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1. 发明授权

US3913201A Bonded material for electrical contact pieces 失效
标题翻译：电接触片用接合材料
公开(公告)号：US3913201A
公开(公告)日：1975-10-21
申请号：US36584273
申请日：1973-06-01
申请人： SIEMENS AG
发明人： SCHREINER HORST , SCHERBAUM RUDOLF
IPC分类号： C22C32/00 , H01H1/0237 , B22F1/00 , H01B1/02
CPC分类号： C22C32/0021 , H01H1/0237 , Y10T428/12014
摘要： Bonded or compound material for electrical contact pieces, consisting of silver as an original metal with up to 20% by weight of at least one finely divided metal oxide, such as CdO, SnO2, ZnO, MgO and/or NiO, and up to 15% by weight of finely divided lead.
摘要翻译：电接触片的粘合或复合材料，由银作为原始金属组成，最多含有20重量％的至少一种细碎金属氧化物，如CdO，SnO2，ZnO，MgO和/或NiO，以及最多15 重量％的细分铅。

2. 发明授权

US3488183A Method for internal oxidation of metal powder from an alloy,a metal-powder mixture of various alloys or a partially alloyed metal-powder mixture 失效
标题翻译：用于从合金内部氧化金属粉末的方法，各种合金或部分合金金属粉末混合物的金属粉末混合物
公开(公告)号：US3488183A
公开(公告)日：1970-01-06
申请号：US3488183D
申请日：1967-08-08
申请人： SIEMENS AG
发明人： SCHREINER HORST , OHMANN HELMUT
IPC分类号： B01J37/12 , C01B13/32 , C22C1/10 , B22F1/00 , B22F3/16
CPC分类号： B01J37/12 , C01B13/322 , C22C1/1078

3. 发明授权

US3524493A Method of making stator core by casting gray iron around lamination stack 失效
标题翻译：通过铸造灰色铁圈在层压板上制作定子芯的方法
公开(公告)号：US3524493A
公开(公告)日：1970-08-18
申请号：US3524493D
申请日：1968-12-12
申请人： SIEMENS AG
发明人： DOLL JUSTIN , FIDOS HENRYK , FORKEL DIRK , SCHREINER HORST
IPC分类号： B22D19/00 , H02K15/00
CPC分类号： B22D19/0054 , Y10T29/49009

4. 发明授权

US3489530A Penetration-bonded metal composition for power-breaker contacts 失效
标题翻译：用于断电器触点的渗透粘合金属组合物
公开(公告)号：US3489530A
公开(公告)日：1970-01-13
申请号：US3489530D
申请日：1968-07-16
申请人： SIEMENS AG
发明人： SCHREINER HORST
IPC分类号： C22C1/04 , H01H1/025 , B22F1/00 , B22F5/00
CPC分类号： H01H1/025 , C22C1/0475 , Y10S428/929 , Y10S428/939 , Y10T428/12174 , Y10T428/12986

