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    • 5. 发明专利
    • DE50209805D1
    • 2007-05-03
    • DE50209805
    • 2002-12-18
    • SIEMENS AG
    • JEUTTER ANDRESTAMM WERNER
    • B05D1/32B05D3/06C23C4/01C23C30/00C25D5/02
    • Method of coating substrate having at least one opening hole involves covering the hole with a plug of wax, electrochemically depositing at least one coating layer and treating the outer surface of the coating either with an electron beam or laser, to improve the adhesion and homogenize the particles in the upper zone of the coating. To coat a substrate (1), which has at least one opening hole (4), the hole(s) is (are) initially covered by a plug (16) of wax, etc. At least one coating layer (13) is applied electrochemically at a low temperature of at most 250 degreesC and preferably at most 100 degreesC. The outer surface (15) of the coating is treated with an electron beam or a laser and the like, to improve the adhesion and homogenize the particles in the upper zone of the coating, by melting the zone immediately under the upper surface. The coating layer is of a ceramic thermal insulation layer or a metal.