incorporation into a chip card. One side of the substrate (2) has conductive contact surfaces (6) which lie within an outer contour line (4) that determines the size of one support element. The other side of the substrate (2) has conductive structures (9, 10, 11, 14, 15) which, within the outer contour line (4), form at least contact areas (11) for at least one coil to be contacted and at least one semi-conductor chip. Outside each outer contour line (4) the invention provides for recesses (13) in the substrate (2), through which the connections to the coil of the semi-conductor chip can be accessed for test purposes from the side of the contact surface as long as the support element remains in the band or panel.
摘要翻译：非导电性，磁带，或形成利益衬底（2）在其上的多个载波要素的，特别是用于安装在一个芯片卡中，通过在基板的一侧上形成（2）设置有导电触点表面（6），一个载体元件外轮廓线（4），其中，所述衬底（2）的另一侧上设置有导体结构的尺寸内的确定（9，10，11，14，15）位于该外轮廓线（4）内，至少接触区（11 ），用于形成至少一个被接触的线圈和至少一个半导体芯片和各外轮廓线之外，所述（4）具有在基板（2）的凹部（13），用于测试目的，从接触面侧的半导体芯片的线圈端子的访问是可能的，通过它，只要是在乐队或效益仍支撑构件。

5. 发明申请

WO1998003937A1 METHOD AND DEVICE FOR PRODUCING AN ELECTRONIC COMPONENT, IN PARTICULAR FOR PRODUCING AN INDUCTION COIL FOR CHIP CARDS 审中-公开
标题翻译： DEVICE AND METHOD FOR生产电子部件，尤其是用于制造感应线圈智能卡
公开(公告)号：WO1998003937A1
公开(公告)日：1998-01-29
申请号：PCT/DE1997001475
申请日：1997-07-11
申请人： SIEMENS AKTIENGESELLSCHAFT , HOUDEAU, Detlef , KIRSCHBAUER, Josef
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： G06K19/077
CPC分类号： G06K19/07779 , G06K19/07749 , G06K19/07783 , H01F41/041 , H01F41/061 , H05K3/061 , H05K3/064 , H05K3/1216 , H05K3/28 , H05K2203/1545
摘要： In the prior art, induction coils which can be integrated in chip cards are produced on the basis of a laminate system coated with a photosensitive resist, namely using a subtractive photolithographic etching method. The throughput rates attained with these prior art methods are low. The invention proposes a method that comprises the following steps 1 to 3: 1. providing a flexible laminate system which comprises insulating material and, on at least one surface, conductor material; 2. printing the conductor material surface with etching resist, namely using a silk-screen printing technique; and 3. etching the printed laminate system. The method steps are carried out in an at least partially continuous process. The invention also concerns a device for carrying out the method according to the invention, and a laminate system which can be used in particular with the method and device according to the invention.
摘要翻译：在现有技术中，已知的是产生，从涂布的光致抗蚀剂层叠体系统中的芯片卡开始积的电感器，带有一个减色光刻蚀刻方法来进行。与已知的现有技术的方法低通量率是可以实现的。本发明提供了一种方法，包括下列步骤1）至3）：1）提供一种柔性层压的系统，所述绝缘材料和在其至少一个表面上的导电材料，2）用蚀刻布线材料的所述表面的印刷抗蚀剂，下的应用丝网印刷技术，3）蚀刻中，该方法步骤是在至少部分连续的过程进行的印刷层压系统。本发明还涉及一种用于执行该方法的装置，和层压erfindugsgemässen系统，其在本发明的设备和本发明的方法特别有用。

6. 发明申请

WO1996030867A1 CARD-LIKE DATA SUBSTRATE AND LEAD FRAME FOR USE THEREIN 审中-公开
标题翻译：卡片形数据载体中，引线框架用在这种MEDIA
公开(公告)号：WO1996030867A1
公开(公告)日：1996-10-03
申请号：PCT/DE1996000464
申请日：1996-03-15
申请人： SIEMENS AKTIENGESELLSCHAFT , HOUDEAU, Detlef , KIRSCHBAUER, Josef , FILSER, Christoph
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： G06K19/077
CPC分类号： H01L23/5388 , G06K19/07743 , H01L2924/0002 , Y10T29/49119 , H01L2924/00
摘要： The "smart card" or "memory card" are known as card-like data substrates. In its chip card form, the smart card has a chip module with corresponding slip contacts. For other cards with greater storage capacities use is made of galvanic contacts generally arranged in a row outwards on a long edge. To improve the stability of the plastic body and the contacts and to simplify the production of such a data substrate, it is proposed to use a lead frame needed for mechanical maintenance and electrical contact which is formed integrally or in one piece with the galvanic contacts or components. Use is advantageously made of special spring materials meeting both the requirements for sprung contacts, familiar in precision engineering and those for the use of a semiconductor component for mechanical and electrical connection.
摘要翻译：为卡片形数据载体是已知的，例如，智能卡或存储卡。在芯片卡的执行的智能卡具有与对应滑动触点的芯片模块。对于具有用于接触到外部通常所用的纵向边缘高的存储容量串成电接触的其它卡。为了提高塑料体和触点的稳定性并简化这种数据载体的制造过程中，提出使用机械的支持和电接触必要的引线框架，其与所述电接触件或其部分形成的。有利的是，特殊的弹簧材料被指定，既满足弹性触头，诸如从精密工程，以及用于使用用于半导体器件的机械和电气连接的要求是已知的要求。