5. 发明授权

US3863337A Powder metallurgy method for making an electric contact and the resulting contact 失效
标题翻译：用于制造电触点和结果接触的粉末冶金方法
公开(公告)号：US3863337A
公开(公告)日：1975-02-04
申请号：US28340872
申请日：1972-08-24
申请人： SIEMENS AG
发明人： SCHREINER HORST , ROTHKEGEL BERNARD
IPC分类号： B22F7/00 , B22F5/00 , H01H1/0233 , H01H1/04 , H01R9/00
CPC分类号： H01H1/0233 , Y10T29/49206 , Y10T29/49215
摘要： A layer of refractory metal or metal compound powder and a layer of low temperature melting metal or metal alloy powder are arranged together in the cavity of a compacting die and consolidated together to form an integrated two-layer compact which is thereafter heated above said low temperature but below the refractory powder''s sintering temperature to cause the pores of the compact''s refractory portion to be impregnated with the low temperature melting component while leaving an excess thereof forming a thin layer on the refractory portion. Because the two layers of the compact are consolidated together so that the compact may be moved safely without the layers separating during the heating, the use of a continuous furnace for the heating is commercially practical, and because the refractory portion is not sintered, the finished product''s dimensions can be accurately predetermined by the compacting die cavity dimensions. By heating the compact with its low temperature melting end down and resting as a refractory carrier surface having a plurality of depressions beneath this end, said layer is formed with a smooth exposed surface suitable for soldering or welding to a supporting metal part. Thus, a finished electric contact, for example, may be produced by the two steps of compacting and heating only, having a thick contact layer resistant to arc burning and contact welding trouble and a thin support layer that is solderable or weldable to a metal support or operating element.
摘要翻译：将难熔金属或金属化合物粉末层和低温熔融金属或金属合金粉末层一起布置在压实模具的空腔中并固结在一起以形成一体的双层压实体，然后将其加热到所述低温但低于耐火材料粉末的烧结温度，导致压坯的耐火部分的孔被低温熔融成分浸渍，同时留下其过剩，在耐火部分上形成薄层。由于两层压坯被固结在一起，使得压块可以安全地移动，而在加热期间没有层分离，所以使用用于加热的连续炉是商业上可行的，并且由于耐火部分不被烧结，所以成品产品的尺寸可以通过压实模腔尺寸精确预定。通过将其低温熔融端部加热，并将其作为具有在该端部下方的多个凹部的耐火载体表面而保持，所述层形成有适于焊接或焊接到支撑金属部件的光滑的暴露表面。因此，例如可以通过仅压制和加热的两个步骤来制造完成的电接触，具有耐电弧燃烧和接触焊接故障的厚接触层和可焊接或可焊接到金属支撑件的薄的支撑层或操作元件。

6. 发明授权

US3598896A Encapsulated semiconductor device with parts formed of sinter metal and plastic 失效
标题翻译：具有铸造金属和塑料的部件的封装半导体器件
公开(公告)号：US3598896A
公开(公告)日：1971-08-10
申请号：US3598896D
申请日：1969-09-22
申请人： SIEMENS AG
发明人： HASSLER HEINRICH , SCHREINER HORST
IPC分类号： H01L23/051 , H01L23/16 , H01L23/31 , B29C6/02 , H01L9/04
CPC分类号： H01L23/3107 , H01L23/051 , H01L23/16 , H01L2924/0002 , Y10T29/49172 , H01L2924/00
摘要： In an encapsulated semiconductor device having a semiconductor body and means for contacting and encapsulating the body, these means comprise a structure of porous sinter metal and of synthetic plastic forming an impregnation in the pores of the sinter metal. An insulating structure of filler-containing plastic is pressure molded onto the sinter metal structure and merges with the impregnation in the pores. Preferably the structure made of filler-containing plastic forms part of the encapsulation.

7. 发明授权

US3489531A Multilayer sintered contact body 失效
标题翻译：多层烧结接触体
公开(公告)号：US3489531A
公开(公告)日：1970-01-13
申请号：US3489531D
申请日：1967-09-19
申请人： SIEMENS AG
发明人： SCHREINER HORST , SCHERBAUM RUDOLF
IPC分类号： H01H1/023 , H01H1/025 , H01H1/027 , B22F7/00 , B22F7/02
CPC分类号： H01H1/027 , H01H1/0231 , Y10S428/926 , Y10T428/12146 , Y10T428/12361 , Y10T428/12986

8. 发明授权

US3864827A Method for making an electric contact by powder metallurgy and the resulting contact 失效
公开(公告)号：US3864827A
公开(公告)日：1975-02-11
申请号：US28340972
申请日：1972-08-24
申请人： SIEMENS AG
发明人： SCHREINER HORST , ROTHKEGEL BERNHARD
IPC分类号： B22F7/00 , H01H1/0233 , H01H1/04 , H01R9/00
CPC分类号： H01H1/0233 , Y10T29/49206 , Y10T29/49215
摘要： A layer of refractory metal or metal compound powder which is mixed with a low melting temperature metal or metal alloy powder, and a layer of low temperature melting metal or metal alloy powder, are arranged together in the cavity of a compacting die and consolidated together to form an integrated two-layer compact which is thereafter heated above said low temperature but below the refractory powder''s sintering temperature to cause the pores of the compact''s refractory portion to be impregnated with the low temperature melting component while leaving an excess thereof forming a thin layer in the refractory portion. Because the two layers of the compact are consolidated together so that the compact may be moved safely without the layers separating during the heating, the use of a continuous furnace for the heating is commercially practical; and because the refractory portion is not sintered, the finished product''s dimensions can be accurately predetermined by the compacting die cavity dimensions. By heating the compact with its low temperature melting end down and resting on a refractory carrier surface having a plurality of depressions beneath this end, said layer is formed with a smooth exposed surface suitable for soldering or welding to a supporting metal part. Thus, a finished electric contact, for example, may be produced by the two steps of compacting and heating only, having a thick contact layer resistant to arc burning and contact welding trouble and a thin support layer that is solderable or weldable to a metal support or operating element. If the low temperature melting metal powder mixed with refractory powder in the refractory portion of the compact, and the low temperature melting powder in the other portion of the compact, are different metals, the heating of the compact can cause alloying or intersolution of the different metals so that in the final product the low temperature melting component of the product has the same composition throughout.

9. 发明授权

US3642523A Method and device for producing tin layers of {22 3{82 {0 on copper and copper alloy wire by hot tin plating 失效
标题翻译：用于生产{22 3 {82 {0]铜箔和铜合金线的热镀锌层的层的方法和装置
公开(公告)号：US3642523A
公开(公告)日：1972-02-15
申请号：US3642523D
申请日：1968-04-25
申请人： SIEMENS AG
发明人： SCHREINER HORST , FIDOS HENRYK
IPC分类号： C23C2/08 , C23C2/38 , B44D1/42 , C23C1/04
CPC分类号： C23C2/38 , C23C2/08
摘要： The invention has an object the production of good solderability wires of copper and copper alloys, through a uniformly thick coating of pure tin or a tin alloy with Pb and/or Sb, Bi, Zn and Cd. This object is achieved by passing perpendicularly (or at a small angle to the vertical) copper or a copper alloy wire through a heated zone after passing a tin bath. This heated zone is within a heated gas chamber which is traversed by the wire with the wire at such a distance from the chamber wall that the oscillating wire is not contacted by the wall. In accordance with the present invention, a wire with 0.2 to 1 mm. and preferably 0.5 mm. diameter is led, after passing the tin bath, through a heating zone of a round or a square cross section, with a length of 30 to 100 cm. and a temperature of 200* to 430* C. Adhesion forces as well as surface tension forces are active in the development of a uniformly thick tin coating. The present invention also relates to a device used to perform the above method.
摘要翻译：本发明的目的是通过均匀地涂覆纯锡或具有Pb和/或Sb，Bi，Zn和Cd的锡合金的铜和铜合金的良好可焊性丝的生产。该目的通过在通过锡浴之后垂直（或垂直）或铜合金丝线穿过加热区域进行实现。该加热区域位于被加热的气体室内，该加热气体室中的金属丝线与腔室壁隔开距离，使振荡丝不被壁接触。根据本发明，具有0.2至1mm的导线。优选为0.5mm。在通过锡槽之后，直径通过圆形或正方形横截面的加热区域，长度为30至100cm。温度为200〜430℃。粘合力以及表面张力对均匀厚的锡涂层的开发是有效的。本发明还涉及用于执行上述方法的装置。

10. 发明授权

US3610859A Composite contact structure for vacuum-type circuit interrupters 失效
标题翻译：用于真空型电路中断器的复合接触结构
公开(公告)号：US3610859A
公开(公告)日：1971-10-05
申请号：US3610859D
申请日：1968-07-29
申请人： SIEMENS AG
发明人： SCHREINER HORST , OHMANN HELMUT
IPC分类号： C22C1/04 , H01H1/02 , H01H33/664
CPC分类号： H01H33/664 , B22F3/11 , B22F3/26 , C22C1/0475 , H01H1/0203 , H01H2001/0208
摘要： A composite contact for a vacuum-type circuit interrupter is formed from a porous sintered refractory structure, such as tungsten or molybdenum, infiltrated with an impregnating metal having a liquid phase below 400* C. To assure a wetting action between the porous refractory sintered structure and the infiltrant stock, preferably an auxiliary agent, or an additive, of small quantity is utilized, such as silver, cobalt, copper, iron, nickel, titanium and zirconium in small quantities, for example, a few tenths of one percent. In use in a vacuum-type circuit interrupter such a composite contact results in a vaporization of the low-melting-point infiltrant. For certain constructions, a reservoir may be provided interiorly of the composite contact to provide an additional quantity of the low-melting-point infiltrant.

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