7. 发明申请

WO1998014904A1 CONTACTLESS CHIP CARD 审中-公开
标题翻译：接触式智能卡
公开(公告)号：WO1998014904A1
公开(公告)日：1998-04-09
申请号：PCT/DE1997002120
申请日：1997-09-18
申请人： SIEMENS AKTIENGESELLSCHAFT , HOUDEAU, Detlef , FRIES, Manfred , FISCHBACH, Reinhard , KIRSCHBAUER, Josef
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： G06K19/077
CPC分类号： G06K19/0775 , G06K19/07749
摘要： This invention concerns a contactless chip card containing besides a chip module (2) an induction coil (3) for data transmission. A lead frame (1) serves as the electrical connection for these two components. In contrast to solutions in prior art, the contact between the lead frame (1) and induction coil (3) is much simpler. In the area of the coil pads (7), apertures (5) are made through the coil pads (7) and substrate film (8) through which the lead frame contacts (4) pass and are soldered on the upper surface.
摘要翻译：一种非接触芯片卡包含一个芯片模块（2）用于数据传输的感应线圈（3）。引线框（1）用于为这两个部件的电连接。所述引线框架（1）和所述感应线圈（3）之间的接触是在与现有技术的简化显著的解决方案。在线圈片的范围内（7）（5）至（8），通过该引线框接触件（4）被从相对侧通过，被焊接到上侧线圈垫（7）和载体膜插入的开口。

8. 发明申请

WO1997015894A2 CARRIER ELEMENT FOR USE IN A CHIP CARD 审中-公开
标题翻译：支撑元件安装在智能卡
公开(公告)号：WO1997015894A2
公开(公告)日：1997-05-01
申请号：PCT/DE1996001946
申请日：1996-10-11
申请人： SIEMENS AKTIENGESELLSCHAFT , FRIES, Manfred , KIRSCHBAUER, Josef , HOUDEAU, Detlef
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： G06K00/00
CPC分类号： G06K19/07747 , G06K19/07749 , G06K19/07779
摘要： A carrier element for use in a chip card has a carrier foil (1) on which are arranged a coil (2) and a semiconductor chip connected thereto. The carrier foil (1) has recesses (5, 6) in and outside the area of the coil (2).
摘要翻译：用于结合在芯片卡与载体膜支承元件（1）在其上的线圈（2）和连接到该半导体芯片被布置，其中，所述载体膜（1），具有线圈的内部和外部（2）区域的凹部（5 ，6）。

9. 发明申请

WO1997044823A1 SUBSTRATE FOR A SEMICONDUCTOR CHIP 审中-公开
标题翻译：支撑元件用于半导体芯片
公开(公告)号：WO1997044823A1
公开(公告)日：1997-11-27
申请号：PCT/DE1997000977
申请日：1997-05-14
申请人： SIEMENS AKTIENGESELLSCHAFT , HOUDEAU, Detlef , HUBER, Michael , ROHDE, Volker , SCHEUENPFLUG, Richard , STAMPKA, Peter
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： H01L23/498
CPC分类号： G06K19/07747 , G06K19/07743 , H01L23/49855 , H01L2924/0002 , H05K3/3426 , Y02P70/613 , H01L2924/00
摘要： This invention concerns a substrate element for a semiconductor chip for incorporation into chip cards as well as for soldering onto boards using SMD technology. For this purpose, the copper cladding of a plastic film (1) is so structured using etching, that contact surfaces (3) are formed in one piece with conductor paths (4) which end at the border of the substrate element and which make reliable soldering possible.
摘要翻译：用于半导体芯片的载体元件是两个用于安装在智能卡以及用于与SMD工艺板焊接中使用。为此，塑料薄膜（1）的铜层压通过蚀刻结构化的，即接触面（3），在所述载体元件导体轨道（4），其能够安全焊接的边缘结束积分，而形成。

10. 发明申请

WO1996034411A1 CHIP COVER 审中-公开
公开(公告)号：WO1996034411A1
公开(公告)日：1996-10-31
申请号：PCT/DE1996000719
申请日：1996-04-24
申请人： SIEMENS AKTIENGESELLSCHAFT , ATZESDORFER, Alexandra , BAYER, Heiner , HOUDEAU, Detlef , STAMPKA, Peter
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： H01L23/28
CPC分类号： G06Q20/341 , G06K19/073 , G06K19/07372 , G06K19/07743 , G07F7/082 , G07F7/1008 , H01L23/293 , H01L23/3135 , H01L23/49855 , H01L23/573 , H01L24/48 , H01L25/18 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/00014 , H01L2924/0102 , H01L2924/01068 , H01L2924/01079 , H01L2924/1433 , H01L2924/181 , H01L2224/45099 , H01L2924/00012
摘要： The description relates to a chip cover (6) to cover completely or partially electrical, electronic, opto-electronic and/or electromechanical components of a chip (1, 8). The chip cover (6) is characterized in that is has a polyimide coating with limited transparency. It is thus possible reliably to prevent unauthorised examinations and/or manipulations of the chip.
摘要翻译：公开了一种用于电气，电子，光电和/或机电部件的芯片的完全或部分覆盖的芯片盖（6）（1，8）。该芯片盖（6）的特征在于，所述盖具有降低透明性的聚酰亚胺层。以这种方式，有可能外国分析和/或芯片的操作（1，8），以防止可靠。

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